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1. 发明授权

US11134564B1 Transparent PCB and method for manufacturing the same 有权
公开(公告)号：US11134564B1
公开(公告)日：2021-09-28
申请号：US17036544
申请日：2020-09-29
申请人： Avary Holding (Shenzhen) Co., Limited. , QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
发明人： Hsiao-Ting Hsu , Ming-Jaan Ho , Fu-Yun Shen , Li-Kun Liu
IPC分类号： H01K1/02 , H05K1/02 , H05K1/09 , H05K1/11 , H05K3/46 , H05K3/06 , H05K1/18 , H05K3/40 , H05K3/28 , H05K3/32
摘要： A transparent PCB includes a transparent base film, a hardened layer, an electrode film, a first conductive paste, a second conductive paste, and an electronic component. The hardened layer is formed on a side of the transparent base film. The electrode film is formed on a side of the hardened layer. The electrode film includes a first transparent conductive oxide layer, a metal layer, and a second transparent conductive oxide layer. The first conductive paste is formed on the electrode film. The second conductive paste is formed on the electrode film and spaced from the first conductive paste. The electronic component is electrically connected to the electrode film through the first conductive paste and the second conductive paste. The present invention also needs to provide a method for manufacturing the transparent PCB.

2. 发明授权

US11091095B2 Truck headlight circuit 有权
公开(公告)号：US11091095B2
公开(公告)日：2021-08-17
申请号：US16158058
申请日：2018-10-11
申请人： YourTruckShop Inc.
发明人： Rick Merovitz , David Merovitz
IPC分类号： B60Q11/00 , B60Q1/04 , F21S41/141 , F21Y115/10 , H05B45/3574 , H05B45/50 , H01K1/02 , F21S41/162 , F21S41/663
摘要： In replacing stock headlights on certain trucks with new Light Emitting Diode (LED) lights, the onboard diagnostic system of the trucks do not read sufficient load resistance from the new lights and so the diagnostic system indicates that there is an issue with the lighting system and consequently limits the functionality of the lighting system. The present application seeks to provide a solution to this problem by creating a headlight adapter that integrates components for imitating the load resistance and switching functions of Original Equipment Manufacturer (OEM) truck headlights (the “Headlight Adapter ”).

3. 发明授权

US10658608B2 Method and device for coupling multiple ground planes 有权
公开(公告)号：US10658608B2
公开(公告)日：2020-05-19
申请号：US15792050
申请日：2017-10-24
申请人： Intel Corporation
发明人： Douglas G. Bennett
IPC分类号： H01K1/02 , H01L51/52 , H01L51/56 , H05K1/02 , H01R12/71 , H01R13/648 , H05K3/32 , H01R4/48 , H01R12/57 , H01L27/32 , H01R12/52 , H01R13/24 , H01L23/00 , H01R101/00
摘要： Generally, this disclosure provides systems, devices and methods for improved electrical coupling of multiple ground planes of a device. The device may include a plurality of ground planes and an electrically conductive ground clip. The ground clip may include a base portion configured to secure the ground clip to the device and a plurality of spring fingers. Each of the spring fingers may be configured to contact and electrically couple to one of the plurality of ground planes, wherein the ground clip is to provide a conduction path between each of the spring fingers. One of the spring fingers may pass through an opening or cut-through in a first ground plane to contact a second ground plane. The device may be a mobile communication or computing platform.

