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1. 发明授权

US06821409B2 Electroetching methods and systems using chemical and mechanical influence 有权
标题翻译：使用化学和机械影响的电蚀方法和系统
公开(公告)号：US06821409B2
公开(公告)日：2004-11-23
申请号：US10117991
申请日：2002-04-05
申请人： Bulent M. Basol , Cyprian E. Uzoh , Paul Lindquist , Homayoun Talieh
发明人： Bulent M. Basol , Cyprian E. Uzoh , Paul Lindquist , Homayoun Talieh
IPC分类号： B23H308
CPC分类号： C25D17/001 , B23H5/08 , C25D5/22 , C25F3/14 , C25F7/00 , H01L21/32134
摘要： The present invention applies an electrochemical etching solution to a material layer, preferably a metal layer, disposed on a workpiece, in the presence of a current. This electrochemical etching solution supplies to the material on the substrate surface the species to form an intermediate compound on the surface that can be more easily mechanically removed as intermediate compound fragments than the material. By removing the intermediate compound fragments, the process allows more efficient use of the supplied current to form another layer of intermediate compound that can also be mechanically removed, rather than using the current to result in another compound on the surface of the material that eventually dissolves into the solution. In another aspect of the invention, such intermediate compound particulates are externally generated and used to mechanically remove the surface layer of the material. Such intermediate particulates do not contaminate, and thus allow for more efficient material removal, as well as plating to occur within the same chamber, if desired.
摘要翻译：本发明在存在电流的情况下将电化学蚀刻溶液应用于设置在工件上的材料层，优选金属层。该电化学蚀刻溶液向基材表面上的材料提供物质，以在表面上形成中间体化合物，其可以比材料作为中间体化合物片段更容易地机械去除。通过去除中间体化合物片段，该方法允许更有效地使用所提供的电流以形成也可机械去除的另一层中间体化合物，而不是使用电流导致最终溶解的材料表面上的另一种化合物进入解决方案。在本发明的另一方面，这种中间体化合物颗粒是外部生成的并用于机械地去除材料的表面层。如果需要，这样的中间颗粒不会污染，因此允许更有效的材料去除以及电镀发生在相同的室内。

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