专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

21. 发明申请

WO2006006509B1 SUBSTRATE PROCESSING APPARATUS AND MOUNTER 审中-公开
标题翻译：基板加工设备和安装
公开(公告)号：WO2006006509B1
公开(公告)日：2007-03-01
申请号：PCT/JP2005012619
申请日：2005-07-01
申请人： MATSUSHITA ELECTRIC IND CO LTD , MURATA TAKAHIKO , TSUJI SHINJIRO , ODAWARA KOZO , KATANO RYOUICHIROU
发明人： MURATA TAKAHIKO , TSUJI SHINJIRO , ODAWARA KOZO , KATANO RYOUICHIROU
IPC分类号： H05K13/00
CPC分类号： H05K13/0069 , Y10T29/4913 , Y10T29/53178 , Y10T29/53191
摘要： The final-bonder (103) is equipped with: a warping correction unit (201) that is equipped in parallel with a backup stage (203) with a distance of about 20 mm from such backup stage (203), and that includes accordion pads (202) for sucking a liquid crystal panel; the backup stage (203) that supports, from the back, the liquid crystal panel when pressure is applied to its outer edge portion at the bonding of semiconductor components; and a pressure head (204) that carries out final bonding of the semiconductor components onto the outer edge portion of the liquid crystal panel by applying pressure and heat to them.
摘要翻译：最终接合器（103）配备有：与备用台（203）并联配置的翘曲矫正单元（201），该备用台（203）与该后备台（203）的距离约为20mm，并且包括手风琴垫（202），用于吸取液晶面板; 备用台（203），其在半导体部件的接合时向其外缘部施加压力时从后面支撑液晶面板; 以及压力头（204），其通过向其施加压力和热量来执行半导体部件到液晶面板的外边缘部分的最终接合。

22. 发明申请

WO2006078068A3 ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNTING METHOD 审中-公开
标题翻译：电子元件安装系统和电子元件安装方法
公开(公告)号：WO2006078068A3
公开(公告)日：2007-02-01
申请号：PCT/JP2006301267
申请日：2006-01-20
申请人： MATSUSHITA ELECTRIC IND CO LTD , KIHARA MASAHIRO , INOUE MASAFUMI , HIDESE WATARU
发明人： KIHARA MASAHIRO , INOUE MASAFUMI , HIDESE WATARU
IPC分类号： H05K13/08
CPC分类号： H05K13/0413 , H05K13/0069 , Y10T29/49004 , Y10T29/53174
摘要： To provide an electronic component mounting system and an electronic component mounting method which can prevent a mounting failure due to positional error in a height direction of a substrate and ensure mounting quality. The electronic component mounting system includes a plurality of electronic component mounting devices connected to one another and mounts an electronic component on a substrate to manufacture a mounting substrate. A print test device for testing the substrate after solder printing measures a height position of a height measurement point set on the upper surface of the substrate 4 by a height measuring machine 22 and outputs a measurement result as substrate height data. In a component placing step using an electronic component placing device, a control parameter for controlling a component placing operation of the placing head 32 is updated. Accordingly, it is possible to correct a variation of the height position of an individual substrate and to prevent a mounting failure due to positional error in the height direction of the substrate.
摘要翻译：提供一种能够防止由于基板的高度方向上的位置误差引起的安装故障并确保安装质量的电子部件安装系统和电子部件安装方法。电子部件安装系统包括彼此连接的多个电子部件安装装置，并将电子部件安装在基板上以制造安装基板。用于在焊接印刷之后测试基板的印刷测试装置通过高度测量机22测量设置在基板4的上表面上的高度测量点的高度位置，并输出测量结果作为基板高度数据。在使用电子部件放置装置的部件放置步骤中，更新用于控制放置头32的部件放置操作的控制参数。因此，可以校正单个基板的高度位置的变化，并且可以防止由于基板的高度方向上的位置误差引起的安装故障。

