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1. 发明授权

US07497763B2 Polishing pad, a polishing apparatus, and a process for using the polishing pad 有权
标题翻译：抛光垫，抛光装置和使用抛光垫的工艺
公开(公告)号：US07497763B2
公开(公告)日：2009-03-03
申请号：US11390176
申请日：2006-03-27
申请人： Brian E. Bottema , Stephen F. Abraham , Alex P. Pamatat
发明人： Brian E. Bottema , Stephen F. Abraham , Alex P. Pamatat
IPC分类号： B24B49/00
CPC分类号： B24B37/205 , B24B49/12
摘要： A polishing pad can include a first layer and a second layer. The first layer can have a first polishing surface and a first opening. The second layer can have an attaching surface and a second opening substantially contiguous with the first opening. The polishing pad can further include, a pad window lying within the first opening. The pad window can include a second polishing surface. When the pad would be attached to a platen, the first and second polishing surfaces can lie along a same plane, and an opposing surface of the pad window can abut an exterior surface of a platen window. In another aspect, a polishing apparatus can include an exterior surface of a platen window abutting the polishing pad. In still another aspect, a process of polishing can include polishing a workpiece such that the pad window contacts the workpiece and the platen window simultaneously.
摘要翻译：抛光垫可以包括第一层和第二层。第一层可以具有第一抛光表面和第一开口。第二层可以具有附接表面和与第一开口基本相邻的第二开口。抛光垫还可以包括位于第一开口内的垫窗。垫窗可包括第二抛光表面。当焊盘将附接到压板时，第一和第二抛光表面可以沿同一平面放置，并且焊盘窗口的相对表面可以抵靠压板窗的外表面。另一方面，抛光装置可以包括邻接抛光垫的压板窗的外表面。在另一方面，抛光过程可以包括抛光工件，使得焊盘窗口同时接触工件和压板窗。

2. 发明授权

US06887138B2 Chemical mechanical polish (CMP) conditioning-disk holder 有权
标题翻译：化学机械抛光（CMP）调理盘支架
公开(公告)号：US06887138B2
公开(公告)日：2005-05-03
申请号：US10601248
申请日：2003-06-20
申请人： Brian E. Bottema , Larry J. Bustos , Martin W. Cain , Nathan R. Brown
发明人： Brian E. Bottema , Larry J. Bustos , Martin W. Cain , Nathan R. Brown
IPC分类号： B24B53/017 , B24B53/12 , B24B33/00
CPC分类号： B24B53/017 , B24B53/12
摘要： A chemical mechanical polishing (CMP) tool holds a conditioning disk that is used to remove impurities from a polishing disk used to planarize surfaces, such as a semiconductor surface. The tool uses an elastic disk that is positioned between a clamp and a gimbal hub that pivotally overlies a gimbal plate. The elastic disk is a polymer material, such as for example polytetrafluoroethylene (PTFE). The elastic disk has a central opening and is radially solid around the central opening. Alignment holes and drive mechanism holes pierce the elastic disk which functions to rotate the tool with minimal friction and provides a liquid seal from CMP fluids. Access holes in the gimbal plate permit easy installation and removal of the individual components. The PTFE disk is strong and durable enough to withstand high torque and provide lengthy operation without maintenance.
摘要翻译：化学机械抛光（CMP）工具保持用于从用于平坦化表面的抛光盘（例如半导体表面）去除杂质的调节盘。该工具使用一个弹性盘，该弹性盘定位在夹具和万向枢轴之间，万向枢轴枢转地覆盖在万向节板上。弹性盘是聚合物材料，例如聚四氟乙烯（PTFE）。弹性盘具有中心开口并围绕中心开口径向固定。对准孔和驱动机构孔刺穿弹性盘，其功能是以最小摩擦旋转工具，并提供CMP流体的液体密封。万向节板上的通孔允许容易地安装和拆卸各个部件。 PTFE圆盘坚固耐用，足以承受高扭矩并提供长时间的操作，无需维护。

