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    • 3. 发明申请
    • DUAL TUBE FOULING MONITOR AND METHOD
    • 用于服务水系统热交换器的在线自动监测器。
    • WO1995016890A1
    • 1995-06-22
    • PCT/US1994014261
    • 1994-12-12
    • ELECTRIC POWER RESEARCH INSTITUTEGARY, John, F.SCHLOTTENMIER, David, J.FELLER, Murray, F.
    • ELECTRIC POWER RESEARCH INSTITUTE
    • F28F07/00
    • F28B11/00F28F19/00Y10S165/002
    • An electro-mechanical, dual tube and plug device (12) for on-line monitoring of heat exchanger (14) performance losses from micro-bio fouling of the surfaces (32) and for detecting change of heat transfer resistance of individual heat transfer tubes (32). The dual tube and plug device (12) includes a flow assembly tube (42) and a second temperature assembly tube (44) attached to the discharge end (24). The flow assembly tube (42) includes a tube (58) having an inner chamber (52) with paddle wheel flow sensor (54) and a temperature sensor (81). The second temperature assembly tube (44) includes a plurality of spring loaded temperature sensors (79) in the plugged empty heat transfer tube (98) immediately adjacent to the flow assembly tube (42). Flow and discharge temperature signals of additional dual tube and plug devices are sent to a microprocessor (100) which, utilizing data from an inlet water temperature sensor (77), continuously calculates, records and displays individual heat transfer coefficient.
    • 一种用于在线监测热交换器(14)表面(32)的微生物结垢的性能损失的机电双管和塞装置(12),并且用于检测各个传热管的传热阻力的变化 (32)。 双管和塞装置(12)包括流动组件管(42)和附接到排放端(24)的第二温度组合管(44)。 流动组件管(42)包括具有带有桨轮流量传感器(54)的内室(52)和温度传感器(81)的管(58)。 第二温度组装管(44)包括紧邻流动组件管(42)的堵塞的空传热管(98)中的多个弹簧加载温度传感器(79)。 另外的双管和插头装置的流量和排放温度信号被送到微处理器(100),微处理器利用来自入口水温传感器(77)的数据连续地计算,记录和显示各个传热系数。
    • 4. 发明申请
    • LOW PROFILE INTEGRATED HEAT SINK AND FAN ASSEMBLY
    • 低配置集成散热风扇组件
    • WO1994000727A1
    • 1994-01-06
    • PCT/US1993005920
    • 1993-06-21
    • PCUBID COMPUTER TECHNOLOGY INC.
    • PCUBID COMPUTER TECHNOLOGY INC.BAILEY, Norman, W.
    • F28F07/00
    • H01L23/467H01L23/40H01L2924/0002H01L2924/00
    • A low profile integrated assembly (10) for dissipating heat from an electronic component (12) includes a heat sink (14) having a peripheral envelope (26), and a self-contained motorized fan unit (16) for generating a flow of air within the envelope (26). The heat sink (14) includes a generally flat bottom base plate (18) and a multiplicity of elongated heat dissipating fins (20) extending upwardly therefrom which define a cavity (26). The fins (20) include a pair of spaced outer fins (20A) disposed along opposite sides of the base plate (18) defining opposite sides of the cavity (26) and a plurality of inner fins (20B) disposed between the outer fins (20A) difining a bottom of the cavity (26) spaced above the base plate (18). The fan unit (16) is seated upon the inner fins (20B) and retained between the outer fins (20A) in a tight-fitting engaged relation.
    • 用于从电子部件(12)散热的薄型集成组件(10)包括具有外围封套(26)的散热器(14)和用于产生空气流的独立的电动风扇单元(16) 在信封(26)内。 散热器(14)包括大致平坦的底部底板(18)和从其向上延伸的多个细长的散热翅片(20),其限定空腔(26)。 散热片(20)包括一对隔开的外翅片(20A),它们设置在基板(18)的相对两侧,该基板限定空腔(26)的相对侧面,以及多个内翅片(20B) 20A)限定在基板(18)上方间隔开的空腔(26)的底部。 风扇单元(16)位于内部翅片(20B)上并且以紧密接合的关系保持在外部翅片(20A)之间。