23. 发明申请

WO2006077804A1 クランプ装置及び画像形成装置审中-公开
标题翻译：夹紧装置和图像形成装置
公开(公告)号：WO2006077804A1
公开(公告)日：2006-07-27
申请号：PCT/JP2006/300478
申请日：2006-01-17
申请人：富士写真フイルム株式会社 , 橋口昭浩 , 福井隆史 , 寺田和広 , 須藤浩樹
发明人：橋口昭浩 , 福井隆史 , 寺田和広 , 須藤浩樹
IPC分类号： H05K3/00 , G03F7/20 , B23Q3/02
CPC分类号： G03F7/70791 , G03F7/707 , H05K13/0069
摘要：　ステージに対して着脱可能とされ、反りが発生してしまうような厚さのワークでも、そのステージ上に確実に固定できるクランプ装置と、そのクランプ装置を備えた画像形成装置の提供を課題とする。板状のワーク１００が載置され、ステージ２０上に着脱可能に装着されるベース３２と、ベース３２に設けられ、ワーク１００の縁端部１００Ａをクランプするクランプ部３４とを備え、ベース３２に、ベース３２上面側とステージ２０側との間を連通させる複数の連通孔３２Ａが穿設されたクランプ装置３０とする。そして、このクランプ装置３０を備えた画像形成装置１０とする。
摘要翻译：一种夹紧装置，其可移除地布置在台架上，并且即使是具有可能引起翘曲的厚度的工件，也可以可靠地固定在平台上; 以及设置有这种夹紧装置的图像形成装置。夹紧装置（30）设置有基座（32），该基座（32）可拆卸地安装在台架（20）上，板形工件（100）放置在基座上，夹紧部分（34）布置在基座 32），用于夹紧工件（100）的边缘部分（100A）。多个连通孔（32A）穿过基座（32），用于在基座（32）的上平面侧和台架（20）的一侧之间连通。图像形成装置（10）设置有夹紧装置（30）。

24. 发明申请

WO2006055015A1 PRINTED CIRCUIT BOARD CLAMP 审中-公开
标题翻译：打印电路板夹
公开(公告)号：WO2006055015A1
公开(公告)日：2006-05-26
申请号：PCT/US2005/000952
申请日：2005-01-12
申请人： AIRLINE HYDRAULICS CORPORATION , MONCAVAGE, Charles
发明人： MONCAVAGE, Charles
IPC分类号： B23K31/02
CPC分类号： B23K37/0408 , B23K1/0016 , B23K3/087 , B23K2201/42 , H05K13/0069
摘要： A PC board clamp (100) has a base member movable between a first position and a second position.
摘要翻译： PC板夹具（100）具有可在第一位置和第二位置之间移动的基座构件。

25. 发明申请

WO2005041629A1 APPARATUS FOR DETERMINING SUPPORT MEMBER LAYOUT PATTERNS 审中-公开
标题翻译：用于确定支持会员布局模式的装置
公开(公告)号：WO2005041629A1
公开(公告)日：2005-05-06
申请号：PCT/JP2004/015664
申请日：2004-10-15
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. , YOSHIDA, Ikuo , YAMASAKI, Akihito , KONISHI, Chikashi , MAENISHI, Yasuhiro , YAMAZAKI, Takuya , NISHIDA, Hiroyoshi , MATSUMOTO, Masaya
发明人： YOSHIDA, Ikuo , YAMASAKI, Akihito , KONISHI, Chikashi , MAENISHI, Yasuhiro , YAMAZAKI, Takuya , NISHIDA, Hiroyoshi , MATSUMOTO, Masaya
IPC分类号： H05K13/00
CPC分类号： H05K13/0069 , H05K13/0061 , Y10T29/49778 , Y10T29/4978 , Y10T29/5313
摘要： A support pin position determination apparatus (600) that determines the positions at which support pins are to be placed so that the leads of electronic components which have already been mounted on the undersurface of a circuit board are not damaged or the solder lands thereof do not come off includes: a database unit (607); a support pin position determination program storing unit (605); and a calculation control unit (601). The database unit (607) holds component mounting point data (607b), component shape data (607c), and available pin positions at which the support pins are allowed to be placed on a support pin plate (support pin plate data (607a)). The support pin position determination program storing unit (605) stores a support pin position determination program for determining positions at which the support pins are to be placed among the available pin positions, on the basis of the mounting point data and the shape data of the components. The calculation control unit (601) executes the support pin position determination program. The component shape data is data of the shape with a margin of a fixed width added around the outer shape of the component itself.
摘要翻译：确定支撑销的位置的支撑销位置确定装置（600），使得已经安装在电路板的下表面上的电子部件的引线没有被损坏或其焊盘没有脱落包括：数据库单元（607）; 支撑销位置确定程序存储单元（605）; 和计算控制单元（601）。数据库单元（607）保持部件安装点数据（607b），部件形状数据（607c）和允许支撑销放置在支撑销板（支撑销板数据（607a）上）的可用销位置）。支撑销位置确定程序存储单元（605）基于安装点数据和安装点位置确定程序的形状数据，存储用于确定支撑销在可用引脚位置之间的位置的支撑销位置确定程序组件。计算控制单元（601）执行支撑销位置确定程序。部件形状数据是在部件本身的外形附近加上固定宽度的边缘的形状的数据。