3. 发明授权

US06905392B2 Polishing system having a carrier head with substrate presence sensing 有权
标题翻译：具有载体头的抛光系统具有衬底存在感测
公开(公告)号：US06905392B2
公开(公告)日：2005-06-14
申请号：US10609996
申请日：2003-06-30
申请人： Brian E. Bottema , Keven A. Cline , Morris S. Poteet
发明人： Brian E. Bottema , Keven A. Cline , Morris S. Poteet
IPC分类号： B24B37/005 , B24B37/30 , B24B49/00 , B24B47/02
CPC分类号： B24B37/30 , B24B37/0053
摘要： A system for polishing a substrate has a controller, pressure source, a platen, and a carrier for handling the substrate. The carrier must be able to detect if a substrate is present. In either the case of a false detection of substrate presence or the failure to detect substrate presence, the likely result is damaged substrates, wasted polishing consumables, and down time of the manufacturing facility. Detection is achieved by the substrate causing movement of a plunger and by such movement resulting in a pressure differential that is detected. The reliability of this detection is improved by one or more of a precise relationship of the plunger to a plate that applies pressure to the substrate, a controlled seal that is ensured of being broken when the plunger is moved by the presence of a substrate, and proper spring pressure applied to the plunger to prevent spurious plunger movement.
摘要翻译：用于抛光衬底的系统具有控制器，压力源，压板和用于处理衬底的载体。载体必须能够检测是否存在基材。在基板存在的错误检测或基板存在的检测失败的情况下，可能的结果是损坏基板，浪费抛光耗材和制造设备的停机时间。通过基板实现检测，引起柱塞的移动，并通过这种移动导致检测到的压力差。该检测的可靠性通过柱塞与向衬底施加压力的板的精确关系中的一种或多种来提高，该受控密封件确保当柱塞通过存在衬底移动时被破坏;以及适当的弹簧压力施加到柱塞以防止假柱塞运动。

4. 发明授权

US07534162B2 Grooved platen with channels or pathway to ambient air 有权
标题翻译：沟槽压板带通道或通向环境空气
公开(公告)号：US07534162B2
公开(公告)日：2009-05-19
申请号：US11221375
申请日：2005-09-06
申请人： Brian E. Bottema , Stephen F. Abraham , Alex P. Pamatat
发明人： Brian E. Bottema , Stephen F. Abraham , Alex P. Pamatat
IPC分类号： B24B1/00 , B24B49/00 , B24B51/00
CPC分类号： B24B37/16
摘要： A polish pad (120) and platen (130) assembly for use in chemical mechanical polishing of semiconductor devices includes a platen (130) having a grooved or channeled surface (136) which is sealed from the processing environment by an ungrooved portion (131) at the periphery of the platen (130). In addition, the platen (130) includes one or more passageways (132) that provide a pathway to ambient or sub-ambient environment. The combination of the sealing region (131) and the passageway(s) (132) prevent liquids, vapors or other undesirable contaminants from infiltrating between the pad and platen, and also vent trapped air pockets between the pad and platen.
摘要翻译：用于半导体器件的化学机械抛光的抛光垫（120）和压板（130）组件包括具有槽或通道表面（136）的压板（130），其通过未槽口部分（131）与处理环境密封，在压板（130）的周边处。此外，压板（130）包括一个或多个通道（132），其提供到环境或亚环境环境的路径。密封区域（131）和通道（132）的组合防止液体，蒸汽或其他不期望的污染物渗透到垫和压板之间，并且还排出垫和压板之间的被困气囊。

5. 发明授权

US07179151B1 Polishing pad, a polishing apparatus, and a process for using the polishing pad 有权
标题翻译：抛光垫，抛光装置和使用抛光垫的工艺
公开(公告)号：US07179151B1
公开(公告)日：2007-02-20
申请号：US11390292
申请日：2006-03-27
申请人： Brian E. Bottema , Stephen F. Abraham , Alex P. Pamatat
发明人： Brian E. Bottema , Stephen F. Abraham , Alex P. Pamatat
IPC分类号： B24B1/00
CPC分类号： B24B37/013 , B24B37/205 , B24B49/12 , B24B49/14
摘要： A polishing pad can include a first layer and a second layer. The first layer can have a first polishing surface and a first opening. The second layer can have an attaching surface and a second opening substantially contiguous with the first opening. The polishing pad can further include a pad window lying within the first opening. The pad window can include a second polishing surface and a gas-permeable material. In one aspect, an apparatus can include an attaching surface of a platen lying adjacent to the attaching surface of the polishing pad. In another aspect, a process for polishing can include changing a temperature of a gas within a spaced-apart region formed between a pad and a platen. The process can also include forming a gas flux across the polishing pad after polishing has started.
摘要翻译：抛光垫可以包括第一层和第二层。第一层可以具有第一抛光表面和第一开口。第二层可以具有附接表面和与第一开口基本相邻的第二开口。抛光垫还可包括位于第一开口内的垫窗。垫窗可以包括第二抛光表面和透气材料。在一个方面，设备可以包括邻近抛光垫的附接表面的台板的附接表面。另一方面，一种用于抛光的方法可以包括改变在垫和压板之间形成的间隔开的区域内的气体的温度。该方法还可以包括在抛光开始之后在抛光垫上形成气体通量。