4. 发明授权

US10440813B1 Microelectronic modules including thermal extension levels and methods for the fabrication thereof 有权
公开(公告)号：US10440813B1
公开(公告)日：2019-10-08
申请号：US16022125
申请日：2018-06-28
申请人： NXP USA, INC.
发明人： Lu Li , Elie A. Maalouf , Lakshminarayan Viswanathan , Mahesh K. Shah
IPC分类号： H01K1/02 , H05K1/02 , H05K1/14 , H05K1/11 , H05K3/00 , H05K3/36 , H01L23/367 , H01L23/495 , H01L21/48 , H01L23/00 , H01L25/16 , H05K1/18
摘要： High thermal performance microelectronic modules containing thermal extension levels are provided, as are methods for fabricating such microelectronic modules. In various embodiments, the microelectronic module includes a module substrate having a substrate frontside and a substrate backside. At least one a microelectronic device, such as a semiconductor die bearing radio frequency circuitry, is mounted to the substrate frontside. A substrate-embedded heat spreader, which is thermally coupled to the microelectronic device, is at least partially contained within the module substrate, and extends to the substrate backside. A thermal extension level is located adjacent the substrate backside and extends away from the substrate backside to terminate at a module mount plane. The thermal extension level contains a heat spreader extension, which is bonded to and in thermal communication with the substrate-embedded heat spreader.

5. 发明授权

US09966246B2 Double-filament incandescent lamp for automotive vehicle front lighting 有权
公开(公告)号：US09966246B2
公开(公告)日：2018-05-08
申请号：US14891316
申请日：2014-04-30
申请人： KONINKLIJKE PHILIPS N.V.
发明人： Bernd Schoenfelder , Johannes Gerhard Moeller
IPC分类号： H01K1/26 , H01K1/02 , H01K9/08 , H01K1/50
CPC分类号： H01K1/26 , F21S41/164 , H01K1/02 , H01K1/50 , H01K9/08
摘要： A lamp for automotive vehicle front lighting is described. The lamp 10 comprises a base 12 for mechanical and electrical connection to an automotive headlight 50 and a burner 14 fixed to the base 12. The burner 14 comprises an enclosed transparent vessel 22. A first and a second filament 34, 36 are arranged within the vessel 22. A baffle 40 is arranged proximate to the first filament 34 to shield the second filament 36 from the first filament 34. When the first filament 34 is operated at a supply voltage of 13.2 V at an electrical power greater than 35 W and less than or equal to 38 W, light with a luminous flux of 500-700 lm is emitted from the lamp 10. If the second filament 36 is operated at a supply voltage of 13.2 V at an electrical power greater than 35 W and less than or equal to 38 W, light with a luminous flux of 800-1,000 lm is emitted from the lamp 10. Both the first and the second filament wire 34, 36 are comprised of a filament wire wound in a winding structure around a filament axis, where the number of winding turns for each of first and second filaments 34, 36 is 16-23.

6. 发明授权

US09049793B2 Multi-piece-array and method of manufacturing the same 有权
标题翻译：多件阵列及其制造方法
公开(公告)号：US09049793B2
公开(公告)日：2015-06-02
申请号：US13876670
申请日：2011-09-30
申请人： Yoshitaka Yoshida , Hiroaki Yamamoto
发明人： Yoshitaka Yoshida , Hiroaki Yamamoto
IPC分类号： H01K1/02 , H05K1/03 , H05K3/00 , B32B3/30
CPC分类号： H05K1/0306 , B32B3/30 , H05K1/09 , H05K3/00 , H05K3/0052 , H05K3/0097 , H05K2201/09036 , H05K2201/0909 , H05K2201/09154 , H05K2201/09863 , Y10T156/10 , Y10T428/15
摘要： A multi-piece-array formed by laminating a plurality of ceramic layers includes: a product region where a plurality of wiring board portions having a rectangular shape in plan view and including cavities are arranged in matrix; a redundant portion that is positioned along a periphery of the product region; and dividing grooves that are formed on a front surface and/or a back surface along a boundary between the wiring board portions and a boundary between the wiring board portion and the redundant portion. A deepest portion of the dividing groove has an arc shape and the dividing groove includes a middle portion, and a width of the deepest portion is greater than a width of the groove inlet and a width of the middle portion is equal to or less than the width of the groove inlet.
摘要翻译：通过层叠多个陶瓷层而形成的多片阵列包括：在平面图中具有矩形形状并且包括空腔的多个布线板部分以矩阵布置的产品区域; 沿着产品区域的周边定位的冗余部分; 以及沿着布线板部分之间的边界和布线板部分和冗余部分之间的边界形成在前表面和/或后表面上的划分凹槽。分隔槽的最深部分具有弧形，分隔槽包括中间部分，并且最深部分的宽度大于沟槽入口的宽度，并且中间部分的宽度等于或小于槽入口宽度。