26. 发明申请

WO2005004575A1 COMPONENT PLACEMENT DEVICE 审中-公开
标题翻译：组件放置设备
公开(公告)号：WO2005004575A1
公开(公告)日：2005-01-13
申请号：PCT/IB2004/051086
申请日：2004-07-01
申请人： ASSEMBLÉON N.V. , THOMASSEN, Jacobus, A., M.
发明人： THOMASSEN, Jacobus, A., M.
IPC分类号： H05K13/00
CPC分类号： H05K13/0069 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183 , Y10T29/53187 , Y10T29/53191 , Y10T29/53291
摘要： Component placement device (11, 21, 31, 41, 51) comprising an elongated transport device (3) by means of which transport device substrates to be provided with components can be moved in a transport direction parallel to the transport device. Furthermore, the component placement device (11, 21, 31, 41, 51) comprises at least one component feeder (5) located along a' longitudinal side of the transport device (3), as well as at least one component pick and place unit (7) by means of which in operation a component can be picked up from the component' feeder and placed on a substrate. The component placement device (11, 21, 31, 41, 51) further comprises a substrate support (15, 22-26, 32, 43, 52) which is located along a longitudinal side of the transport device (3) opposite to the component feeder.
摘要翻译：包括细长输送装置（3）的部件放置装置（11,21,31,41,51）可以通过该部件移动装置沿着平行于输送装置的输送方向移动。此外，部件放置装置（11,21,31,41,51）包括沿着输送装置（3）的纵向侧面定位的至少一个部件供给器（5），以及至少一个部件拾取和放置单元（7），通过该单元（7），组件可以从组件的进料器中拾取并放置在基板上。所述部件放置装置（11,21,31,41,51）还包括基板支撑件（15,22-26,32,33,52），所述基板支撑件沿着所述输送装置（3）的与所述输送装置组件馈线

