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    • 1. 发明授权
    • System and method for inspecting semiconductor wafers
    • 用于检查半导体晶片的系统和方法
    • US06791680B1
    • 2004-09-14
    • US09474941
    • 1999-12-30
    • Eliezer RosengausSteven R. Lange
    • Eliezer RosengausSteven R. Lange
    • G01N2188
    • G01N21/95623G01N21/9501G01N2021/8822H01L21/67155
    • A method for inspecting semiconductor wafers is provided in which a plurality of independent, low-cost, optical-inspection subsystems are packaged and integrated to simultaneously perform parallel inspections of portions of the wafer, the wafer location relative to the inspection being controlled so that the entire wafer is imaged by the system of optical subsystems in a raster-scan mode. A monochromatic coherent-light source illuminates the wafer surface. A darkfield-optical system collects scattered light and filters patterns produced by valid periodic wafer structures using Fourier filtered. The filtered light is processed by general purpose digital-signal processors. Image subtraction methods are used to detect wafer defects, which are reported to a main computer to aid in statistical process control, particularly for manufacturing equipment.
    • 提供了一种用于检查半导体晶片的方法,其中多个独立的,低成本的光学检查子系统被封装和集成,以同时对晶片的部分进行并行检查,相对于被检查的晶片位置被控制,使得 整个晶片由光学子系统的系统以光栅扫描模式成像。 单色相干光源照亮晶片表面。 暗场光学系统使用傅立叶滤波来收集散射光并滤除由有效周期性晶片结构产生的图案。 滤波后的光由通用数字信号处理器处理。 图像减法方法用于检测晶片缺陷,报告给主计算机,以帮助进行统计过程控制,特别是制造设备。
    • 2. 发明授权
    • System and method for inspecting semiconductor wafers
    • 用于检查半导体晶片的系统和方法
    • US6020957A
    • 2000-02-01
    • US70437
    • 1998-04-30
    • Eliezer RosengausSteven R. Lange
    • Eliezer RosengausSteven R. Lange
    • G01B11/30G01N21/95G01N21/956G06T1/00H01L21/66H01L21/677G01N21/89
    • G01N21/95623G01N21/9501G01N2021/8822H01L21/67155
    • A method for inspecting semiconductor wafers is provided in which a plurality of independent, low-cost, optical-inspection subsystems are packaged and integrated to simultaneously perform parallel inspections of portions of the wafer, the wafer location relative to the inspection being controlled so that the entire wafer is imaged by the system of optical subsystems in a raster-scan mode. A monochromatic coherent-light source illuminates the wafer surface. A darkfield-optical system collects scattered light and filters patterns produced by valid periodic wafer structures using Fourier filtering. The filtered light is processed by general purpose digital-signal processors. Image subtraction methods are used to detect wafer defects, which are reported to a main computer to aid in statistical process control, particularly for manufacturing equipment.
    • 提供了一种用于检查半导体晶片的方法,其中多个独立的,低成本的光学检查子系统被封装和集成,以同时对晶片的部分进行并行检查,相对于被检查的晶片位置被控制,使得 整个晶片由光学子系统的系统以光栅扫描模式成像。 单色相干光源照亮晶片表面。 暗场光学系统收集散射光,并使用傅立叶滤波对由有效的周期性晶片结构产生的滤波图案进行滤波。 滤波后的光由通用数字信号处理器处理。 图像减法方法用于检测晶片缺陷,报告给主计算机,以帮助进行统计过程控制,特别是制造设备。
    • 6. 发明授权
    • Systems and methods for inspection of a specimen
    • 检测样品的系统和方法
    • US09068917B1
    • 2015-06-30
    • US11374711
    • 2006-03-14
    • Mehdi Vaez-IravaniEliezer Rosengaus
    • Mehdi Vaez-IravaniEliezer Rosengaus
    • G01N21/00G01N21/88
    • G01N21/00G01N21/88G01N21/9501G01N21/956G01N2021/8825
    • Systems and methods for inspection of a specimen are provided. One system includes an illumination subsystem configured to illuminate the specimen by scanning a spot across the specimen. The system also includes a non-imaging detection subsystem configured to generate output signals responsive to light specularly reflected from the spot scanned across the specimen. In addition, the system includes a processor configured to generate images of the specimen using the output signals and to detect defects on the specimen using the images. In one embodiment, the non-imaging detection subsystem includes an objective and a detector. An NA of the objective does not match a pixel size of the detector. In another embodiment, the non-imaging detection subsystem includes an objective having an NA of greater than about 0.05. The system may be configured for multi-spot illumination and multi-channel detection. Alternatively, the system may be configured for single spot illumination and multi-channel detection.
    • 提供了用于检查样本的系统和方法。 一个系统包括照明子系统,该照明子系统被配置为通过扫描样品上的斑点照射样本。 该系统还包括非成像检测子系统,其被配置为响应于从穿过样本扫描的点镜面反射的光产生输出信号。 另外,该系统包括处理器,该处理器被配置为使用输出信号产生样本的图像,并使用该图像来检测样本上的缺陷。 在一个实施例中,非成像检测子系统包括物镜和检测器。 目标的NA与检测器的像素尺寸不匹配。 在另一个实施例中,非成像检测子系统包括具有大于约0.05的NA的物镜。 该系统可以被配置用于多点照明和多通道检测。 或者,该系统可以被配置用于单点照明和多通道检测。