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    • 8. 发明授权
    • Method for compression molding
    • 压缩成型方法
    • US06228294B1
    • 2001-05-08
    • US09304049
    • 1999-05-04
    • Hong Hee LeeDal Young Kang
    • Hong Hee LeeDal Young Kang
    • B05D508
    • B29C37/0067B29C33/60B29C43/021B29C43/36B29C2037/0046B29K2033/12B29K2105/256
    • A compression molding method reduces or removes adhesion property between a mold substrate and a high polymer material, which is to be imprinted with a pattern from the mold substrate. Accordingly, a pattern having increased granularity to tens of A can be obtained for application to fabrication processes of semiconductor devices and electronic products. The compression molding method can use a patterned mold and preferably a high polymer material to be imprinted with the pattern. The method can further include heating one of the mold and the high polymer material, compression-molding the mold and the high polymer material, cooling the heated one for a prescribed time and separating the high polymer material and the mold from each other.
    • 压缩成型法减少或去除了模具基板与要从模具基板印刷图案的高分子材料之间的粘合性。 因此,为了适用于半导体器件和电子产品的制造工艺,可以获得具有增加的粒度至数十个的图案。 压缩成型方法可以使用图案化的模具,并且优选地使用高分辨率材料印刷图案。 该方法可以进一步包括加热模具和高分子材料之一,压缩模塑模具和高聚合物材料,将加热的模具冷却预定时间并将高分子材料和模具彼此分离。