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    • 11. 发明申请
    • SELF-ALIGNED METAL OXIDE TFT WITH REDUCED NUMBER OF MASKS
    • 自对准金属氧化物膜,具有减少数量的掩模
    • WO2013019910A1
    • 2013-02-07
    • PCT/US2012/049238
    • 2012-08-02
    • CBRITE INC.SHIEH, Chan-LongYU, GangFOONG, Fatt
    • SHIEH, Chan-LongYU, GangFOONG, Fatt
    • H01L29/10
    • H01L29/7869H01L21/02554H01L21/02565
    • A method of fabricating MO TFTs on transparent substrates by positioning opaque gate metal on the front surface of the substrate defining a gate area, depositing gate dielectric material on the front surface of the substrate, overlying the gate metal and a surrounding area, and depositing metal oxide semiconductor material on the gate dielectric material. Depositing etch stop material on the semiconductor material. Positioning photoresist on the etch stop material, the etch stop material and the photoresist being selectively removable, and the photoresist defining an isolation area in the semiconductor material. Removing uncovered portions of the etch stop. Exposing the photoresist from the rear surface of the substrate using the gate metal as a mask and removing exposed portions so as to leave the etch stop material uncovered except for a portion overlying and aligned with the gate metal. Etching uncovered portions of the semiconductor material to isolate the TFT. Using the photoresist, selectively etching the etch stop layer to leave a portion overlying and aligned with the gate metal and defining a channel area in the semiconductor material. Depositing and patterning conductive material on the etch stop layer and on the semiconductor material to form source and drain areas on opposed sides of the channel area.
    • 一种在透明基板上制造MO TFT的方法,该方法是通过在形成栅极区域的衬底的前表面上定位不透明栅极金属,在衬底的前表面上沉积栅介电材料,覆盖栅极金属和周围区域,并沉积金属 氧化物半导体材料。 在半导体材料上沉积蚀刻停止材料。 将光致抗蚀剂定位在蚀刻停止材料上,蚀刻停止材料和光致抗蚀剂可选择性地移除,并且光刻胶在半导体材料中限定隔离区域。 去除蚀刻停止件的未覆盖部分。 使用栅极金属作为掩模从基板的后表面露出光致抗蚀剂,并除去暴露部分,以使除蚀刻停止材料未被覆盖,除了覆盖并与栅极金属对准的部分之外。 蚀刻半导体材料的未覆盖部分以隔离TFT。 使用光致抗蚀剂,选择性地蚀刻蚀刻停止层以留下覆盖并与栅极金属对准的部分并限定半导体材料中的沟道区域。 在蚀刻停止层和半导体材料上沉积和图案化导电材料以在沟道区域的相对侧上形成源极和漏极区域。
    • 12. 发明申请
    • DRIVING METHOD FOR IMPROVING STABILITY IN MOTFTS
    • 用于改善电动机稳定性的驱动方法
    • WO2012115745A1
    • 2012-08-30
    • PCT/US2012/022867
    • 2012-01-27
    • CBRITE INC.SHIEH, Chan-longYU, Gang
    • SHIEH, Chan-longYU, Gang
    • H01L29/10
    • G09G3/3225G09G2310/063G09G2320/0204
    • A method of driving a display device includes providing an array of pixels including rows and columns of pixels, each pixel including a switching/driving transistor circuit and at least one light emitting device. Each row of pixels has a scan line and each column of pixels has a data line. The method further includes defining a frame period during which each pixel in the array of pixels is addressed and dividing the frame period into a write subframe, a display subframe, and a rest subframe. A scan pulse is supplied to each scan line, a data signal to each data line and the light emitting devices are disabled during the write subframe. The light emitting devices are enabled during the display subframe and the switching/driving transistor circuits are disabled. A rest pulse is supplied to all scan lines and the light emitting devices are disabled during the rest subframe.
