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1. 发明授权

US08186047B2 Method of mounting electronic component 有权
标题翻译：安装电子元器件的方法
公开(公告)号：US08186047B2
公开(公告)日：2012-05-29
申请号：US12434500
申请日：2009-05-01
申请人： Akira Aoki , Makio Kameda , Yoshihara Fukushima , Katsuyuki Seto , Hideaki Fukushima
发明人： Akira Aoki , Makio Kameda , Yoshihara Fukushima , Katsuyuki Seto , Hideaki Fukushima
IPC分类号： H05K3/30
CPC分类号： H05K13/0452 , H05K13/0853 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/53039 , Y10T29/53178 , Y10T29/53191
摘要： The invention is directed to prevention of interference of an operation of mounting proper electronic components and improvement of usability without reduction of a manufacturing speed of printed boards. Suction states of electronic components held by suction by suction nozzles are detected by a line sensor unit. When the detection result shows that there is an improper electronic component, the improper electronic component is disposed of, and after the disposal a component recognition camera takes images of electronic components judged proper as a result of the detection and a recognition processing device performs a recognition process. When the recognition result shows that there is an improper electronic component, the improper electronic component is disposed of, and after the disposal only electronic components judged proper as a result of the recognition are mounted on a printed board.
摘要翻译：本发明旨在防止在不降低印刷电路板制造速度的情况下安装适当的电子部件的操作和提高可用性的干扰。通过吸嘴吸附保持的电子部件的吸引状态由线传感器单元检测。当检测结果表明存在不正确的电子部件时，处理不正确的电子部件，并且在处置之后，部件识别照相机拍摄作为检测结果被判定为正确的电子部件的图像，并且识别处理装置执行识别处理。当识别结果表明存在不正确的电子部件时，处理不正确的电子部件，并且在处理之后，仅将作为识别的结果判定为合适的电子部件安装在印刷电路板上。

2. 发明申请

US20090211086A1 ELECTRONIC COMPONENT MOUNTING METHOD AND ELETRONIC COMPONENT AND MOUNTING APPARATUS 有权
标题翻译：电子元件安装方法和ELETRONIC组件和安装设备
公开(公告)号：US20090211086A1
公开(公告)日：2009-08-27
申请号：US12434500
申请日：2009-05-01
申请人： Akira AOKI , Makio Kameda , Yoshiharu Fukushima , Katsuyuki Seto , Hideaki Fukushima
发明人： Akira AOKI , Makio Kameda , Yoshiharu Fukushima , Katsuyuki Seto , Hideaki Fukushima
IPC分类号： H05K3/30
CPC分类号： H05K13/0452 , H05K13/0853 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/53039 , Y10T29/53178 , Y10T29/53191
摘要： The invention is directed to prevention of interference of an operation of mounting proper electronic components and improvement of usability without reduction of a manufacturing speed of printed boards. Suction states of electronic components held by suction by suction nozzles are detected by a line sensor unit. When the detection result shows that there is an improper electronic component, the improper electronic component is disposed of, and after the disposal a component recognition camera takes images of electronic components judged proper as a result of the detection and a recognition processing device performs a recognition process. When the recognition result shows that there is an improper electronic component, the improper electronic component is disposed of, and after the disposal only electronic components judged proper as a result of the recognition are mounted on a printed board.
摘要翻译：本发明旨在防止在不降低印刷电路板制造速度的情况下安装适当的电子部件的操作和提高可用性的干扰。通过吸嘴吸附保持的电子部件的吸引状态由线传感器单元检测。当检测结果表明存在不正确的电子部件时，处理不正确的电子部件，并且在处置之后，部件识别照相机拍摄作为检测结果被判定为正确的电子部件的图像，并且识别处理装置执行识别处理。当识别结果表明存在不正确的电子部件时，处理不正确的电子部件，并且在处理之后，仅将作为识别的结果判定为合适的电子部件安装在印刷电路板上。

