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11. 发明申请

WO1997006398A1 HEAT EXCHANGER WITH FLEXIBLE TUBE SUPPORT 审中-公开
标题翻译：热交换器与柔性管支持
公开(公告)号：WO1997006398A1
公开(公告)日：1997-02-20
申请号：PCT/US1996012784
申请日：1996-08-06
申请人： HEATCRAFT INC.
发明人： HEATCRAFT INC. , DEROSIER, Gregory, S.
IPC分类号： F28F07/00
CPC分类号： F28F9/0131 , F28F2265/26 , Y10S165/066
摘要： A heat exchanger coil (10) is comprised of plural metal tubes (12) of generally circular cross section, plural heat transfer enhancing fins (22) and plural relatively flat metal support plates (14, 16), each of which has plural first holes (18) and plural second holes (20) arranged in parallel rows. The second holes (20) have a smaller diameter than the first holes (18). The tubes (12) are laced through respective holes (18, 20) in the plates (14, 16) and through aligned holes in the fins (22) such that the tubes (12) extend generally at right angles to the respective planes of the plates (14, 16) and fins (22). In one embodiment, each plate (14, 16) is cut to define two discrete flexible sections (30, 32) and two resilient arms (58, 60) for flexibly coupling one of the sections (30) of each plate (14, 16) with a relatively fixed portion (96) of the corresponding plate (14, 16).
摘要翻译：一种热交换器盘管（10）由多个大体呈圆形横截面的金属管（12），多个传热增强翅片（22）和多个相对扁平的金属支撑板（14,16）构成，每个具有多个第一孔（18）和平行排列的多个第二孔（20）。第二孔（20）的直径小于第一孔（18）。管（12）穿过板（14,16）中的相应孔（18,20）并且穿过翅片（22）中的对准孔，使得管（12）大致垂直于相应平面板（14,16）和翅片（22）。在一个实施例中，每个板（14,16）被切割以限定两个离散的柔性部分（30,32）和两个弹性臂（58,60），用于柔性地联接每个板（14,16）的部分（30）中的一个）具有相应板（14,16）的相对固定部分（96）。

12. 发明申请

WO1996027774A1 HEAT SINK ASSEMBLIES 审中-公开
标题翻译：散热装置
公开(公告)号：WO1996027774A1
公开(公告)日：1996-09-12
申请号：PCT/US1996002940
申请日：1996-03-01
申请人： AAVID ENGINEERING, INC.
发明人： AAVID ENGINEERING, INC. , LAVOCHKIN, Ronald, B.
IPC分类号： F28F07/00
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A heat sink assembly (10) made up of a heat sink (12), an electrical component (14) adapted for mounting to a region of a printed circuit board (16) and a clip (18). The clip (18) includes a planar horizontal section (20), a pair of vertically extending legs (20a, 22b) disposed along folds formed at opposing ends of the horizontal section (20) and, an engaging section (30) disposed along an edge of the horizontal section (20) and positioned intermediate the opposing ends of the horizontal section. The engaging section (30) is adapted to engage the heat sink (12) and force the heat sink (12) against the printed circuit board (16) mounted electrical component (14) as the legs of the clip (18) engage the printed circuit board (16) through holes formed in the printed circuit board (16) on opposing sides of the component mounting region of the printed circuit board. A pair of gussets is disposed at the folds formed at the opposing ends of the horizontal section. The gussets (42a, 42b) are provided to "lock in" the bend between the legs and the horizontal section (20) at 90 degrees. The planar horizontal section (20), the pair of vertically extending legs (20, 22b), the gussets (42a, 42b) and the vertically extending, engaging section (30) of the clip (18) are integrally formed from a single material, preferably sheet metal.
摘要翻译：由散热器（12），适于安装到印刷电路板（16）的区域的电气部件（14）和夹子（18）构成的散热器组件（10）。夹子（18）包括平面水平部分（20），沿着形成在水平部分（20）的相对端处的褶皱设置的一对垂直延伸的腿部（20a，22b）和沿着水平部分（20）设置的接合部分水平部分（20）的边缘并且位于水平部分的相对端之间。接合部分（30）适于接合散热器（12），并且当夹子（18）的腿接合印刷电路板（12）的腿部时，迫使散热器（12）抵靠安装在电气部件（14）上的印刷电路板（16）在印刷电路板的部件安装区域的相对侧上形成在印刷电路板（16）上的电路板（16）通孔。一对角撑板设置在形成在水平部分的相对端处的褶皱处。角撑板（42a，42b）被设置成以90度将“腿”和水平部分（20）之间的弯曲“锁定”。夹子（18）的平面水平部分（20），一对垂直延伸的支腿（20,22a），角撑板（42a，42b）和垂直延伸的接合部分（30）由单一材料，优选为金属片。

