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    • 9. 发明授权
    • Ungelled resins containing hydrolyzable moieties from organosilane
compounds
    • 含有有机硅烷化合物的可水解部分的未凝胶化树脂
    • US4623697A
    • 1986-11-18
    • US728966
    • 1985-04-30
    • Wen-Hsuan ChangDavid T. McKeough
    • Wen-Hsuan ChangDavid T. McKeough
    • C08G59/00C08F8/42C08F16/00C08F16/02C08F16/06C08G59/14C08G63/00C08G63/91C08G65/48C08G69/00C08G69/48C08G77/50C08G85/00C09D157/06C09D183/00C09D183/05C09D201/02C08F8/00
    • C09D201/02C08G77/50C08G85/004C09D157/06
    • Disclosed is an ungelled resin composition comprising a compound having at least one group containing a silicon atom selected from: ##STR1## wherein Q represents the residue from an organic polyol selected from the group consisting of (1) simple diols, triols and higher hydric alcohols, (2) polyester polyols, (3) polyether polyols, (4) amide-containing polyols, (5) epoxy polyols and (6) polyhydric polyvinyl alcohols, and eachR independently is selected from the group of moieties consisting of hydrogen, and a C.sub.1 -C.sub.10 group joined to Si through an Si-C linkage, andY represents an easily hydrolyzable group.The ungelled resin composition contains an amount of easily hydrolyzable Y moieties directly bonded to silicon atoms such that the ratio of the number of grams of the ungelled resin composition to equivalents of easily hydrolyzable Y moieties in the ungelled resin composition is in a range of from 40 to 667. Preferred resin compositions of the invention can be cured in the presence of atmospheric moisture and a suitable catalyst at a temperature of less than or equal to 121 degrees Celsius within 3 hours.Disclosed is a method for producing the ungelled resin composition.Also disclosed is a nonaqueous composition, particularly a nonaqueous coating composition, containing an ungelled resin composition of the invention. Preferred coating compositions containing an ungelled resin composition of the invention can be cured in the presence of atmospheric moisture and a suitable catalyst at a temperature of less than or equal to 121 degrees C within 3 hours.
    • 公开了一种无胶凝树脂组合物,其包含具有至少一个含有选自以下的硅原子的基团的化合物:其中Q表示选自(1)简单二醇, 三醇和高级醇,(2)聚酯多元醇,(3)聚醚多元醇,(4)含酰胺的多元醇,(5)环氧多元醇和(6)多元聚乙烯醇,并且每个R独立地选自部分 由氢组成的C1-C10基团和通过Si-C键与Si连接的C1-C10基团,Y表示易水解基团。 未凝胶化树脂组合物含有一定量的直接键合到硅原子上的易水解的Y部分,使得未凝胶化树脂组合物的克数与未凝胶化树脂组合物中容易水解的Y部分的当量之比在40 本发明优选的树脂组合物可在大气湿度和合适的催化剂存在下在3小时内在小于或等于121℃的温度下固化。 公开了一种无胶凝树脂组合物的制造方法。 还公开了含有本发明的未凝胶化树脂组合物的非水性组合物,特别是非水性涂料组合物。 含有本发明的未凝胶化树脂组合物的优选涂料组合物可在大气水分和合适的催化剂存在下在3小时内在小于或等于121℃的温度下固化。