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    • 6. 发明授权
    • Vapor deposition method of forming low cost semiconductor solar cells
including reconstitution of the reacted gases
    • 形成低成本半导体太阳能电池的气相沉积方法,包括重构反应气体
    • US3969163A
    • 1976-07-13
    • US507329
    • 1974-09-19
    • Gene Felix Wakefield
    • Gene Felix Wakefield
    • C23C16/24C30B29/64H01L31/0352H01L31/068H01L31/18H01L21/205H01L21/84H01L31/00
    • C23C16/24H01L31/035281H01L31/068H01L31/1804Y02E10/547Y02P70/521Y10S148/006Y10S148/12Y10S148/122Y10S148/13Y10S438/907
    • The disclosure relates to a method of upgrading metallurgical grade silicon to semiconductor grade for making low cost silicon devices and particularly solar cells. This is accomplished by passing conductive fibers such as graphite or the like which are compatible with the later processing steps through an area which is cooled below 700.degree. C and which contains silicon difluoride and a proper N-type dopant. At these temperatures, the silicon difluoride gas will break down into pure silicon which will deposit onto the fiber with the formation of silicon tetrafluoride gas which is then recycled into a further chamber. In the further chamber, the gaseous silicon tetrafluoride is mixed with the impure metallurgical grade silicon at temperatures above 700.degree. C to form the silicon difluoride gas which is then fed into the former chamber for deposition of pure silicon onto the continuously moving fibers of graphite or the like. A p-type layer can then be formed over the n-type layer in any standard manner, such as by then passing the coated fibers through a further reaction chamber wherein p-type dopant is diffused into the top surface of the n-type layer that has been formed. The dopants alternatively could be added in the gas stream of SiF.sub.4 or the p-layer formed by ion implantation. In this way, relatively inexpensive p-n junction devices are formed without the requirement of purifying, cutting and polishing a silicon slice in the standard manner.
    • 本公开涉及一种将冶金级硅升级为半导体级的方法,用于制造低成本硅器件,特别是太阳能电池。 这通过将与后面的处理步骤相容的导电纤维如石墨等通过冷却至700℃以下并含有二氟化硅和适当的N型掺杂剂的区域来实现。 在这些温度下,二氧化硅气体将分解成纯硅,其将沉积到纤维上,形成四氟化硅气体,然后再循环到另一个室中。 在另外的室中,气态四氟化硅在高于700℃的温度下与不纯的冶金级硅混合以形成二氟化硅气体,然后将其加入到前一个室中,以将纯硅沉积到石墨的连续移动的纤维上 类似。 然后可以以任何标准方式在n型层上形成p型层,例如通过然后使涂覆的纤维通过另一个反应室,其中p型掺杂剂扩散到n型层的顶表面 已经形成。 可以将掺杂剂添加到SiF 4的气流或通过离子注入形成的p层中。 以这种方式,形成相对便宜的p-n结器件,而不需要以标准方式净化,切割和抛光硅片。