13. 发明申请

WO1979000605A1 MODULAR HEAT EXCHANGER WITH RESILIENT MOUNTING AND SEALING ELEMENT 审中-公开
标题翻译：具有回弹安装和密封元件的模块式热交换器
公开(公告)号：WO1979000605A1
公开(公告)日：1979-08-23
申请号：PCT/US1979000019
申请日：1979-01-15
申请人： CATERPILLAR TRACTOR CO
发明人： CATERPILLAR TRACTOR CO , KESKE F
IPC分类号： F28F07/00
CPC分类号： F28F9/06 , Y10T29/4935
摘要： A heat exchanger (10) having one or more cooling cores (16) connected between an inlet manifold lank (12) and an outlet manifold tank (14) is provided with a resilient element (50) for mounting the cooling cores (16) to the manifold tanks (12, 14) and sealing the connection therebetween. The resilient mounting and sealing element (50) is formed so as to have a strip portion (56) with at least one opening (32) formed therein to receive the tube (28, 30) of a cooling core (16) and a raised lip portion (58) around the strip portion (56) to provide a damped soft mount. The resilient element (50) also includes a grommet portion (54) around the opening (32) which deforms to provide a liquid or fluid-tight seal between the outside of cooling core tubes (28, 30) and the inside of the manifold tank bores which are adapted to receive the tubes.

14. 发明申请

WO1998029704A1 THERMALLY CONDUCTIVE CHUCK FOR VACUUM PROCESSOR 审中-公开
标题翻译：用于真空处理器的热导式止回阀
公开(公告)号：WO1998029704A1
公开(公告)日：1998-07-09
申请号：PCT/US1997024185
申请日：1997-12-30
申请人： CVC PRODUCTS, INC.
发明人： CVC PRODUCTS, INC. , MOSLEHI, Merhdad, M.
IPC分类号： F28F07/00
CPC分类号： C23C16/463 , C23C14/50 , C23C14/541 , C23C16/4585 , C23C16/46 , C23C16/466 , H01L21/67103
摘要： A chuck body (38) mounts a substrate (64) within a vacuum chamber (46). An intermediate sealing structure (44) seals the chuck body (38) to the substrate (64) and forms a pressurizable region within the vacuum chamber (46).
摘要翻译：卡盘主体（38）将基板（64）安装在真空室（46）内。中间密封结构（44）将卡盘主体（38）密封到基板（64）上并在真空室（46）内形成可加压区域。

15. 发明申请

WO1997031236A1 ACTIVE HEAT SINK STRUCTURE WITH FLOW AUGMENTING RINGS AND METHOD FOR REMOVING HEAT 审中-公开
标题翻译：具有流动环形活塞的主动散热结构和移除热量的方法
公开(公告)号：WO1997031236A1
公开(公告)日：1997-08-28
申请号：PCT/US1997002307
申请日：1997-02-20
申请人： LEMONT AIRCRAFT CORPORATION
发明人： LEMONT AIRCRAFT CORPORATION , LEMONT, Andrew, I. , RADZIUNAS, Jeffrey
IPC分类号： F28F07/00
CPC分类号： H01L23/467 , H01L23/38 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： An active heat sink (30) for use in the transfer of heat from a heat generating device such as a semiconductor chip (32) and the like with a heat sink (30) having an embedded fan (44) surrounded by a plurality of heat conducting flow augmenting rings (40) separated by apertures (41) through which a radially inward flow arises and with the rings (40) being sufficiently axially separated to enable fan propeller tip vortices (59) to penetrate the axial spacings (41) so as to cause a substantial cooling of annular ring regions (50) so as to raise the overall heat transfer coefficient of the active heat sink (30) in a significant manner.
摘要翻译：一种用于从诸如半导体芯片（32）等的发热装置传热的散热器（30），具有散热器（30），散热器（30）具有被多个热量包围的嵌入式风扇（44）由孔（41）分开的导电流动增加环（40），径向向内流动通过该孔（41），并且环（40）被充分轴向分离，以使得风扇螺旋桨梢涡流（59）能够穿透轴向间隔（41），以便导致环形环区域（50）的实质冷却，以便以显着的方式提高有源散热器（30）的总体传热系数。

