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1. 发明公开

US20230357945A1 CYANIDE-BASED SILVER ALLOY ELECTROPLATING SOLUTION 审中-公开
公开(公告)号：US20230357945A1
公开(公告)日：2023-11-09
申请号：US18041624
申请日：2021-08-17
申请人： EEJA LTD.
发明人： Masato ISEKI
IPC分类号： C25D3/64
CPC分类号： C25D3/64
摘要： The present invention provides a cyanide-based silver alloy electroplating solution characterized by containing 10 to 100 g/L of silver cyanide complex in terms of silver, 5 to 300 g/L of electroconductive salt, 0.1 to 10 g/L of germanium compound in terms of germanium, and 1 to 100 g/L of a coordinating polymer additive.

2. 发明授权

US11643742B2 Silver/tin electroplating bath and method of using the same 有权
公开(公告)号：US11643742B2
公开(公告)日：2023-05-09
申请号：US17591071
申请日：2022-02-02
申请人： MacDermid Enthone Inc.
发明人： Fengting Xu , Jean W. Chevalier , Ernest Long , Richard A. Bellemare , Michael M. Ryl
IPC分类号： C25D3/64 , C25D3/32 , C25D3/12 , C25D3/46 , C25D5/12 , H01R43/26
CPC分类号： C25D3/46 , C25D3/32 , C25D3/64 , C25D5/12 , H01R43/26
摘要： An electroplating bath for depositing a silver/tin alloy on a substrate. The electroplating bath comprises (a) a source of tin ions; (b) a source of silver ions; (c) an acid; (d) a first complexing agent; (e) a second complexing agent, wherein the second complexing agent is selected from the group consisting of allyl thioureas, aryl thioureas, and alkyl thioureas, and combinations thereof; and (f) optionally, a wetting agent, and (g) optionally, an antioxidant.

3. 发明申请

US20220205122A1 Electrolyte for the Cyanide-Free Deposition of Silver 有权
公开(公告)号：US20220205122A1
公开(公告)日：2022-06-30
申请号：US17260090
申请日：2019-08-20
申请人： Umicore Galvanotechnik GmbH
发明人： Sascha Berger , Klaus Bronder , Mario Tomazzoni , Uwe Manz
IPC分类号： C25D3/46 , C25D21/12 , C25D17/10 , C07D233/74 , C25D3/64
摘要： The present invention relates to an electrolyte and to a method for the electrolytic deposition of silver coatings and silver alloy coatings. The electrolyte according to the invention is cyanide-free, storage-stable and ensures the deposition of high-gloss, brilliant and white silver and silver alloy layers for technical and decorative applications.

4. 发明授权

US10305210B2 Terminal plating material, and terminal, terminal-equipped electric wire and wire harness using the same 有权
公开(公告)号：US10305210B2
公开(公告)日：2019-05-28
申请号：US15877449
申请日：2018-01-23
申请人： YAZAKI CORPORATION
发明人： Nobuyuki Tamura , Hayato Ikeya , Shinobu Kayama
IPC分类号： C22C5/06 , C25D3/46 , C25D3/64 , C25D7/00 , H01R13/03 , C25D7/06 , H01R4/18 , C25D3/12 , C25D5/12
摘要： A terminal plating material includes a metal substrate, and a silver-tin alloy plating layer containing a silver-tin alloy, arranged on the metal substrate. The silver-tin alloy plating layer contains an intermetallic compound of silver and tin, the Vickers hardness of the surface of the silver-tin alloy plating layer in the terminal plating material is 250 Hv or more, and the surface roughness of the silver-tin alloy plating layer is 0.60 μmRa or less. Further, a terminal is formed from the terminal plating material. A terminal-equipped electric wire includes the terminal. A wire harness includes the terminal-equipped electric wire.

5. 发明申请

US20190071789A1 ADDITIVE FOR SILVER-PALLADIUM ALLOY ELECTROLYTES 审中-公开
公开(公告)号：US20190071789A1
公开(公告)日：2019-03-07
申请号：US15767234
申请日：2016-10-19
申请人： UMICORE GALVANOTECHNIK GMBH
发明人： Bernd WEYHMUELLER , Alexander PETERS , Uwe MANZ
IPC分类号： C25D3/64
摘要： The present invention relates to an electrolyte containing suitable reducing agents for adjusting the composition of silver-palladium layers. Furthermore, these reducing agents contribute to improving the layer appearance and to increasing the luminance (L value, CIE Lab) of the deposited layers. The present invention also discloses a method for the electrolytic deposition of silver-rich silver-palladium alloys. The alloys can be deposited on conductive surfaces over a wide current density range.