7. 发明授权

US08183756B2 Thermionic electron emitter, method for preparing same and X-ray source including same 有权
标题翻译：热电子发射体，其制备方法和包括其的X射线源
公开(公告)号：US08183756B2
公开(公告)日：2012-05-22
申请号：US12670133
申请日：2008-07-18
申请人： Zoryana Terletska , Stefan Hauttmann
发明人： Zoryana Terletska , Stefan Hauttmann
IPC分类号： H01J1/15 , H01J19/08 , H01K1/02
CPC分类号： H01J35/06 , H01J1/13 , H01J1/14 , H01J9/04 , H01J9/042
摘要： A thermionic electron emitter (1) is proposed comprising an emitter part (2) with a substantially flat electron emission surface (3) and a bordering surface (5) adjacent thereto. In order to better absorb main stress loads (L) induced by external forces, the emitter part is provided with an anisotropic polycrystalline material having a crystal grain structure of elongated interlocked grains the longitudinal direction (G) of which is oriented substantially perpendicular to the direction (L) of the main stress loads occurring under normal operating conditions.
摘要翻译：提出了一种热离子电子发射体（1），其包括具有基本上平坦的电子发射表面（3）的发射极部分（2）和与其相邻的边界表面（5）。为了更好地吸收由外力引起的主应力负荷（L），发射器部分设置有具有细长互锁晶粒的晶粒结构的各向异性多晶材料，其纵向方向（G）基本上垂直于方向（L）在正常工作条件下发生的主应力负荷。

8. 发明申请

US20070284988A1 FLAT ELECTRODE, ULTRA THIN SURFACE LIGHT SOURCE DEVICE AND BACKLIGHT UNIT HAVING THE SAME 审中-公开
标题翻译：平面电极，超薄表面光源装置和具有相同功能的背光单元
公开(公告)号：US20070284988A1
公开(公告)日：2007-12-13
申请号：US11684531
申请日：2007-03-09
申请人： Kyeong Taek JUNG , Hyung Bin Youn , Seok Mo Ban , Dai Hong Jung , Ki Yeon Lee , Keun Seok Lee , Dong Hee Lee , Eun Sook Kwon
发明人： Kyeong Taek JUNG , Hyung Bin Youn , Seok Mo Ban , Dai Hong Jung , Ki Yeon Lee , Keun Seok Lee , Dong Hee Lee , Eun Sook Kwon
IPC分类号： H01K1/02
CPC分类号： H01J65/046 , H01J61/305
摘要： There is provided a flat electrode for a surface light source, in which a conductive electrode is formed in a fine strip-shaped pattern on a plane. The flat electrode may comprise a base layer, an electrode pattern formed on the base layer, and a protection layer formed on the electrode pattern. There is also provided an ultra thin surface light source device which comprises: a first substrate and a second substrate which are spaced apart from each other at a predetermined interval; and a first surface electrode formed on the first substrate, and a second surface electrode formed on the second substrate. The surface light source device may further comprise a medium layer formed in at least one of spaces between the first substrate and the first surface electrode and between the second substrate and the second surface electrode.
摘要翻译：提供了一种用于表面光源的平面电极，其中导电电极在平面上形成为细小的带状图案。扁平电极可以包括基底层，形成在基底层上的电极图案，以及形成在电极图案上的保护层。还提供了一种超薄表面光源装置，其包括：以预定间隔彼此间隔开的第一基板和第二基板; 以及形成在第一基板上的第一表面电极和形成在第二基板上的第二表面电极。表面光源装置还可以包括形成在第一基板和第一表面电极之间以及第二基板和第二表面电极之间的至少一个空间中的介质层。

