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    • 8. 发明授权
    • Semiconductor memory device
    • 半导体存储器件
    • US09036440B2
    • 2015-05-19
    • US13716418
    • 2012-12-17
    • SK hynix Inc.
    • Choung-Ki Song
    • G11C7/00G11C11/402G11C11/406
    • G11C11/40607G11C11/402G11C11/40611G11C11/40615G11C2211/4061G11C2211/4067
    • A semiconductor memory device includes a memory cell array configured to include a plurality of word lines, a clock enable buffer configured to receive a clock enable signal, a plurality of command buffers configured to receive a plurality of commands, a refresh control unit configured to sequentially activate the plurality of word lines in a self-refresh mode, a command decoder configured to decode the clock enable signal and the plurality of commands, and to allow the refresh control unit to enter the self-refresh mode or exit from the self-refresh mode, and a buffer control unit configured to disable the plurality of command buffers when the clock enable signal is deactivated, and to enable the plurality of command buffers when the refresh control unit exits from the self-refresh mode.
    • 半导体存储器件包括配置为包括多个字线的存储单元阵列,被配置为接收时钟使能信号的时钟使能缓冲器,被配置为接收多个命令的多个命令缓冲器,配置为顺序地配置的刷新控制单元 在自刷新模式下激活多个字线,命令解码器,被配置为对时钟使能信号和多个命令进行解码,并允许刷新控制单元进入自刷新模式或退出自刷新 模式,以及缓冲器控制单元,被配置为当所述时钟使能信号被去激活时禁用所述多个命令缓冲器,并且当所述刷新控制单元退出所述自刷新模式时启用所述多个命令缓冲器。
    • 9. 发明授权
    • Techniques for providing a direct injection semiconductor memory device
    • 提供直接注入半导体存储器件的技术
    • US08964461B2
    • 2015-02-24
    • US14084386
    • 2013-11-19
    • Micron Technology, Inc.
    • Yogesh Luthra
    • G11C11/39G11C16/26H01L27/108H01L29/73H01L29/78G11C11/402H01L27/102
    • G11C5/02G11C5/06G11C7/00G11C11/402G11C16/26H01L27/1023H01L27/10802H01L29/73H01L29/7841
    • Techniques for providing a direct injection semiconductor memory device are disclosed. In one embodiment, the techniques may be realized as a method for biasing a direct injection semiconductor memory device including the steps of applying a first non-negative voltage potential to a first region via a bit line and applying a second non-negative voltage potential to a second region via a source line. The method may also include applying a third voltage potential to a word line, wherein the word line may be spaced apart from and capacitively to a body region that may be electrically floating and disposed between the first region and the second region. The method may further include applying a fourth positive voltage potential to a third region via a carrier injection line, wherein the third region may be disposed below at least one of the first region, the body region, and the second region.
    • 公开了提供直接注入半导体存储器件的技术。 在一个实施例中,技术可以被实现为用于偏置直接注入半导体存储器件的方法,包括以下步骤:通过位线将第一非负电压电位施加到第一区域,并将第二非负电压电位施加到 经由源极线的第二区域。 该方法还可以包括将第三电压电位施加到字线,其中字线可以与可以电浮动并且布置在第一区域和第二区域之间的体区间隔开并且电容化。 该方法可以进一步包括经由载体注入管线将第四正电压电位施加到第三区域,其中第三区域可以设置在第一区域,体区域和第二区域中的至少一个之下。
    • 10. 发明授权
    • Memory refresh methods, memory section control circuits, and apparatuses
    • 存储器刷新方法,存储器部分控制电路和装置
    • US08861296B2
    • 2014-10-14
    • US14084417
    • 2013-11-19
    • Micron Technology, Inc.
    • John David PorterGi-Hong Kim
    • G11C7/00G11C11/402G11C11/408G11C8/08G11C5/14G11C11/406G11C8/10
    • G11C11/40615G11C5/147G11C8/08G11C8/10G11C11/402G11C11/406G11C11/4085G11C2211/4065G11C2211/4067
    • Apparatuses, memory section control circuits, and methods of refreshing memory are disclosed. An example apparatus includes a plurality of memory sections and a plurality of memory section control circuits. Each memory section control circuit is coupled to a respective one of the plurality of memory sections and includes a plurality of access line drivers, each of which includes a plurality of transistors having common coupled gates. During an operation of the apparatus a first voltage is provided to the commonly coupled gates of the transistors of at least some of the access line drivers of the memory section control circuit coupled to an active memory section and a second voltage is provided to the commonly coupled gates of the transistors of the access line drivers of the memory section control circuit coupled to an inactive memory section control circuit, wherein the first voltage is greater than the second voltage.
    • 公开了设备,存储器部分控制电路和刷新存储器的方法。 示例性设备包括多个存储器部分和多个存储器部分控制电路。 每个存储器部分控制电路耦合到多个存储器部分中的相应一个,并且包括多个存取线驱动器,每个存取线驱动器包括具有公共耦合栅极的多个晶体管。 在装置的操作期间,将第一电压提供给耦合到有源存储器部分的存储器部分控制电路的至少一些存取线驱动器的晶体管的共同耦合的栅极,并且第二电压被提供给共同耦合的 存储器部分控制电路的存取线驱动器的晶体管的栅极耦合到非活动存储器部分控制电路,其中第一电压大于第二电压。