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    • 31. 发明申请
    • EXTREME EDGE AND SKEW CONTROL IN ICP PLASMA REACTOR
    • ICP等离子体反应器中的极端边缘和轴流控制
    • WO2015099892A1
    • 2015-07-02
    • PCT/US2014/064858
    • 2014-11-10
    • APPLIED MATERIALS, INC.
    • BANNA, SamerKNYAZIK, VladimirTANTIWONG, Kyle
    • H01L21/02
    • H05H1/24H01J37/321H01J37/32174H01J37/32642H01J37/32697H01L21/6875
    • Embodiments of the present disclosure provide apparatus and methods for improving plasma uniformity around edge regions and/or reducing non-symmetry in a plasma processing chamber. One embodiment of the present disclosure provides a plasma tuning assembly having one or more conductive bodies disposed around an edge region of a substrate support in a plasma processing chamber. The one or more conductive bodies are isolated from other chamber components and electrically floating in the processing chamber near the edge region without connecting to active electrical potentials. During operation, when a plasma is maintained in the plasma processing chamber, the presence of the one or more conductive bodies affects the plasma distribution near the one or more conductive bodies.
    • 本公开的实施例提供了用于改善边缘区域周围的等离子体均匀性和/或降低等离子体处理室中的非对称性的装置和方法。 本公开的一个实施例提供了一种等离子体调谐组件,其具有设置在等离子体处理室中的衬底支撑件的边缘区域周围的一个或多个导电体。 一个或多个导电体与其它腔室部件隔离,并且在边缘区域附近电处理室中电浮动,而不连接到有源电位。 在操作期间,当等离子体保持在等离子体处理室中时,一个或多个导电体的存在影响一个或多个导电体附近的等离子体分布。
    • 33. 发明申请
    • POWER DEPOSITION CONTROL IN INDUCTIVELY COUPLED PLASMA (ICP) REACTORS
    • 感应耦合等离子体(ICP)反应器中的功率沉积控制
    • WO2015034736A1
    • 2015-03-12
    • PCT/US2014/053077
    • 2014-08-28
    • APPLIED MATERIALS, INC.
    • BANNA, SamerGUNG, Tza-JingKNYAZIK, VladimirTANTIWONG, KyleMAROHL, Dan A.TODOROW, Valentin N.YUEN, Stephen
    • H05H1/24H05H1/34H05H1/46
    • H01J37/32119H01J37/321H01J37/3211
    • Embodiments of inductively coupled plasma (ICP) reactors are provided herein. In some embodiments, a dielectric window for an inductively coupled plasma reactor includes: a body including a first side, a second side opposite the first side, an edge, and a center, wherein the dielectric window has a dielectric coefficient that varies spatially. In some embodiments, an apparatus for processing a substrate includes: a process chamber having a processing volume disposed beneath a lid of the process chamber; and one or more inductive coils disposed above the lid to inductively couple RF energy into and to form a plasma in the processing volume above a substrate support disposed within the processing volume; wherein the lid is a dielectric window comprising a first side and an opposing second side that faces the processing volume, and wherein the lid has a dielectric coefficient that spatially varies to provide a varied power coupling of RF energy from the one or more inductive coils to the processing volume.
    • 本文提供电感耦合等离子体(ICP)反应器的实施例。 在一些实施例中,用于电感耦合等离子体反应器的电介质窗包括:主体,包括第一侧,与第一侧相对的第二侧,边缘和中心,其中介电窗口具有在空间上变化的介电系数。 在一些实施例中,用于处理衬底的装置包括:处理室,其具有设置在处理室的盖下方的处理容积; 以及设置在所述盖上方的一个或多个感应线圈,以将RF能量感应耦合并在处理体积中形成等离子体,所述等离子体位于设置在所述处理容积内的衬底支撑件上方; 其中所述盖是包括面向所述处理体积的第一侧和相对的第二侧的电介质窗,并且其中所述盖具有空间变化的介电系数,以提供来自所述一个或多个感应线圈的RF能量与所述一个或多个感应线圈的变化的功率耦合 处理量。
    • 36. 发明申请
    • HIGH EFFICIENCY TRIPLE-COIL INDUCTIVELY COUPLED PLASMA SOURCE WITH PHASE CONTROL
    • 高效率三线圈电感耦合等离子体源相控
    • WO2013062929A1
    • 2013-05-02
    • PCT/US2012/061410
    • 2012-10-23
    • APPLIED MATERIALS, INC.
    • BANNA, SamerBISHARA, WahebGIAR, RyanTODOROW, ValentinLUBOMIRSKY, DmitryTANTIWONG, Kyle
    • H05H1/46H01F38/14H01L21/3065
    • H05H1/46H05H2001/4667
    • A plasma processing apparatus may include a process chamber having an interior processing volume, first, second and third RF coils disposed proximate the process chamber to couple RF energy into the processing volume, wherein the second RF coil disposed coaxially with respect to the first RF coil, and wherein the third RF coil disposed coaxially with respect to the first and second RF coils, at least one ferrite shield disposed proximate to at least one of the first, second or third RF coils, wherein the ferrite shield is configured to locally guide a magnetic field produced by an RF current flow through the first, second or third RF coils toward the process chamber, wherein the plasma processing apparatus is configured to control a phase of each RF current flow through each of the of the first, second or third RF coils.
    • 等离子体处理装置可以包括具有内部处理体积的处理室,设置在处理室附近的第一,第二和第三RF线圈,以将RF能量耦合到处理容积中,其中相对于第一RF线圈同轴设置的第二RF线圈 ,并且其中所述第三RF线圈相对于所述第一和第二RF线圈同轴设置,至少一个铁氧体屏蔽件设置在所述第一,第二或第三RF线圈中的至少一个附近,其中所述铁氧体屏蔽件被配置为局部引导 由RF电流产生的磁场通过第一,第二或第三RF线圈流向处理室,其中等离子体处理装置被配置为控制通过第一,第二或第三RF中的每一个的每个RF电流的相位 线圈。