9. 发明申请

US20050133926A1 METALLIC PHOTONIC BOX AND ITS FABRICATION TECHNIQUES 有权
标题翻译：金属光电箱及其制造技术
公开(公告)号：US20050133926A1
公开(公告)日：2005-06-23
申请号：US10746908
申请日：2003-12-23
申请人： Ching-Fuh Lin , Cha-Hsin Chao
发明人： Ching-Fuh Lin , Cha-Hsin Chao
IPC分类号： G02B6/12 , F21K99/00 , H01J65/00 , H01K1/00 , H01K1/02 , H01K3/02 , H01L23/48 , H01S3/08 , H01S3/095
CPC分类号： H01K3/02 , H01K1/02
摘要： A metallic photonic box capable of intensifying light at a certain wavelength, includes: a metallic surrounding forming a resonance chamber; and an insulator layer, disposed in the resonance chamber, having a predetermined dimension defining a cut-off wavelength, which inhibits light of a wavelength greater than the cut-off wavelength from resonating, whereby when the metallic photonic box is heated to generate light radiation, the light radiation is intensified at a wavelength rage predetermined by the cut-off wavelength.
摘要翻译：能够增强一定波长的光的金属光子盒包括：形成谐振室的金属环绕; 以及设置在共振室中的具有限定截止波长的预定尺寸的绝缘体层，其阻止大于截止波长的波长的光谐振，由此当金属光子盒被加热以产生光辐射，光辐射在以截止波长预定的波长范围内增强。

10. 发明申请

US20050093420A1 Spurred light source lead wire for handling and for assembling with a filament 审中-公开
标题翻译：用于处理和组装灯丝的光源引线
公开(公告)号：US20050093420A1
公开(公告)日：2005-05-05
申请号：US10701832
申请日：2003-11-05
申请人： Elmer Fridrich
发明人： Elmer Fridrich
IPC分类号： H01J1/16 , H01J19/10 , H01K1/02 , H01K1/14 , H01K1/40 , H01K3/06
CPC分类号： H01K3/06 , H01K1/02 , H01K1/40
摘要： Manufacturing equipment and manufacturing process steps that improve upon prior art processes for the manufacturing of filament tube and arc tube light sources, their components and subassemblies, and lamps employing said light sources. A double ended, tipless filament tube or arc tube light source incorporates a drawn-down tubular body, and one piece foliated leads with spurs for process handling and for spudding into a filament with stretched-out legs. Bugled ends on the body provide a novel cutoff means, facilitate a flush-fill finishing process, and enhance mounting and support of the light sources in lamps. The foliated leads are made from a continuous length of wire in a process including foil hammering and two-bath AC electrochemical etching. Cost-reduced light source and lamp production enables affordable household consumer lamps, even when containing two series-connected halogen filament tubes. Safety benefits ensue from series connection, especially in combination with disclosed body and filament constructions.
摘要翻译：制造设备和制造工艺步骤，其改进了用于制造灯丝管和电弧管光源，其部件和子组件的现有技术方法以及采用所述光源的灯。双头，无头的灯丝管或电弧管光源包括一个拉制的管状体，一个单一的叶片引线具有用于过程处理的刺激，并且用于伸展成具有伸展腿的细丝。身体上的穿刺端部提供了一种新颖的切割装置，便于冲洗填充整理过程，并且增强灯中光源的安装和支撑。叶片引线由连续长度的线材制成，包括箔锤击和双浴AC电化学蚀刻。成本降低的光源和灯具生产使家庭消费者能够负担得起的家用电器，即使包含两个串联的卤素灯丝管。串联连接的安全优势，特别是结合公开的主体和灯丝结构。

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