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    • 1. 发明授权
    • Radiation applying apparatus
    • 辐射施加装置
    • US06826254B2
    • 2004-11-30
    • US10285441
    • 2002-11-01
    • Kazumasa MiharaYuichiro KaminouAkira Ishibashi
    • Kazumasa MiharaYuichiro KaminouAkira Ishibashi
    • G21K500
    • H01J35/04A61B6/4429A61N5/01A61N5/10G21G1/12G21H5/02H01J2235/186
    • An x-ray treatment apparatus includes an x-ray generating device, a head unit, a manipulator and a microwave source. The x-ray generating device produces x-rays, by letting electrons, which have been emitted from an electron gun, be accelerated by a linear accelerator and strike a target. The acceleration of electrons is effected by microwaves. The x-ray generating device is accommodated in the head unit. The head unit is attached to a distal end portion of the manipulator. The manipulator positions the head unit such that x-rays emitted from the head unit may be applied to a part for medical treatment in a patient. The microwave source is disposed at a proximal end portion of the manipulator. Microwaves are propagated from the microwave source to the accelerator through a waveguide.
    • X射线治疗装置包括X射线产生装置,头部单元,机械手和微波源。 X射线产生装置通过使从电子枪发射的电子被线性加速器加速并产生目标而产生X射线。 电子的加速由微波进行。 X射线产生装置容纳在头单元中。 头单元附接到操纵器的远端部分。 操纵器定位头单元,使得从头单元发射的x射线可以施加到患者体内用于医疗的部件。 微波源设置在操纵器的近端部分。 微波通过波导从微波源传播到加速器。
    • 3. 发明授权
    • Exposing method and semiconductor device fabricated by the exposing method
    • 曝光方法和通过曝光方法制造的半导体器件
    • US06760400B2
    • 2004-07-06
    • US10211309
    • 2002-08-05
    • Hiroshi WatanabeToyoki KitayamaKouji Kise
    • Hiroshi WatanabeToyoki KitayamaKouji Kise
    • G21K500
    • G21K5/02G21K1/06
    • In an exposing method reflecting synchrotron radiation, having a critical wavelength of 8.46 Å, emitted from a radiation generator (SR device) having a deflecting magnetic field of 4.5 T and electron acceleration energy of 0.7 GeV twice through rhodium mirrors having an oblique-incidence angle of 1°, transmitting the light through a beryllium window of 20 &mgr;m and through an X-ray mask prepared by forming an X-ray absorber pattern on a diamond mask substrate of 2 &mgr;m in thickness and thereafter irradiating a resist surface provided on a substrate with the light, the resist has a main absorption waveband in the wave range of at least 3 Å and not more than 13 Å and contains an element generating Auger electrons having energy in the range of at least about 0.51 KeV and not more than 2.6 KeV upon exposure.
    • 在从具有4.5T的偏转磁场和0.7GeV的电子加速能量的辐射发生器(SR装置)发射的具有临时波长8.46的反射同步辐射的曝光方法中,通过具有倾斜入射角的铑镜 将光通过20μm的铍窗,并通过在2μm的金刚石掩模基板上形成X射线吸收体图案而制备的X射线掩模,然后照射设置在基板上的抗蚀剂表面 在光照下,抗蚀剂在至少为且不大于13的波长范围内具有主吸收波段,并且包含产生具有至少约0.51KeV且不大于2.6KeV的能量的俄歇电子的元件 曝光后
    • 6. 发明授权
    • Semiconductor manufacturing apparatus and semiconductor device manufacturing method
    • 半导体制造装置及半导体装置的制造方法
    • US06549608B1
    • 2003-04-15
    • US09538737
    • 2000-03-30
    • Takayoshi MamineNobuyuki MatsuzawaNoriyuki Kishii
    • Takayoshi MamineNobuyuki MatsuzawaNoriyuki Kishii
    • G21K500
    • G03F7/70008
    • To provide a semiconductor manufacturing apparatus and a semiconductor device manufacturing method able to form a sufficiently precise pattern by ablation. A semiconductor manufacturing apparatus comprising a light source emitting light of a first wavelength on the surface of a wafer and a mask through which at least a part of the light of the first wavelength passes and removing a material of the part of the wafer exposed by the light of the first wavelength by vaporization, wherein the light source comprises an electron beam generating means for generating an electron beam and a light emitting means for emitting light of a second wavelength longer than the first wavelength and wherein the light of the first wavelength is inverse Compton scattered light obtained by collision of electrons in the electron beam with photons in the light of the second wavelength causing the energy of the electrons to be given to the photons and a semiconductor device manufacturing method using the apparatus.
    • 1.一种半导体制造装置,其特征在于,具有通过烧蚀形成足够精细的图案的半导体制造装置和半导体装置的制造方法。1。一种半导体制造装置,其特征在于,包括在晶片表面上发射第一波长的光的光源和至少一个 第一波长的光的一部分通过蒸发而通过并除去由第一波长的光曝光的晶片的部分的材料,其中光源包括用于产生电子束的电子束产生装置和发光装置 用于发射比第一波长长的第二波长的光,其中第一波长的光是通过电子束中的电子与第二波长的光子碰撞而获得的康普顿散射光,导致电子的能量 给予光子和使用该设备的半导体器件制造方法 s。
    • 7. 发明授权
    • Laser plasma source for extreme ultraviolet lithography using a water droplet target
    • 激光等离子体源,用于使用水滴靶的极紫外光刻
    • US06377651B1
    • 2002-04-23
    • US09685291
    • 2000-10-10
    • Martin RichardsonGuido Shriever
    • Martin RichardsonGuido Shriever
    • G21K500
    • H05G2/003B82Y10/00G03F7/70033H05G2/008
    • A laser produced extreme ultraviolet (EUV) source based on a water droplet target has been implemented an auxiliary electrode system between the source and the first collector mirror. The auxiliary electrode system creates a repeller electric field, possibly a dc voltage imposed on the mirror that slows down and reverses the trajectories of ions from the source before they impact the collection mirror. The source modified according to the invention was evaluated with respect to the demands of EUV lithography and found to have much extended operational lifetimes. The spectral distribution of the generated radiation as well as the conversion efficiency into line radiation at 13 nm was determined. Long time measurements of the reflectivity of silicon/molybdenum multilayer mirrors for up to from 107 to 109 shots show the useful influence of the treatment of ions emitted from the source. Several methods of debris reduction were tested and discussed. Surface analysis of the treated multilayer mirrors of is presented. Long time measurements of the reflectivity of silicon/molybdenum multilayer mirrors for up to 109 shots show the advantage provided by this invention.
    • 基于水滴目标的激光产生极紫外(EUV)源已经实现了源和第一收集镜之间的辅助电极系统。 辅助电极系统产生排斥电场,可能是施加在反射镜上的直流电压,其在撞击收集反射镜之前减慢并反转来自源的离子轨迹。 根据本发明修改的源对EUV光刻的要求进行了评估,发现其寿命延长。 确定所产生的辐射的光谱分布以及在13nm处的线辐射的转换效率。 长时间测量硅/钼多层反射镜的反射率可达107至109次,显示了从源发射的离子的处理的有用影响。 测试和讨论了几种减少碎屑的方法。 提出了经处理的多层反射镜的表面分析。 长达109次的硅/钼多层反射镜的反射率的长时间测量显示了本发明提供的优点。