27. 发明申请

WO2003067950A1 ELASTIC COLLET FOR PCB MOUNTING JIG AND PCB JIG ASSEMBLY HAVING THE COLLET 审中-公开
标题翻译：用于PCB安装夹具和PCB夹具的弹性夹具
公开(公告)号：WO2003067950A1
公开(公告)日：2003-08-14
申请号：PCT/KR2003/000248
申请日：2003-02-05
申请人： NAM, Sung-Hun
发明人： NAM, Sung-Hun
IPC分类号： H05K13/00
CPC分类号： H05K13/0069 , H05K13/0465
摘要： The present invention relates to an elastic collet for PCB mounting jig and a PCB jig assembly having the collet, more particularly, to an elastic collet for PCB mounting jig and a PCB jig assembly having the collet, which prevents bending and the soldering defect of a printed circuit board (PCB) in the process of mounting and soldering chips and parts on PCB, thus simplifies the surface mount process. An printed circuit board (PCB) jig assembly having the collet in accordance with the present invention is characterized in comprising a plate-type jig having a plurality of through holes for mounting a PCB of a certain thickness on the top surface thereof and a plurality of elastic member being combined with the plurality of through holes respectively in order to fix the PCB mounted on the top surface of the jig detachably, wherein each of the elastic members is an elastic collet for the jig, having a hollow cylindrical shape having a inner diameter and a outer diameter, the outer diameter consisting of a large outer diameter portion and a small outer diameter portion to form a step on the outer surface of the elastic collet, and a plurality of through slots having a certain length, being formed on the circumference of the elastic collet, and stemming axially from a distal end of the large outer diameter portion, each of the through holes of the jig consists of a large inner diameter portion and a small inner diameter portion, wherein the outer diameter of the small outer diameter portion of the elastic collet is larger than the inner diameter of the small inner diameter portion of the through hole, and the outer diameter of the large outer diameter portion of the elastic collet is larger than the inner diameter of the large inner diameter portion of the through hole.
摘要翻译：本发明涉及一种用于PCB安装夹具的弹性夹头和具有夹头的PCB夹具组件，更具体地涉及一种用于PCB安装夹具的弹性夹头和具有夹头的PCB夹具组件，其防止弯曲和焊接缺陷印刷电路板（PCB）在PCB上安装和焊接芯片和零件的过程中，从而简化了表面贴装过程。具有根据本发明的夹头的印刷电路板（PCB）夹具组件的特征在于包括：板型夹具，其具有多个用于在其顶表面上安装一定厚度的PCB的通孔，以及多个弹性构件分别与多个通孔组合以便可拆卸地固定安装在夹具顶表面上的PCB，其中每个弹性构件是用于夹具的弹性夹头，具有中空圆柱形状，其具有内径所述外径由外径大的部分和外径小的部分构成，以在所述弹性夹头的外表面上形成台阶，并且在所述圆周上形成有一定长度的多个贯通槽的弹性夹头，并且从大外径部分的远端轴向引导，夹具的每个通孔由大的内径p 所述弹性夹头的小外径部的外径大于所述通孔的小内径部的内径，所述大外径部的外径为弹性夹头大于通孔的大内径部分的内径。

28. 发明申请

WO2003009664A1 DEVICE FOR SUPPORTING FLAT PRODUCTS 审中-公开
标题翻译：支持平板产品的设备
公开(公告)号：WO2003009664A1
公开(公告)日：2003-01-30
申请号：PCT/IB2002/002539
申请日：2002-06-24
申请人： KONINKLIJKE PHILIPS ELECTRONICS N.V.
发明人： VAN DEURSEN, Johannes, A., M.
IPC分类号： H05K13/00
CPC分类号： H05K13/0069 , Y10T29/5313 , Y10T29/53265
摘要： The invention relates to a device for supporting flat products, especially printed circuit boards. The device comprises a supporting member (4) and supporting pins (1) which can be placed on and removed from the supporting member. Recesses (5) and protrusions (3) fitting in said recesses are provided for positioning of the supporting pins in relation to the supporting member. Said recesses (5) and protrusions (3) have a non-circular cross-section. A combination of a protrusion (3) and a recess (5) positioning a supporting pin (1) in a particular position on the supporting member (4) is located eccentrically in relation to the centreline of said supporting pin (1).
摘要翻译：本发明涉及一种用于支撑平板产品，特别是印刷电路板的装置。该装置包括支撑构件（4）和支撑销（1），其可以被放置在支撑构件上和从支撑构件移除。凹部（5）和安装在所述凹部中的凸起（3）设置成用于相对于支撑构件定位支撑销。所述凹部（5）和突起（3）具有非圆形横截面。将支撑销（1）定位在支撑构件（4）上的特定位置的突起（3）和凹部（5）的组合相对于所述支撑销（1）的中心线偏心定位。

