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1. 发明授权

US09657403B2 Method for preparing tin-silver alloy plating solution and plating solution prepared by same 有权
公开(公告)号：US09657403B2
公开(公告)日：2017-05-23
申请号：US14363225
申请日：2012-12-06
申请人： MSC CO., LTD. , S&S CHEM CO., LTD. , Dong Hyun Kim , Tae Jo Bang
发明人： Dong Hyun Kim , Tae Jo Bang , Jeong Hun Oh , Jin Ho Son , Hong Ki Kim , Jeong Dae Kim , Jeong Nan Yuk
IPC分类号： C25D3/56 , C25D3/60 , C25D3/64 , C25D21/12
CPC分类号： C25D3/56 , C25D3/60 , C25D3/64 , C25D21/12
摘要： A method is described of preparing a tin-silver (Sn—Ag) alloy plating solution containing methanesulfonic acid tin, methanesulfonic acid silver, methanesulfonic acid, and an additive, wherein the method includes: (a) eliminating impurities such as released chloride compounds and released sulfur compounds, which are present in the methanesulfonic acid, (b) preparing the methanesulfonic acid tin and the methanesulfonic acid silver by dissolving, through an electrolytic process, tin and silver in the methanesulfonic acid from which the impurities are eliminated; (c) producing a mixture solution by adding the methanesulfonic acid, the methanesulfonic acid tin, the methanesulfonic acid silver, and the additive; and (d) filtering the mixture solution. And by the method thereof, current efficiency may be increased and a desirable plating film may be maintained by eliminating the impurities from the methanesulfonic acid used as a base material and preparing the Sn—Ag alloy plating solution.

2. 发明申请

US20140318982A1 METHOD FOR PREPARING TIN-SILVER ALLOY PLATING SOLUTION AND PLATING SOLUTION PREPARED BY SAME 有权
标题翻译：制备锡银合金溶液的方法及其制备的镀层溶液
公开(公告)号：US20140318982A1
公开(公告)日：2014-10-30
申请号：US14363225
申请日：2012-12-06
申请人： Dong Hyun KIM , Tae Jo BANG , MSC CO., LTD. , S&S CHEM CO., LTD.
发明人： Dong Hyun Kim , Tae Jo Bang , Jeong Hun Oh , Jin Ho Son , Hong Ki Kim , Jeong Dae Kim , Jeong Nan Yuk
IPC分类号： C25D3/56 , C25D3/64 , C25D3/60
CPC分类号： C25D3/56 , C25D3/60 , C25D3/64 , C25D21/12
摘要： A method is described of preparing a tin-silver (Sn—Ag) alloy plating solution containing methanesulfonic acid tin, methanesulfonic acid silver, methanesulfonic acid, and an additive, wherein the method includes: (a) eliminating impurities such as released chloride compounds and released sulfur compounds, which are present in the methanesulfonic acid, (b) preparing the methanesulfonic acid tin and the methanesulfonic acid silver by dissolving, through an electrolytic process, tin and silver in the methanesulfonic acid from which the impurities are eliminated; (c) producing a mixture solution by adding the methanesulfonic acid, the methanesulfonic acid tin, the methanesulfonic acid silver, and the additive; and (d) filtering the mixture solution. And by the method thereof, current efficiency may be increased and a desirable plating film may be maintained by eliminating the impurities from the methanesulfonic acid used as a base material and preparing the Sn—Ag alloy plating solution.
摘要翻译：描述了制备含有甲磺酸锡，甲磺酸银，甲磺酸和添加剂的锡 - 银（Sn-Ag）合金电镀溶液的方法，其中所述方法包括：（a）除去杂质如脱离氯化物化合物和存在于甲磺酸中的释放的硫化合物，（b）通过电解方法将除去杂质的甲磺酸中的锡和银溶解制备甲磺酸锡和甲磺酸银; （c）通过加入甲磺酸，甲磺酸锡，甲磺酸银和添加剂制备混合溶液; 和（d）过滤混合物溶液。并且通过其方法，可以提高电流效率，并且可以通过从用作基材的甲磺酸中除去杂质并制备Sn-Ag合金电镀溶液来保持所需的镀膜。

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