16. 发明申请

WO1996013058A3 APPARATUS AND METHOD FOR TEMPERATURE CONTROL OF WORKPIECES IN VACUUM 审中-公开
公开(公告)号：WO1996013058A3
公开(公告)日：1996-05-02
申请号：PCT/US1995013158
申请日：1995-10-17
申请人： DIAMOND SEMICONDUCTOR GROUP, INC.
发明人： DIAMOND SEMICONDUCTOR GROUP, INC. , WHITE, Nicholas, R.
IPC分类号： F28F07/00

17. 发明申请

WO1996011372A1 IMPROVED HEAT TRANSFER SYSTEM FOR THERMOELECTRIC MODULES 审中-公开
标题翻译：改进的热电模块换热系统
公开(公告)号：WO1996011372A1
公开(公告)日：1996-04-18
申请号：PCT/US1995012885
申请日：1995-10-04
申请人： AMERIGON, INC.
发明人： AMERIGON, INC. , GALLUP, David, F. , GREGORY, Christian, T. , KARUNASIRI, Rankiri, T. , NOLES, David, R. , BELL, Lon, E.
IPC分类号： F28F07/00
CPC分类号： F28F3/02 , H01L35/30
摘要： A heat transfer system (48) comprises at least one thermoelectric module (50) that includes at least one thermoelectric element (52) interposed between a pair of thermally conductive surface portions (54). Thermally conductive heat transfer elements (60) are in contact with a respective surface portion (54) to provide conductive heat transfer. The heat transfer elements (60) may be integral or independent with one another and are stress relieved to accommodate the different thermal expansion rate of the surface portions (54) and, consequently increase thermoelectric module life. Contact between the heat transfer elements (60) and each respective surface portion (54) is maintained by a flexible thermally conductive bonding material or by solder connection or by an outer structure (68). Compressible sheets (64) are disposed over outer facing portions of the heat transfer elements (60) and the outer structure (68) is placed over the sheets to impose a compressive force onto the sheets. A thermally conductive material (62) is interposed between the heat transfer elements (60) and the surface portion (54) to promote thermal conductivity therebetween.
摘要翻译：传热系统（48）包括至少一个热电模块（50），其包括置于一对导热表面部分（54）之间的至少一个热电元件（52）。导热传热元件（60）与相应的表面部分（54）接触以提供导电的热传递。传热元件（60）可以是彼此一体的或独立的，并且应力释放以适应表面部分（54）的不同的热膨胀率，并且因此增加热电模块寿命。传热元件（60）和每个相应的表面部分（54）之间的接触由柔性导热接合材料或通过焊接连接或由外部结构（68）保持。可压缩片（64）设置在传热元件（60）的外表面部分上，并且外部结构（68）被放置在片材上以对片材施加压缩力。传热材料（62）介于传热元件（60）和表面部分（54）之间以促进它们之间的热传导。