6. 发明授权

US07074118B1 Polishing carrier head with a modified pressure profile 失效
标题翻译：具有改进压力分布的抛光载具头
公开(公告)号：US07074118B1
公开(公告)日：2006-07-11
申请号：US11264185
申请日：2005-11-01
申请人： Brian E. Bottema , Keven A. Cline , Alex P. Pamatat , Nathan R. Brown
发明人： Brian E. Bottema , Keven A. Cline , Alex P. Pamatat , Nathan R. Brown
IPC分类号： B24B5/00
CPC分类号： B24B37/30 , B24B49/16
摘要： A polishing carrier head including a retaining ring for defining an area of a polishing pocket region used to polish a predetermined object, is provided. The polishing carrier head may further include a perforated plate positioned lateral to the retaining ring, the perforated plate having a plurality of perforations for permitting fluid flow. The polishing carrier head may further include a flexible membrane having a first region overlying a portion of the retaining ring and the perforated plate and a second region in which a first portion of the flexible membrane overlies a second portion of the flexible membrane to form one or more bellows. The polishing carrier head may further include an edge support ring in contact with the first region of the flexible membrane for clamping the first region of the flexible membrane to the perforated plate.
摘要翻译：提供了一种抛光载体头，其包括用于限定用于抛光预定物体的抛光袋区域的区域的保持环。抛光载体头还可以包括位于保持环侧面的穿孔板，多孔板具有用于允许流体流动的多个穿孔。抛光载体头还可以包括柔性膜，其具有覆盖保持环和多孔板的一部分的第一区域和第二区域，其中柔性膜的第一部分覆盖柔性膜的第二部分以形成一个或多个更多的风箱。抛光载体头还可以包括与柔性膜的第一区域接触的边缘支撑环，用于将柔性膜的第一区域夹紧到多孔板。

7. 发明授权

US07892070B2 Process of using a polishing apparatus including a platen window and a polishing pad 有权
标题翻译：使用包括压板窗和抛光垫的抛光装置的工艺
公开(公告)号：US07892070B2
公开(公告)日：2011-02-22
申请号：US12243543
申请日：2008-10-01
申请人： Brian E. Bottema , Stephen F. Abraham , Alex P. Pamatat
发明人： Brian E. Bottema , Stephen F. Abraham , Alex P. Pamatat
IPC分类号： B24B49/00
CPC分类号： B24B37/205 , B24B49/12
摘要： A polishing pad can include a first layer and a second layer. The first layer can have a first polishing surface and a first opening. The second layer can have an attaching surface and a second opening substantially contiguous with the first opening. The polishing pad can further include, a pad window lying within the first opening. The pad window can include a second polishing surface. When the pad would be attached to a platen, the first and second polishing surfaces can lie along a same plane, and an opposing surface of the pad window can abut an exterior surface of a platen window. In another aspect, a polishing apparatus can include an exterior surface of a platen window abutting the polishing pad. In still another aspect, a process of polishing can include polishing a workpiece such that the pad window contacts the workpiece and the platen window simultaneously.
摘要翻译：抛光垫可以包括第一层和第二层。第一层可以具有第一抛光表面和第一开口。第二层可以具有附接表面和与第一开口基本相邻的第二开口。抛光垫还可以包括位于第一开口内的垫窗。垫窗可包括第二抛光表面。当焊盘将附接到压板时，第一和第二抛光表面可以沿同一平面放置，并且焊盘窗口的相对表面可以抵靠压板窗的外表面。另一方面，抛光装置可以包括邻接抛光垫的压板窗的外表面。在另一方面，抛光过程可以包括抛光工件，使得焊盘窗口同时接触工件和压板窗。