    • 一种驱动显示装置的方法包括提供包括行和列的像素的像素阵列,每个像素包括开关/驱动晶体管电路和至少一个发光器件。 每行像素具有扫描线,并且每列像素具有数据线。 该方法还包括定义帧期间,在该帧周期期间,像素阵列中的每个像素被寻址并且将帧周期划分为写子帧,显示子帧和剩余子帧。 向每条扫描线提供扫描脉冲,在写入子帧期间,对每个数据线的数据信号和发光器件禁用。 发光器件在显示子帧期间被使能,并且开关/驱动晶体管电路被禁止。 向所有扫描线提供静止脉冲,并且在其余子帧期间禁用发光装置。
    • 18. 发明申请
    • METHOD OF RECOVERY OF MOTFT BACKPLANE AFTER A-SI PHOTODIODE FABRICATION
    • 在A-Si光电二极管制造之后恢复MOTFT背板的方法
    • WO2018075404A1
    • 2018-04-26
    • PCT/US2017/056792
    • 2017-10-16
    • CBRITE INC.
    • SHIEH, Chan-LongYU, GangWANG, Guangming
    • H01L27/146
    • H01L27/14616H01L27/1463H01L27/14643H01L27/14658H01L27/14689H01L27/1469H01L27/14692
    • A method of fabricating a structure including a high mobility backplane and a-Si photodiode imager includes forming a matrix of metal oxide thin film transistors on the surface of a rigid support member, depositing a planarizing layer on the matrix of transistors that is either porous or permissive/diffusive to oxygen at temperatures below approximately 200°C, and fabricating a matrix of passivated a-Si photodiodes over the matrix of transistors and electrically connected one each photodiode to each of the transistors. A continuous path is provided through the planarizing layer from the exterior of the structure to each of the transistors and the structure is annealed at a temperature below 200°C in an oxygen ambient to move oxygen from the oxygen ambient to an active layer of each of the transistors and repair loss of oxygen damage to the transistors caused by the fabrication of the passivated a-Si photodiodes.
    • 一种制造包括高迁移率背板和a-Si光电二极管成像器的结构的方法包括:在刚性支撑构件的表面上形成金属氧化物薄膜晶体管的矩阵;在所述刚性支撑构件的表面上沉积平坦化层 在低于大约200℃的温度下多孔或者允许/扩散到氧的晶体管矩阵,以及在晶体管矩阵上制造钝化a-Si光电二极管矩阵并且将每个光电二极管与每个晶体管电连接。 提供穿过平面化层从结构外部到每个晶体管的连续路径,并且结构在低于200℃的温度下在氧气环境中退火,以将氧气从氧气环境移动到每个晶体管的活性层 晶体管和修复由于钝化a-Si光电二极管的制造而导致的晶体管的氧损伤的损失。
    • 20. 发明申请
    • TWO-TERMINAL ELECTRONIC DEVICES AND THEIR METHODS OF FABRICATION
    • 双端子电子器件及其制造方法
    • WO2016014345A3
    • 2016-03-17
    • PCT/US2015040815
    • 2015-07-16
    • CBRITE INC
    • YU GANGSHIEH CHAN-TONGCHEN ZHAO
    • H01L29/861G02F1/1365H01G11/48H01L51/05H01L51/42H01L51/50
    • H01L51/4273G02F1/1365H01L27/308H01L51/0081H01L51/0085H01L51/0587H01L2251/308Y02E10/549
    • Two-terminal electronic devices, such as photodetectors, photovoltaic devices and electroluminescent devices, are provided. The devices include a first electrode residing on a substrate, wherein the first electrode comprises a layer of metal; an I-layer comprising an inorganic insulating or broad band semiconducting material residing on top of the first electrode, and aligned with the first electrode, wherein the inorganic insulating or broad band semiconducting material is a compound of the metal of the first electrode; a semiconductor layer, preferably comprising a p-type semiconductor, residing over the I-layer; and a second electrode residing over the semiconductor layer, the electrode comprising a layer of a conductive material. The band gap of the material of the semiconductor layer, is preferably smaller than the band gap of the I-layer material. The band gap of the material of the I-layer is preferably greater than 2.5 eV.
    • 提供诸如光电探测器,光伏器件和电致发光器件的双端子电子器件。 该器件包括位于衬底上的第一电极,其中第一电极包括金属层; 包括位于所述第一电极顶部并与所述第一电极对齐的无机绝缘或宽带半导体材料的I层,其中所述无机绝缘或宽带半导体材料是所述第一电极的金属化合物; 位于I层之上的半导体层,优选地包括p型半导体; 以及位于半导体层上的第二电极,该电极包括一层导电材料。 半导体层的材料的带隙优选小于I层材料的带隙。 I层材料的带隙优选大于2.5eV。