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    • 2. 发明授权
    • Capacitor for semiconductor device and fabrication method thereof
    • 半导体器件用电容器及其制造方法
    • US06373083B1
    • 2002-04-16
    • US09392632
    • 1999-09-09
    • Bo-Seok Oh
    • Bo-Seok Oh
    • H01L2932
    • H01L27/0805
    • A capacitor having variable capacitance for a semiconductor device is formed on a device isolation area. A trench is formed in a semiconductor substrate for device isolation and a device isolating insulating film in which a bottom electrode of the capacitor is buried is formed in the trench. A first dielectric film is formed on the buried bottom electrode, a middle electrode is formed thereon and a second dielectric film and a top electrode are formed on the middle electrode, thereby having a three-layer electrode structure. The capacitor according to the present invention has variable capacitance in accordance with a voltage applied to top, bottom and middle electrodes, respectively.
    • 在器件隔离区域上形成具有用于半导体器件的可变电容的电容器。 在用于器件隔离的半导体衬底中形成沟槽,并且在沟槽中形成其中埋入电容器的底部电极的器件隔离绝缘膜。 在掩埋底部电极上形成第一电介质膜,在其上形成中间电极,在中间电极上形成第二电介质膜和顶部电极,由此具有三层电极结构。 根据本发明的电容器分别根据施加到顶部,底部和中间电极的电压具有可变电容。