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    • 10. 发明申请
    • ADHESIVE COMPOSITION
    • 粘合剂组合物
    • US20110257315A1
    • 2011-10-20
    • US13085510
    • 2011-04-13
    • Mikio ShionoNoriyuki Koike
    • Mikio ShionoNoriyuki Koike
    • C09J183/07C09J185/00C09J11/06
    • C09D183/08C08G77/24C08L71/02
    • An adhesive composition is provided comprising (A) a fluorinated amide compound containing at least two vinyl groups and having a polyfluoro structure, (B) a fluorinated organosilicon compound containing a fluorinated organic group, at least two SiH groups, and an alkyl, aryl or aralkyl group, and (C) a platinum catalyst, and (D) an organosiloxane containing a SiH group and an epoxy and/or trialkoxysilyl group. The composition is cured on brief heating into a product which achieves adhesion to various substrates and has solvent resistance, chemical resistance, heat resistance, low-temperature properties, low moisture permeability, electric insulation, and acid resistance.
    • 提供一种粘合剂组合物,其包含(A)含有至少两个乙烯基并具有多氟结构的氟化酰胺化合物,(B)含氟化有机基团的氟化有机硅化合物,至少两个SiH基团和烷基,芳基或 芳族烷基,(C)铂催化剂,(D)含有SiH基和环氧基和/或三烷氧基甲硅烷基的有机硅氧烷。 该组合物在短暂加热下固化成实现对各种基材的粘合性的产品,并具有耐溶剂性,耐化学性,耐热性,低温性,低透湿性,电绝缘性和耐酸性。