29. 发明申请

WO2002089552A1 A METHOD FOR HANDLING BOARDS IN A COMPONENT MOUNTING MACHINE AND A COMPONENT MOUNTING MACHINE FOR PERFORMING THE METHOD 审中-公开
标题翻译：一种用于处理组件安装机和用于执行方法的组件安装机的方法
公开(公告)号：WO2002089552A1
公开(公告)日：2002-11-07
申请号：PCT/SE2002/000753
申请日：2002-04-17
申请人： MYDATA AUTOMATION AB , JACOBSSON, Nils , CARLSSON, Gunnar
发明人： JACOBSSON, Nils , CARLSSON, Gunnar
IPC分类号： H05K13/02
CPC分类号： H05K13/0069 , Y10T29/4913 , Y10T29/5137 , Y10T29/53174 , Y10T29/53178
摘要： The present invention relates to a method for handling boards in a component mounting machine comprising the steps of: a) moving a plurality of boards substantially simultaneously from a first plurality of cassettes, arranged in parallel at the machine, onto a board carrier; b) processing said plurality of boards by mounting components thereon; c) moving said plurality of boards substantially simultaneously and in parallel from the board carrier into a second plurality of board cassettes arranged in parallel at the machine and moving a next plurality of boards from said first plurality of cassettes onto the board carrier; g) repeating steps b-c- until said first plurality of cassettes are empty; and h) exchanging cassettes and repeating the method form step a. The invention also relates to a component mounting machine, which is arranged to perform the method.
摘要翻译：本发明涉及一种用于在组件安装机中处理板的方法，包括以下步骤：a）基本上同时从机器上平行布置的第一多个盒子同时移动多个板到板载体上; b）通过在其上安装部件来处理所述多个板; c）将所述多个板基本上同时地并且从所述板载体平行移动到在所述机器处并排布置的第二多个板盒，并将下一个多个板从所述第一多个盒移动到所述板载体上; g）重复步骤b-c-直到所述第一多个盒是空的; 和h）交换盒并重复方法形成步骤a。本发明还涉及一种组件安装机，其被配置为执行该方法。

30. 发明申请

WO02021893A2 METHOD AND DEVICE FOR TESTING PRINTED CIRCUIT BOARDS WITH A PARALLEL TESTER 审中-公开
标题翻译：使用平行测试仪检查PCB调节器的方法和装置
公开(公告)号：WO02021893A2
公开(公告)日：2002-03-14
申请号：PCT/EP2001/009133
申请日：2001-08-07
IPC分类号： G01R31/02 , G01R31/28 , G01R31/309 , H05K3/00 , H05K13/00 , H05K13/08
CPC分类号： H05K13/0069 , G01R31/2805 , G01R31/2806 , G01R31/309
摘要： The invention relates to a method and device for testing printed circuit boards with a parallel tester. The printed circuit boards comprise strip conductors whose end points are embodied as printed circuit board testing points which can be contacted during testing. The method comprises the following steps; testing a printed circuit board with a parallel tester, whereby the printed circuit board testing points of the printed circuit board are brought into contact with the contact elements of the parallel tester; determining the printed circuit board testing points which are either judged to be unable to be put correctly into contact with the parallel tester or deemed to be basically unable to be put into contact with the parallel tester; and re-measuring the printed circuit board test points judged to be unable to be put correctly into contact or the non contactable printed circuit board test points and also the strip conductors connected to said points by means of a device which is independent from the contact elements in the parallel tester.
摘要翻译：本发明涉及一种用于与并行测试仪，其特征在于，所述印刷电路板具有导体路径，结束点被形成为电路板测试点可用于测试联络测试电路板的方法和设备。该方法包括以下步骤： - 测试的测试电路板与平行测试仪，其特征在于，与所述平行测试器的接触元件的测试电路板的电路板测试点相接触时， - 确定的电路板测试点是不安全的接触评估或者正确地与并行测试器，或基本上是与并行测试仪不能进行接触，和 - 重测量为不安全正确地接触可评估电路板测试点的或不接触电路板测试点和相关联的导体路径，以独立于并行测试器装置的接触元件的实体。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式