18. 发明申请

WO1995030121A1 APPARATUS FOR THERMAL TREATMENT OF THIN FILM WAFER 审中-公开
标题翻译：薄膜薄膜热处理设备
公开(公告)号：WO1995030121A1
公开(公告)日：1995-11-09
申请号：PCT/US1995005281
申请日：1995-04-28
申请人： VARIAN ASSOCIATES, INC. , KYUNG, Hyun-Su , CHOI, Won-Song , LEE, Hueng-Jik , KIM, Sek-Young , SHIN, Jung-Ho , CHOI, Chang-Hwan
发明人： VARIAN ASSOCIATES, INC.
IPC分类号： F28F07/00
CPC分类号： H01L21/67103
摘要： An apparatus for thermal treatment of a wafer comprising a vacuum chamber (10) with a heater block (20) positioned in the vacuum chamber (10) and a clamp means (31) which presses against the wafer positioned on the heater block (20) with the weight of the clamp (31). A vacuum means (60) forms a vacuum in the chamber (10) and a gas supply means (100) supplies gas into the chamber (10) to provide a uniform temperature. A wafer supply means (50) supplies the wafer to the clamp means (31) for heat treatment.
摘要翻译：一种用于热处理晶片的设备，包括具有位于真空室（10）中的加热器块（20）的真空室（10）和压靠位于加热器块（20）上的晶片的夹紧装置（31）具有夹具（31）的重量。真空装置（60）在室（10）中形成真空，气体供应装置（100）将气体供应到室（10）中以提供均匀的温度。晶片供给装置（50）将晶片供给到用于热处理的夹紧装置（31）。

19. 发明申请

WO1995025255A1 APPARATUS AND METHOD FOR COOLING HEAT GENERATING ELECTRONIC COMPONENTS IN A CABINET 审中-公开
标题翻译：装置和方法，用于在柜中冷却发电电子元件
公开(公告)号：WO1995025255A1
公开(公告)日：1995-09-21
申请号：PCT/US1994002763
申请日：1994-03-15
申请人： AAVID ENGINEERING, INC.
发明人： AAVID ENGINEERING, INC. , GOURDINE, Meredith, C.
IPC分类号： F28F07/00
CPC分类号： H05K7/20154
摘要： A cabinet (30) having an exhaust fan (F) that creates a primary air flow across heat generating electronic components includes a cooling enclosure (11) which encloses predetermined components (C) to isolate them from other components in the cabinet (30). An air inlet conduit (18) connects the cooling enclosure (11) with the air inlets in the cabinet (30) and an air outlet conduit (19) connects the enclosure (11) with the air outlets of the cabinet (30) and the fan (F) to define a separate secondary air flow across the isolated components (C). The fan (F) creating the primary air flow across the non-isolated components simultaneously creates the secondary air flow across the isolated components (C), where heat generated by the isolated components (C) and non-isolated components is not mixed to maximize cooling of all components within the cabinet (30). The cooling enclosure (11) may also contain a heat sink (H).
摘要翻译：具有排气风扇（F）的机柜（30），其产生横跨发热电子部件的一次空气流，其包括封闭预定部件（C）以将它们与机柜（30）中的其它部件隔离的冷却外壳（11）。空气入口管道（18）将冷却外壳（11）与机柜（30）中的空气入口连接，并且空气出口导管（19）将外壳（11）与机壳（30）的空气出口和风扇（F）以限定跨隔离组件（C）的单独二次空气流。跨过非隔离部件产生主要空气流的风扇（F）同时产生跨隔离部件（C）的二次空气流，其中由隔离部件（C）产生的热量和非隔离部件不混合以最大化冷却柜内的所有部件（30）。冷却外壳（11）还可以包含散热器（H）。

20. 发明申请

WO1993003319A1 CONTROLLED HIGHLY DENSIFIED DIAMOND PACKING OF THERMALLY CONDUCTIVE ELECTRICALLY RESISTIVE CONDUIT 审中-公开
标题翻译：导热电导管的高精度控制钻石包装
公开(公告)号：WO1993003319A1
公开(公告)日：1993-02-18
申请号：PCT/US1992006241
申请日：1992-07-28
申请人： TRA-CON, INC.
发明人： TRA-CON, INC. , SCHUFT, Charles, F.
IPC分类号： F28F07/00
CPC分类号： H01L23/3732 , H01L2924/0002 , H01L2924/09701 , H01L2924/00
摘要： The invention provides a system and method for fabricating an electrically resistive, high density diamond-packed thermal conduit for electrical components. An exemplary conduit provides superior thermal transfer between two objects. This is achieved by establishing, within a flowable and highly shrinkable electrically insulative carrier medium (20) such as acrylic, intimate contact between diamond particles (16) preferably having an aspect ratio of 1.35 or less.

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