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1. 发明申请

WO1995023999A1 AQUEOUS COMPOSITION FOR REMOVING POLYMER RESIST LAYERS FROM SUBSTRATE SURFACES AND ITS USE 审中-公开
标题翻译：用于聚合物的去除性水抗蚀剂组合物的基底表面及其应用层
公开(公告)号：WO1995023999A1
公开(公告)日：1995-09-08
申请号：PCT/EP1995000858
申请日：1995-03-06
申请人： ATOTECH DEUTSCHLAND GMBH , BARON, David, Thomas , SMITH, Michael, Leonhard , JOHAL, Kuldip, Singh
发明人： ATOTECH DEUTSCHLAND GMBH
IPC分类号： G03F07/32
CPC分类号： G03F7/425 , H01L21/31133
摘要： Aqueous compositions are disclosed for removing polymer resist layers from underlying surfaces, and the use of such compositions. Conventional aqueous solutions for removing polymer resist layers, for example from printed circuit cards, contain alkalinising agents, such as alkaline metal hydroxides or substituted ammonium hydroxides. Various additives are added to these solutions to prevent the composition from corroding the metallic surfaces of the printed circuit card. The removed resist material is substantially dissolved or suspended in the form of very small particles in the pickling composition. The disclosed pickling composition contains soluble silicates besides the alkalinising agents. Other additives are generally not required. These compositions remove the resists from the substrate surface in the form of large particles, so that their separation from the composition is possible without problems.
摘要翻译：本发明涉及一种用于去除聚合物抗蚀剂下层表面的层，并且使用这样的组合物的含水组合物。用于除去聚合的常规的水溶液抗蚀剂层，诸如印刷电路板，包括碱化剂，如碱金属或取代的铵的氢氧化物。为了防止对Mettallflächen电路板上的组合物的发作，这些解决方案的各种其它添加剂加入。所述光致抗蚀剂去除材料溶解在基本上脱除组合物或悬浮在非常小的颗粒在其中。根据本发明的汽提组合物另外含有除碱剂可溶性硅酸盐。其他添加剂通常不需要。用这些组合物，该抗蚀剂在从与基板面大的颗粒除去，从而使它们的去除可能是从组合物中容易。

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