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    • 1. 发明授权
    • Capacitor cooling arrangement
    • 电容冷却装置
    • US4947287A
    • 1990-08-07
    • US277945
    • 1988-11-30
    • Richard J. Hoppe
    • Richard J. Hoppe
    • H01G4/12H01C20060101H01G2/08H01G4/10H05K7/20
    • H01G2/08H01G4/12H01G4/30
    • A cooling arrangement is provided for capacitor chips (10) or a capacitor assembly (40). A metal foil (18,18',18",18'") is affixed to a chip (10) with electrical insulation therebetween. The foil (18,18',18",18'") has a free end extending beyond the capacitor periphery and transversely of the capacitor stack (13) and can be provided with an L-shaped end (21) or a tube heat exchanger (23) or a fin plate heat exchanger (24). An assembly (40) of capacitors (30 to 38) can be arranged between legs of U-shaped metal heat exchange members (25,26,27) which conduct heat from the capacitors (30 to 38) through the legs and to a coolplate (28) having a tube (29) for passage of coolant.
    • 为电容器芯片(10)或电容器组件(40)提供冷却装置。 金属箔(18,18',18“,18”')固定到芯片(10)上,其间具有电绝缘。 箔片(18,18',18“,18”)具有延伸超过电容器外围并横向于电容器叠层(13)的自由端,并且可以设置有L形端部(21)或 管式热交换器(23)或散热片热交换器(24)。 电容器(30至38)的组件(40)可以布置在U形金属热交换构件(25,26,27)的腿之间,U形金属热交换构件(25,26,27)从电容器(30至38)穿过支腿传导热量, (28)具有用于冷却剂通过的管(29)。