3. 发明授权

US07721424B2 Electronic component mounting method 有权
标题翻译：电子元件安装方法
公开(公告)号：US07721424B2
公开(公告)日：2010-05-25
申请号：US11340866
申请日：2006-01-27
申请人： Akira Aoki , Makio Kameda , Yoshiharu Fukushima , Katsuyuki Seto , Hideaki Fukushima
发明人： Akira Aoki , Makio Kameda , Yoshiharu Fukushima , Katsuyuki Seto , Hideaki Fukushima
IPC分类号： H05K3/30
CPC分类号： H05K13/0452 , H05K13/0853 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/53039 , Y10T29/53178 , Y10T29/53191
摘要： The invention is directed to prevention of interference of an operation of mounting proper electronic components and improvement of usability without reduction of a manufacturing speed of printed boards. Suction states of electronic components held by suction by suction nozzles are detected by a line sensor unit. When the detection result shows that there is an improper electronic component, the improper electronic component is disposed of, and after the disposal a component recognition camera takes images of electronic components judged proper as a result of the detection and a recognition processing device performs a recognition process. When the recognition result shows that there is an improper electronic component, the improper electronic component is disposed of, and after the disposal only electronic components judged proper as a result of the recognition are mounted on a printed board.
摘要翻译：本发明旨在防止在不降低印刷电路板制造速度的情况下安装适当的电子部件的操作和提高可用性的干扰。通过吸嘴吸附保持的电子部件的吸引状态由线传感器单元检测。当检测结果表明存在不正确的电子部件时，处理不正确的电子部件，并且在处置之后，部件识别照相机拍摄作为检测结果被判定为正确的电子部件的图像，并且识别处理装置执行识别处理。当识别结果表明存在不正确的电子部件时，处理不正确的电子部件，并且在处理之后，仅将作为识别的结果判定为合适的电子部件安装在印刷电路板上。

4. 发明申请

US20060185162A1 Electronic component mounting method and electronic component mounting apparatus 有权
标题翻译：电子部件安装方法和电子部件安装装置
公开(公告)号：US20060185162A1
公开(公告)日：2006-08-24
申请号：US11340866
申请日：2006-01-27
申请人： Akira Aoki , Makio Kameda , Yoshiharu Fukushima , Katsuyuki Seto , Hideaki Fukushima
发明人： Akira Aoki , Makio Kameda , Yoshiharu Fukushima , Katsuyuki Seto , Hideaki Fukushima
IPC分类号： H05K3/30 , B23P19/00
CPC分类号： H05K13/0452 , H05K13/0853 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/53039 , Y10T29/53178 , Y10T29/53191
摘要： The invention is directed to prevention of interference of an operation of mounting proper electronic components and improvement of usability without reduction of a manufacturing speed of printed boards. Suction states of electronic components held by suction by suction nozzles are detected by a line sensor unit. When the detection result shows that there is an improper electronic component, the improper electronic component is disposed of, and after the disposal a component recognition camera takes images of electronic components judged proper as a result of the detection and a recognition processing device performs a recognition process. When the recognition result shows that there is an improper electronic component, the improper electronic component is disposed of, and after the disposal only electronic components judged proper as a result of the recognition are mounted on a printed board.
摘要翻译：本发明旨在防止在不降低印刷电路板制造速度的情况下安装适当的电子部件的操作和提高可用性的干扰。通过吸嘴吸附保持的电子部件的吸引状态由线传感器单元检测。当检测结果表明存在不正确的电子部件时，处理不正确的电子部件，并且在处置之后，部件识别照相机拍摄作为检测结果被判定为正确的电子部件的图像，并且识别处理装置执行识别处理。当识别结果表明存在不正确的电子部件时，处理不正确的电子部件，并且在处理之后，仅将作为识别的结果判定为合适的电子部件安装在印刷电路板上。

