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    • 14. 发明申请
    • WAFER-SCANNING ION IMPLANTER HAVING FAST BEAM DEFLECTION APPARATUS FOR BEAM GLITCH RECOVERY
    • 具有快速光束偏转装置的波束扫描离子植绒装置用于光束恢复
    • WO2006084143A8
    • 2008-02-14
    • PCT/US2006003863
    • 2006-02-03
    • VARIAN SEMICONDUCTOR EQUIPMENTLOW RUSSELL JANGEL GORDON C
    • LOW RUSSELL JANGEL GORDON C
    • H01J37/317H01J37/147H01J37/304
    • H01J37/304H01J37/147H01J37/3171H01J2237/043H01J2237/15H01J2237/1501H01J2237/20228H01J2237/3045H01J2237/30472
    • An analyzer module of an ion implanter includes beam deflection apparatus adjacent to a resolving opening from which a terminal ion beam portion of an ion beam emanates. In response to a beam deflection voltage of a first value of substantially zero volts in a first operating condition, the beam deflection apparatus directs a source ion beam portion of the ion beam toward the resolving opening to generate the terminal ion beam portion. When the beam deflection voltage has a high second value in a second operating condition, the beam deflection apparatus directs the species of the source ion beam portion away from the resolving opening such that the terminal ion beam portion is substantially extinguished. Beam control circuitry is operative during the second operating condition to transition the ion implanter to the first operating condition by rapidly switching the beam deflection voltage from the second value to the first value. An implantation method employs the features of the implanter to recover from glitches during implantation and thereby improve the yield of implanted wafers.
    • 离子注入机的分析器模块包括与分离开口相邻的光束偏转装置,离子束的末端离子束部分从该分离开口发射。 响应于在第一操作条件下基本为零伏的第一值的光束偏转电压,光束偏转装置将离子束的源离子束部分引向分辨开口以产生端子离子束部分。 当光束偏转电压在第二操作条件下具有高的第二值时,光束偏转装置引导源离子束部分的种类远离分辨开口,使得末端离子束部分基本上熄灭。 光束控制电路在第二操作条件期间操作,以通过将光束偏转电压从第二值快速切换到第一值来将离子注入机转换到第一操作状态。 植入方法采用注入机的特征从植入期间的毛刺恢复,从而提高植入晶片的产量。
    • 17. 发明申请
    • WAFER-SCANNING ION IMPLANTER HAVING FAST BEAM DEFLECTION APPARATUS FOR BEAM GLITCH RECOVERY
    • 具有快速光束偏转装置的波束扫描离子植绒装置用于光束恢复
    • WO2006084143A3
    • 2007-11-01
    • PCT/US2006003863
    • 2006-02-03
    • VARIAN SEMICONDUCTOR EQUIPMENTLOW RUSSELL JANGEL GORDON C
    • LOW RUSSELL JANGEL GORDON C
    • H01J37/317H01J37/147H01J37/304
    • H01J37/304H01J37/147H01J37/3171H01J2237/043H01J2237/15H01J2237/1501H01J2237/20228H01J2237/3045H01J2237/30472
    • An analyzer module of an ion implanter includes beam deflection apparatus adjacent to a resolving opening from which a terminal ion beam portion of an ion beam emanates. In response to a beam deflection voltage of a first value of substantially zero volts in a first operating condition, the beam deflection apparatus directs a source ion beam portion of the ion beam toward the resolving opening to generate the terminal ion beam portion. When the beam deflection voltage has a high second value in a second operating condition, the beam deflection apparatus directs the species of the source ion beam portion away from the resolving opening such that the terminal ion beam portion is substantially extinguished. Beam control circuitry is operative during the second operating condition to transition the ion implanter to the first operating condition by rapidly switching the beam deflection voltage from the second value to the first value. An implantation method employs the features of the implanter to recover from glitches during implantation and thereby improve the yield of implanted wafers.
    • 离子注入机的分析器模块包括与分离开口相邻的光束偏转装置,离子束的末端离子束部分从该分离开口发射。 响应于在第一操作条件下基本为零伏特的第一值的光束偏转电压,光束偏转装置将离子束的源离子束部分引导到分辨开口以产生终端离子束部分。 当光束偏转电压在第二操作状态下具有高的第二值时,光束偏转装置引导源离子束部分的种类远离分辨开口,使得终端离子束部分基本上熄灭。 光束控制电路在第二操作条件期间操作,以通过将光束偏转电压从第二值快速切换到第一值来将离子注入机转换到第一操作状态。 植入方法采用注入机的特征从植入期间的毛刺恢复,从而提高植入晶片的产量。
    • 20. 发明申请
    • METHODS AND APPARATUS FOR GLITCH RECOVERY IN STATIONARY-BEAM ION IMPLANTATION PROCESS USING EAST ION BEAM CONTROL
    • 使用光束束控制的静态光束离子植入工艺中的玻璃恢复方法与装置
    • WO2006107797A3
    • 2007-06-14
    • PCT/US2006012144
    • 2006-03-31
    • VARIAN SEMICONDUCTOR EQUIPMENT
    • LOW RUSSELL JOLSON JOSEPH CTIMBERLAKE DAVID RMCLANE JAMES RSAUNDERS MARK DCUMMINGS JAMES JCALLAHAN THOMAS BENGLAND JONATHAN
    • H01J37/317H01J37/304
    • H01J37/304H01J37/3171H01J2237/30455H01J2237/31761Y10S438/961
    • An ion implanter includes a source (12) of a stationary, planar ion beam, a set of beamline components that steer the ion beam along a normal beam path as determined by first operating parameter values, an end station (18) that mechanically scans the wafer across the normal beam path, and control circuitry that responds to a glitch in the ion beam during implantation pass to (1) immediately alter an operating parameter of at least one of the beamline components to a second value to direct the ion beam away from the normal beam path and thereby cease implantation at an implantation transition location on the wafer, (2) subsequently move the wafer to an implantation- resuming position in which the implantation transition location on the wafer lies directly on the normal path of the ion beam, and (3) return the operating parameter to its first value to direct the ion beam along the normal beam path and resume ion implantation at the implantation transition location on the wafer. The operating parameter may be an output voltage of an extraction power supply, or other voltages and/or currents of beamline components that affect the path of the ion beam.
    • 离子注入机包括固定的平面离子束的源(12),一组束线分量,其通过由第一操作参数值确定的沿正常光束路径引导离子束;终端台(18),其机械地扫描 晶片穿过正常光束路径,以及控制电路,其在注入期间响应于离子束中的毛刺,以(1)立即将至少一个束线分量的操作参数改变为第二值,以将离子束远离 通常的光束路径,从而在晶片上的注入转变位置处停止注入,(2)随后将晶片移动到晶片上的注入转变位置直接位于离子束的正常路径上的注入恢复位置, 和(3)将操作参数返回到其第一值以引导沿着正常光束路径的离子束并且在晶片上的注入转变位置处恢复离子注入。 操作参数可以是提取电源的输出电压,或影响离子束路径的束线组件的其他电压和/或电流。