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    • 2. 发明授权
    • Apparatus for drying batches of wafers
    • 用于干燥批次的晶片的装置
    • US06430841B1
    • 2002-08-13
    • US09580825
    • 2000-05-26
    • Jonathan BorkowskiOliver David JonesKenneth C. McMahonScott PetersenDonald StephensYassin MehmandoustJames M. Olivas
    • Jonathan BorkowskiOliver David JonesKenneth C. McMahonScott PetersenDonald StephensYassin MehmandoustJames M. Olivas
    • F26B2108
    • H01L21/67057H01L21/67034H01L21/67046H01L21/6776
    • Liquid is removed from batches of substrates by apparatus and methods for drying substrates that have been wet in an elongated liquid bath. The substrates are moved relative to the bath and an elongated gas-filled volume at rates of movement selected according to the location of the batches of substrates in the bath or the volume. As an example, the substrates and the bath are separated at a controlled rate to form a thin layer of liquid on each substrate as each substrate enters the gas-filled volume. The gas-filled volume is defined by an elongated hot chamber and hot gas directed into the volume and across the substrates and out of the volume continuously transfers thermal energy to the substrates. The flow rate of the gas into the volume is related to introduction of the substrates into the bath to avoid disturbing the liquid in the bath. The thermal energy transferred to the substrates in the volume evaporates the thin layer from the substrates without decreasing the rate of separation of the substrates and the bath below the maximum rate of such separation at which a meniscus will form between the bath and the surface of one of the substrates during such separation. Relative humidity in the volume is controlled by sensing the relative humidity and regulating the speed of a fan that draws gas from the volume.
    • 通过用于干燥在细长液体浴中润湿的基底的装置和方法从批次的基底中除去液体。 衬底相对于浴移动,并且根据衬底批次在浴中的位置或体积选择移动速率的细长气体填充体积。 作为示例,基板和浴以受控的速率分离,以在每个基板进入气体填充体积时在每个基板上形成薄层的液体。 气体填充体积由细长的热室和引导到体积中并跨过衬底的热气体限定,并且在体积之外连续地将热能传递到衬底。 进入体积的气体的流速与将基底引入浴中以避免干扰浴中的液体有关。 在体积中转移到基底的热能从衬底中蒸发薄层,而不会降低衬底和浴的分离速率低于这种分离的最大速率,其中在浴和表面之间形成弯液面 在这种分离过程中。 通过感测相对湿度并调节从体积吸取气体的风扇的速度来控制体积中的相对湿度。