5. 发明授权

US06199272B1 Electronic component- mounting apparatus and component-feeding device therefor 失效
标题翻译：电子部件安装装置及其部件供给装置
公开(公告)号：US06199272B1
公开(公告)日：2001-03-13
申请号：US09090734
申请日：1998-06-04
申请人： Katsuyuki Seto , Kazuyoshi Oyama , Yoshiharu Fukushima
发明人： Katsuyuki Seto , Kazuyoshi Oyama , Yoshiharu Fukushima
IPC分类号： B23P1900
CPC分类号： H05K13/021 , H05K13/0434 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183 , Y10T29/53187 , Y10T29/53222
摘要： A pallet-storing block of an electronic component-mounting apparatus stores a plurality of pallets each carrying thereon a tray containing a large number of electronic components. A desired pallet selected from the pallets is moved along a transfer path, in a manner such that the desired pallet is advanced to be introduced into a pickup area which extends to cover almost all of the transfer path or withdrawn from the pickup area into the pallet-storing block. Desired electronic components are sequentially picked up from the desired pallet introduced into the pickup area and mounted on a circuit board. The desired pallet is moved to a desired position within the pickup area.
摘要翻译：电子部件安装装置的托盘存放块存储多个托盘，每个托盘载有包含大量电子部件的托盘。从托盘中选择的期望的托盘沿着传送路径移动，使得期望的托盘被推进以被引入到拾取区域中，该拾取区域延伸以覆盖几乎所有的传送路径或者从拾取区域撤回到托盘积木块。期望的电子部件从引入到拾取区域的期望的托盘顺序地拾取并且安装在电路板上。所需的托盘移动到拾取区域内的所需位置。

6. 发明授权

US6036425A Component-feeding device in electronic component-mounting apparatus 失效
标题翻译：电子部件安装装置中的分量供给装置
公开(公告)号：US6036425A
公开(公告)日：2000-03-14
申请号：US47036
申请日：1998-03-24
申请人： Katsuyuki Seto
发明人： Katsuyuki Seto
IPC分类号： H05K13/02 , H05K13/04 , B65G1/00
CPC分类号： H05K13/0434 , H05K13/021
摘要： There is provided a component-feeding device for an electronic component-mounting apparatus which has a main block for carrying out electronic component-pickup and mounting operations. The component-feeding device selectively transports a plurality of pallets on each of which at least one tray containing a number of electronic components is placed, to a pickup position for picking up supplied one of the electronic components. A selected one of the pallets is vertically transported selectively to different levels according to a height of the at least one tray on the selected one of the pallets. The selected pallet vertically transported to the selected level is horizontally transported to the pickup position.
摘要翻译：提供了一种用于电子部件安装装置的部件供给装置，其具有用于执行电子部件拾取和安装操作的主块。部件供给装置选择性地将包含多个电子部件的至少一个托盘的多个托盘输送到用于拾取所提供的一个电子部件的拾取位置。所选择的一个托盘根据所选择的一个托盘上的至少一个托盘的高度被选择性地垂直运送到不同的高度。垂直运送到所选水平的所选托盘被水平运送到拾取位置。

7. 发明申请

US20050177998A1 Electronic component mounting apparatus 有权
标题翻译：电子元件安装装置
公开(公告)号：US20050177998A1
公开(公告)日：2005-08-18
申请号：US11054625
申请日：2005-02-10
申请人： Yoshiharu Fukushima , Takahiro Nagata , Katsuyuki Seto
发明人： Yoshiharu Fukushima , Takahiro Nagata , Katsuyuki Seto
IPC分类号： H05K13/04 , B23P19/00
CPC分类号： H05K13/0452 , H05K13/0409 , Y10T29/49131 , Y10T29/53178 , Y10T29/53183 , Y10T29/53191 , Y10T29/53261
摘要： The invention provides an electronic component mounting apparatus which can obtain a relative vertically moving stroke of a suction nozzle and is applicable to electronic components ranging from thin to thick ones. The electronic component mounting apparatus of the invention has a suction nozzle for picking an electronic component up from a plurality of component feeding units supplying the electronic component to a component pickup position and mounting the electronic component on a printed board, where a mounting head movable along a beam can move vertically by a head vertical movement device and the suction nozzle provided on the mounting head can move vertically by a nozzle vertical movement device 50.
摘要翻译：本发明提供一种能够获得吸嘴的相对垂直移动行程的电子部件安装装置，并且可应用于从薄到厚的电子部件。本发明的电子部件安装装置具有从多个向电子部件供给部件供给部件向组件拾取位置取出电子部件的吸嘴，将电子部件安装在印刷电路板上，梁可以通过头垂直移动装置垂直移动，并且设置在安装头上的吸嘴可以通过喷嘴垂直移动装置50垂直移动。