6. 发明申请

US20180163315A1 COATED ARTICLES, ELECTRODEPOSITION BATHS, AND RELATED SYSTEMS 审中-公开
公开(公告)号：US20180163315A1
公开(公告)日：2018-06-14
申请号：US15711210
申请日：2017-09-21
申请人： Xtalic Corporation
发明人： Nazila Dadvand , John D'Urso , Jonathan C. Trenkle , Alan C. Lund , John Cahalen
IPC分类号： C25D3/64
CPC分类号： C25D3/64
摘要： Coated articles, electrodeposition baths, and related systems are described. The article may include a base material and a coating comprising silver formed thereon. In some embodiments, the coating comprises a silver-based alloy, such as a silver-tungsten alloy. The coating can exhibit desirable properties and characteristics such as durability (e.g., wear), hardness, corrosion resistance, and high conductivity, which may be beneficial, for example, in electrical and/or electronic applications. In some cases, the coating may be applied using an electrodeposition process.

7. 发明申请

US20140318982A1 METHOD FOR PREPARING TIN-SILVER ALLOY PLATING SOLUTION AND PLATING SOLUTION PREPARED BY SAME 有权
标题翻译：制备锡银合金溶液的方法及其制备的镀层溶液
公开(公告)号：US20140318982A1
公开(公告)日：2014-10-30
申请号：US14363225
申请日：2012-12-06
申请人： Dong Hyun KIM , Tae Jo BANG , MSC CO., LTD. , S&S CHEM CO., LTD.
发明人： Dong Hyun Kim , Tae Jo Bang , Jeong Hun Oh , Jin Ho Son , Hong Ki Kim , Jeong Dae Kim , Jeong Nan Yuk
IPC分类号： C25D3/56 , C25D3/64 , C25D3/60
CPC分类号： C25D3/56 , C25D3/60 , C25D3/64 , C25D21/12
摘要： A method is described of preparing a tin-silver (Sn—Ag) alloy plating solution containing methanesulfonic acid tin, methanesulfonic acid silver, methanesulfonic acid, and an additive, wherein the method includes: (a) eliminating impurities such as released chloride compounds and released sulfur compounds, which are present in the methanesulfonic acid, (b) preparing the methanesulfonic acid tin and the methanesulfonic acid silver by dissolving, through an electrolytic process, tin and silver in the methanesulfonic acid from which the impurities are eliminated; (c) producing a mixture solution by adding the methanesulfonic acid, the methanesulfonic acid tin, the methanesulfonic acid silver, and the additive; and (d) filtering the mixture solution. And by the method thereof, current efficiency may be increased and a desirable plating film may be maintained by eliminating the impurities from the methanesulfonic acid used as a base material and preparing the Sn—Ag alloy plating solution.
摘要翻译：描述了制备含有甲磺酸锡，甲磺酸银，甲磺酸和添加剂的锡 - 银（Sn-Ag）合金电镀溶液的方法，其中所述方法包括：（a）除去杂质如脱离氯化物化合物和存在于甲磺酸中的释放的硫化合物，（b）通过电解方法将除去杂质的甲磺酸中的锡和银溶解制备甲磺酸锡和甲磺酸银; （c）通过加入甲磺酸，甲磺酸锡，甲磺酸银和添加剂制备混合溶液; 和（d）过滤混合物溶液。并且通过其方法，可以提高电流效率，并且可以通过从用作基材的甲磺酸中除去杂质并制备Sn-Ag合金电镀溶液来保持所需的镀膜。

