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    • 3. 发明授权
    • Method of fabricating a semiconductor light-emitting device and the semiconductor light-emitting device
    • 制造半导体发光器件和半导体发光器件的方法
    • US06633054B2
    • 2003-10-14
    • US09789560
    • 2001-02-22
    • Shoji HirataHironobu Narui
    • Shoji HirataHironobu Narui
    • H01L29221
    • H01S5/164H01L33/0062H01S5/0207H01S5/1064H01S5/2081
    • A method of fabricating a semiconductor light-emitting device in which the window structure can readily be obtained without relying upon an advanced process technology. In the method of the present invention, a first multi-layered film formed on a substrate is patterned into a groove pattern having a widened portion and narrowed portions provided on both sides of such widened portion. A second multi-layered film is then epitaxially grown on the substrate so as to cover the groove pattern, by successively growing an n-type second lower clad layer, a second active layer, a p-type second upper clad layer and a p-type cap layer. The cap layer is then patterned to thereby form a current injection layer on the second multi-layered film within the groove pattern so as to be extended along the longitudinal direction of such groove pattern.
    • 一种制造半导体发光器件的方法,其中可以在不依赖于先进工艺技术的情况下容易地获得窗户结构。 在本发明的方法中,将形成在基板上的第一多层膜图案化成具有加宽部分和设置在这种加宽部分的两侧上的变窄部分的凹槽图案。 然后通过依次生长n型第二下包层,第二有源层,p型第二上覆层和p型第二上包覆层,在衬底上外延生长第二多层膜,以覆盖沟槽图案。 盖帽层。 然后对盖层进行图案化,从而在凹槽图案内的第二多层膜上形成电流注入层,以沿着这种凹槽图案的纵向方向延伸。
    • 4. 发明授权
    • Semiconductor light emitting device
    • 半导体发光器件
    • US06603147B1
    • 2003-08-05
    • US09587254
    • 2000-06-02
    • Shigeki HashimotoKatsunori YanashimaMasao IkedaHiroshi Nakajima
    • Shigeki HashimotoKatsunori YanashimaMasao IkedaHiroshi Nakajima
    • H01L29221
    • H01L33/32H01S5/20H01S5/2004H01S5/3211H01S5/32341
    • A semiconductor light emitting device using nitride III-V compound semiconductors is improved to reduce the threshold current density with almost no increase of the operation voltage. In a GaN semiconductor laser as one version thereof, the p-type cladding layer is made of two or more semiconductor layers different in band gap, and a part of the p-type cladding layer near one of its boundaries nearer to the active layer is made of a semiconductor layer having a large band gap than that of the remainder part. More specifically, in a AlGaN/GaN/GaInN SCH-structured GaN semiconductor laser, a p-type AlGaN cladding layer is made of a p-type Alx1Ga1−x1N layer in contact with a p-type GaN optical guide layer, and a p-type Alx2Ga1−x2N layer overlying the p-type Alx1Ga1−x1N layer (where 0≦x2
    • 改进了使用氮化物III-V化合物半导体的半导体发光器件,几乎不增加工作电压,从而降低阈值电流密度。 在作为其一个版本的GaN半导体激光器中,p型覆层由带隙不同的两个以上的半导体层构成,并且在靠近有源层的边界附近的p型覆层的一部分为 由具有比剩余部分大的带隙的半导体层制成。 更具体地,在AlGaN / GaN / GaInN SCH结构的GaN半导体激光器中,p型AlGaN包层由与p型GaN光导层接触的p型Al x Ga 1-x N层构成,p 型Alx2Ga1-x2N层,其中p型Alx1Ga1-x1N层(其中0 <= x2