8. 发明授权

US07520797B2 Platen endpoint window with pressure relief 有权
标题翻译：压板端点窗口
公开(公告)号：US07520797B2
公开(公告)日：2009-04-21
申请号：US11221376
申请日：2005-09-06
申请人： Brian E. Bottema , Stephen F. Abraham , Alex P. Pamatat
发明人： Brian E. Bottema , Stephen F. Abraham , Alex P. Pamatat
IPC分类号： B24B1/00 , B24B29/00 , B29C65/00
CPC分类号： B24B37/013 , B24B37/205
摘要： A polish pad (40, 42) and platen (50) assembly for use in chemical mechanical polishing of semiconductor devices includes a platen (50) having a vented endpoint window (62, 72, 82) with one or more venting passageways (e.g., 64, 66) and/or a grooved or channeled platen surface (176) to prevent air pressure buildup in the air gap (46) by discharging or venting air through one or more vent pathways (52) formed in the platen to provide a pathway to ambient or sub-ambient environment. The air permeable construction of the vented endpoint window (72) provides pressure relief for the air gap (46) between the pad endpoint window (44) and the vented endpoint window (72), but may also include passages (75, 76) that are filled with an air permeable hydrophobic material which protects the underlying endpoint detection system (30, 32) from contamination during cleaning of the platen endpoint window (72).
摘要翻译：用于半导体器件的化学机械抛光的抛光垫（40,42）和压板（50）组件包括具有通气端点窗口（62,72,82）的压板（50），其具有一个或多个通气通道（例如，通过排出或排出空气通过形成在压盘中的一个或多个排气通道（52），以提供通道（64,66）和/或沟槽或通道的压板表面（176），以防止空气间隙环境或环境下的环境。通气端点窗口（72）的透气结构为垫垫端点窗口（44）和排气端点窗口（72）之间的气隙（46）提供压力释放，但也可包括通道（75,76）填充有透气的疏水材料，其在清洁压板端点窗口（72）期间保护下面的端点检测系统（30,32）免受污染。

9. 发明申请

US20090023363A1 PROCESS OF USING A POLISHING APPARATUS INCLUDING A PLATEN WINDOW AND A POLISHING PAD 有权
标题翻译：使用包括平板窗和抛光垫的抛光装置的方法
公开(公告)号：US20090023363A1
公开(公告)日：2009-01-22
申请号：US12243543
申请日：2008-10-01
申请人： Brian E. Bottema , Stephen F. Abraham , Alex P. Pamatat
发明人： Brian E. Bottema , Stephen F. Abraham , Alex P. Pamatat
IPC分类号： B24B1/00
CPC分类号： B24B37/205 , B24B49/12
摘要： A polishing pad can include a first layer and a second layer. The first layer can have a first polishing surface and a first opening. The second layer can have an attaching surface and a second opening substantially contiguous with the first opening. The polishing pad can further include, a pad window lying within the first opening. The pad window can include a second polishing surface. When the pad would be attached to a platen, the first and second polishing surfaces can lie along a same plane, and an opposing surface of the pad window can abut an exterior surface of a platen window. In another aspect, a polishing apparatus can include an exterior surface of a platen window abutting the polishing pad. In still another aspect, a process of polishing can include polishing a workpiece such that the pad window contacts the workpiece and the platen window simultaneously.
摘要翻译：抛光垫可以包括第一层和第二层。第一层可以具有第一抛光表面和第一开口。第二层可以具有附接表面和与第一开口基本相邻的第二开口。抛光垫还可以包括位于第一开口内的垫窗。垫窗可包括第二抛光表面。当焊盘将附接到压板时，第一和第二抛光表面可以沿同一平面放置，并且焊盘窗口的相对表面可以抵靠压板窗的外表面。另一方面，抛光装置可以包括邻接抛光垫的压板窗的外表面。在另一方面，抛光过程可以包括抛光工件，使得焊盘窗口同时接触工件和压板窗。

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