8. 发明授权

US07938948B2 Silver and silver alloy plating bath 有权
标题翻译：银和银合金电镀浴
公开(公告)号：US07938948B2
公开(公告)日：2011-05-10
申请号：US12553731
申请日：2009-09-03
申请人： Kiyotaka Tsuji , Tetsuji Nishikawa , Takao Takeuchi , Keigo Obata , Hidemi Nawafune
发明人： Kiyotaka Tsuji , Tetsuji Nishikawa , Takao Takeuchi , Keigo Obata , Hidemi Nawafune
IPC分类号： C25D3/46 , C25D3/64 , C23C18/31
CPC分类号： C25D3/46 , C25D3/64
摘要： To develop stable, non-cyanide silver and silver alloy plating baths. The present invention is a silver and silver alloy plating bath, comprises: (A) a soluble salt, comprising a silver salt or a mixture of a silver salt and a salt of a metal selected from the group consisting of tin, bismuth, cobalt, antimony, iridium, indium, lead, copper, iron, zinc, nickel, palladium, platinum, and gold; and (B) at least one aliphatic sulfide compound comprising a functionality selected from the group consisting of an ether oxygen atom, a 3-hydroxypropyl group, and a hydroxypropylene group, with the proviso that the aliphatic sulfide compound does not comprise a basic nitrogen atom.
摘要翻译：开发稳定的非氰化银和银合金电镀浴。本发明是一种银和银合金电镀液，包括：（A）可溶性盐，其包含银盐或银盐和选自锡，铋，钴等的金属盐的混合物，锑，铱，铟，铅，铜，铁，锌，镍，钯，铂和金; 和（B）至少一种包含选自醚氧原子，3-羟基丙基和羟基亚丙基的官能团的脂族硫化物，条件是脂族硫化物不包含碱性氮原子。

9. 发明申请

US20090321269A1 SILVER AND SILVER ALLOY PLATING BATH 有权
标题翻译：银和银合金镀锌浴
公开(公告)号：US20090321269A1
公开(公告)日：2009-12-31
申请号：US12553731
申请日：2009-09-03
申请人： Kiyotaka TSUJI , Tetsuji NISHIKAWA , Takao TAKEUCHI , Keigo OBATA , Hidemi NAWAFUNE
发明人： Kiyotaka TSUJI , Tetsuji NISHIKAWA , Takao TAKEUCHI , Keigo OBATA , Hidemi NAWAFUNE
IPC分类号： C25D3/64 , C25D3/46
CPC分类号： C25D3/46 , C25D3/64
摘要： To develop stable, non-cyanide silver and silver alloy plating baths. The present invention is a silver and silver alloy plating bath, comprises: (A) a soluble salt, comprising a silver salt or a mixture of a silver salt and a salt of a metal selected from the group consisting of tin, bismuth, cobalt, antimony, iridium, indium, lead, copper, iron, zinc, nickel, palladium, platinum, and gold; and (B) at least one aliphatic sulfide compound comprising a functionality selected from the group consisting of an ether oxygen atom, a 3-hydroxypropyl group, and a hydroxypropylene group, with the proviso that the aliphatic sulfide compound does not comprise a basic nitrogen atom.
摘要翻译：开发稳定的非氰化银和银合金电镀浴。本发明是一种银和银合金电镀液，包括：（A）可溶性盐，其包含银盐或银盐和选自锡，铋，钴等的金属盐的混合物，锑，铱，铟，铅，铜，铁，锌，镍，钯，铂和金; 和（B）至少一种包含选自醚氧原子，3-羟基丙基和羟基亚丙基的官能团的脂族硫化物，条件是脂族硫化物不包含碱性氮原子。

10. 发明申请

US20050077186A1 Electrolysis bath for electrodepositing silver-tin alloys 审中-公开
标题翻译：用于电沉积银 - 锡合金的电解浴
公开(公告)号：US20050077186A1
公开(公告)日：2005-04-14
申请号：US10495771
申请日：2002-11-06
申请人： Christian Hansen , Volkmar Sommer , Marc De Vogelaere
发明人： Christian Hansen , Volkmar Sommer , Marc De Vogelaere
IPC分类号： C25D3/60 , C25D3/64 , C25D3/46
CPC分类号： C25D3/60
摘要： The invention relates to an electrolysis bath for electrodepositing silver-tin alloys that, in addition to water serving as a solvent with a pH value of less than 1.5, contains a water-soluble silver compound, a water-soluble tin compound and an organic complexing agent. In order to obtain a stable electrolysis bath that enables the homogenous deposition of a compact tin-silver alloy with any type of composition, an aliphatic complexing agent having a sulfide group and an amino group is used as a complexing agent, whereby the functional groups are bound to different carbon atoms.
摘要翻译：本发明涉及一种电沉积银 - 锡合金的电解槽，除了作为pH值小于1.5的溶剂的水外，还含有水溶性银化合物，水溶性锡化合物和有机络合物代理商为了获得能够均匀沉积任何类型组合物的紧密的锡 - 银合金的稳定的电解槽，使用具有硫醚基和氨基的脂族络合剂作为络合剂，由此官能团为结合不同的碳原子。

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