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    • 2. 发明公开
    • IMAGING ELEMENT, IMAGING DEVICE, AND METHOD OF MANUFACTURING IMAGING ELEMENT
    • US20240297202A1
    • 2024-09-05
    • US18251630
    • 2021-11-04
    • SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    • YILUN HETAKASHI MACHIDA
    • H01L27/148H01L27/146H04N25/62
    • H01L27/14818H01L27/14689H04N25/62
    • To prevent leakage of incident light to a charge holding unit of an imaging element. The pixel includes a photoelectric conversion unit disposed on a side of the light receiving face of the semiconductor substrate, a charge holding unit disposed on a side different from the light receiving face of the semiconductor substrate, and a charge transfer unit that transfers a charge to the charge holding unit, and is configured to have a rectangular shape in a light receiving face view. The charge holding unit light shielding film is configured to have a band shape adjacent to three sides including a first side that is one of the sides of the rectangle and parallel to the first side in a light receiving face view, is adjacent to a semiconductor region including the charge transfer unit in a light receiving face view, and is disposed in the pixel between the photoelectric conversion unit and the charge holding unit to shield incident light. The charge transfer unit light shielding film is configured to have a band shape adjacent to three sides including a second side that is a side facing the first side in a light receiving face view and parallel to the second side, and is configured to be disposed in the pixel between the photoelectric conversion unit and the charge transfer unit to shield incident light and have a shape which has an end portion overlapping an end portion of the charge holding unit light shielding film in a light receiving face view.