8. 发明授权

US06796022B2 Electronic component mounting apparatus 失效
标题翻译：电子元件安装装置
公开(公告)号：US06796022B2
公开(公告)日：2004-09-28
申请号：US10108989
申请日：2002-03-29
申请人： Hisayoshi Kashitani , Katsuyuki Seto , Yoshiharu Fukushima
发明人： Hisayoshi Kashitani , Katsuyuki Seto , Yoshiharu Fukushima
IPC分类号： H05K330
CPC分类号： H05K13/0452 , Y10S29/044 , Y10T29/53178 , Y10T29/53183 , Y10T29/53191
摘要： An electronic component mounting apparatus has a pair of guides, a beam traveling along the guides and a mounting head placed on the beam. A first linear motor moves the beam along the guides, and a second linear motor moves the mounting head along the beam. A thermal insulating portion placed between the beam and the guides thermally insulates the two components from each other. Thermal conduction portions are placed on the fixed elements of the first and second linear motors. This configuration assures an accurate operation of the mounting apparatus by eliminating thermal deformations of their components.
摘要翻译：电子部件安装装置具有一对引导件，沿引导件行进的梁和放置在梁上的安装头。第一线性电动机沿着导轨移动光束，并且第二线性电动机沿着光束移动安装头。放置在梁和引导件之间的绝热部分将两个部件彼此热绝缘。导热部分放置在第一和第二直线电动机的固定元件上。该配置通过消除其组件的热变形来确保安装装置的精确操作。

9. 发明授权

US07813607B2 Optical fiber bundle unit for transmitting ultraviolet light 有权
标题翻译：用于传输紫外线的光纤束单元
公开(公告)号：US07813607B2
公开(公告)日：2010-10-12
申请号：US11084515
申请日：2005-03-17
申请人： Ken-ichi Nakatate , Tomoaki Toriya , Manabu Kudoh , Katsuyuki Seto , Takashi Tsumanuma
发明人： Ken-ichi Nakatate , Tomoaki Toriya , Manabu Kudoh , Katsuyuki Seto , Takashi Tsumanuma
IPC分类号： G02B6/04
CPC分类号： G02B6/403 , G02B6/04 , G02B6/102
摘要： An optical fiber bundle unit is provided for transmitting ultraviolet light in which the increase of the transmission loss caused by radicals generated in the optical fiber by irradiation or transmission of ultraviolet light is suppressed and a stable energy state is maintained even after the irradiation or transmission of ultraviolet light. The optical fiber bundle unit for transmitting ultraviolet light includes an optical fiber bundle and a sealed container in which the optical fiber bundle is held. A diffusion of hydrogen gas is suppressed by putting the optical fiber bundle pretreated in a hydrogen atmosphere into the sealed container, followed by filling the sealed container with a mixed gas including a hydrogen gas and a gas which is not combustible, will not support combustion, and will not explode.
摘要翻译：提供一种光纤束单元，用于透射紫外光，其中通过照射或透射紫外光而在光纤中产生的自由基引起的传输损耗的增加被抑制，并且即使在照射或传输之后也保持稳定的能量状态紫外光线。用于透射紫外线的光纤束单元包括光纤束和保持光纤束的密封容器。通过将在氢气氛中预处理的光纤束放入密封容器中，然后用包含氢气和不可燃气体的混合气体填充密封容器来抑制氢气的扩散，不支持燃烧，并不会爆炸。

10. 发明申请

US20050238302A1 Optical fiber bundle unit for transmitting ultraviolet light 有权
公开(公告)号：US20050238302A1
公开(公告)日：2005-10-27
申请号：US11084515
申请日：2005-03-17
申请人： Ken-ichi Nakatate , Tomoaki Toriya , Manabu Kudoh , Katsuyuki Seto , Takashi Tsumanuma
发明人： Ken-ichi Nakatate , Tomoaki Toriya , Manabu Kudoh , Katsuyuki Seto , Takashi Tsumanuma
IPC分类号： G02B6/04 , G02B6/10 , G02B6/40
CPC分类号： G02B6/403 , G02B6/04 , G02B6/102
摘要： An optical fiber bundle unit is provided for transmitting ultraviolet light in which the increase of the transmission loss caused by radicals generated in the optical fiber by irradiation or transmission of ultraviolet light is suppressed and a stable energy state is maintained even after the irradiation or transmission of ultraviolet light. The optical fiber bundle unit for transmitting ultraviolet light includes an optical fiber bundle and a sealed container in which the optical fiber bundle is held, wherein the sealed container contains a hydrogen gas.

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