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    • 5. 发明申请
    • METHOD OF OPERATING A SEMICONDUCTOR MEMORY ARRAY OF FLOATING GATE MEMORY CELLS WITH BURIED BIT-LINE AND VERTICAL WORD LINE TRANSISTOR
    • 操作带有双向直线和垂直字线晶体管的闸门存储器电池的半导体存储器阵列的方法
    • US20040160824A1
    • 2004-08-19
    • US10776483
    • 2004-02-10
    • Sohrab KianianChih Hsin Wang
    • G11C016/04
    • H01L27/11521H01L27/115H01L29/42332H01L29/7885
    • A self aligned method of forming a semiconductor memory array of floating gate memory cells in a semiconductor substrate, and an array formed thereby, whereby each memory cell includes a trench formed into a surface of a semiconductor substrate, spaced apart source and drain regions with a channel region formed therebetween. The drain region is formed underneath the trench, and the channel region includes a first portion that extends substantially vertically along a sidewall of the trench and a second portion that extends substantially horizontally along the surface of the substrate. An electrically conductive floating gate is formed over and insulated from at least a portion of the channel region and a portion of the source region. An electrically conductive control gate is formed having a first portion disposed in the trench and a second portion formed over but insulated from the floating gate.
    • 一种在半导体衬底中形成浮置栅极存储单元的半导体存储器阵列的自对准方法,以及由此形成的阵列,由此每个存储单元包括形成在半导体衬底的表面中的沟槽,间隔开的源极和漏极区域具有 沟道区域之间形成。 漏极区域形成在沟槽下方,并且沟道区域包括沿着沟槽的侧壁基本垂直地延伸的第一部分和沿着衬底的表面基本水平延伸的第二部分。 导电浮栅形成在沟道区的至少一部分和源极区的一部分之上并与之绝缘。 导电控制栅极形成为具有设置在沟槽中的第一部分和形成在浮动栅极上但与浮动栅极绝缘的第二部分。
    • 6. 发明申请
    • Programmable semiconductor memory
    • 可编程半导体存储器
    • US20040156236A1
    • 2004-08-12
    • US10771320
    • 2004-02-05
    • Kabushiki Kaisha Toshiba
    • Fujio Masuoka
    • G11C016/04
    • H01L27/115G11C16/0483
    • Memory cells are divided into a plurality of series circuit units arranged in matrix fashion and comprising some memory cells connected in series. The memory cells each consist of non-volatile transistors provided with a control gate electrode, a floating gate electrode and an erase gate electrode. Bit lines to which one end of each of the series circuit units of the plurality of series circuit units arranged in one row are connected in common. Column lines are provided in common for the series circuit units that are arranged in one column and that are respectively connected to each control gate electrode of the memory cells constituting each of the series circuit unit. A voltage by which the selected non-volatile transistor works in a saturation state is applied to the control gate electrode of the selected transistor of a series circuit unit by a column line, thereby injecting hot electrons from the semiconductor substrate into the floating gate electrode. Another voltage by which the non-selected non-volatile transistor works in a non-saturation operation is applied to the gate electrodes of the remaining non-volatile transistors of the series circuit unit. By sequentially selecting memory cells in one series circuit unit, the sequential data writing operation is performed. The sequential data reading operation is performed in a similar manner.
    • 存储单元被分成以矩阵方式布置的多个串联电路单元,并且包括串联连接的一些存储器单元。 每个存储单元由设置有控制栅电极,浮栅电极和擦除栅电极的非易失性晶体管组成。 排列成一排的多个串联电路单元的串联电路单元的一端的共同连接的位线。 对于排列成一列的串联电路单元共同地提供列线,并且分别连接到构成串联电路单元的每一个的存储单元的每个控制栅电极。 所选择的非易失性晶体管工作在饱和状态的电压通过列线施加到串联电路单元的选定晶体管的控制栅电极,从而将热电子从半导体衬底注入到浮置栅电极中。 未选择的非易失性晶体管工作在非饱和操作中的另一电压被施加到串联电路单元的剩余非易失性晶体管的栅电极。 通过依次选择一个串联电路单元中的存储单元,执行顺序数据写入操作。 以类似的方式执行顺序数据读取操作。
    • 8. 发明申请
    • Power-on reset circuit for erasing of split gate flash memory reference cells
    • 用于擦除分闸门闪存参考单元的上电复位电路
    • US20040145948A1
    • 2004-07-29
    • US10755496
    • 2004-01-12
    • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
    • Shao-Yu Chou
    • G11C016/04
    • G11C16/28G11C16/16G11C16/30
    • In a standard Flash EPROM, a plurality of flash memory cells are arranged in an array of rows and columns. In order to determine the programming state of each cell, the magnitude of the cell read current is measured using a reference current source set to approximately 25uA. The memory cell being examined is connected with the drain wired to a positive voltage between about 1 to 2 volts. The source of the memory cell is connected to the current source. The control gate voltage is set to approximately 5V. An unprogrammed memory cell will have a drain current equal to that of the reference current source and the cell output will be slightly less than the drain voltage (logic 1). Under these conditions, a programmed memory cell, having a higher threshold voltage, will conduct only leakage currents. This results in the cell output being very close to ground potential (logic 0). Older technologies utilized fixed current sources for the reference current. In order to better track manufacturing tolerances, more recent technologies use a nullreference cellnull identical to the standard memory cell to form the reference current source. This reference cell is erased under the same conditions as a memory cell. Since the memory and reference cells are identical in geometry, their current characteristics will track regardless of manufacturing process variations. In order to maintain the proper state for the reference cells, they must be periodically erased. Most manufacturers erase the reference cells during a mass erase resulting in repeated high voltage stress equal to the memory array and decoder. The present invention reduces this high voltage stress using a method where a pulse initiating the erasure of the reference cells is generated upon application of power to the memory.
    • 在标准闪存EPROM中,多个闪存单元被排成行和列的阵列。 为了确定每个单元的编程状态,使用设置为大约25uA的参考电流源来测量单元读取电流的大小。 被检查的存储单元与被连接到约1至2伏之间的正电压的漏极连接。 存储单元的源连接到当前源。 控制栅极电压设置为大约5V。 未编程的存储单元将具有等于参考电流源的漏极电流,并且单元输出将稍微小于漏极电压(逻辑1)。 在这些条件下,具有较高阈值电压的编程存储器单元将仅传导泄漏电流。 这导致单元输出非常接近地电位(逻辑0)。 较老的技术使用固定电流源作为参考电流。 为了更好地跟踪制造公差,更新的技术使用与标准存储器单元相同的“参考单元”来形成参考电流源。 该参考单元在与存储单元相同的条件下被擦除。 由于存储器和参考单元的几何形状相同,所以它们的电流特性将跟踪制造工艺的变化。 为了保持参考单元的适当状态,必须定期擦除。 大多数制造商在批量擦除期间擦除参考电池,导致重复的高电压应力等于存储器阵列和解码器。 本发明使用这样的方法来降低这种高电压应力,其中在向存储器施加电力时产生引发参考单元擦除的脉冲。