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1. 发明授权

US11806877B2 Method and apparatus for adjusting robot motion path 有权
公开(公告)号：US11806877B2
公开(公告)日：2023-11-07
申请号：US17055187
申请日：2018-02-08
申请人： ABB Schweiz AG
发明人： Fangfang Zhao , Lei Mao , Shaojie Cheng
IPC分类号： B25J9/16 , G05B19/408
CPC分类号： B25J9/1664 , G05B19/4083 , G05B2219/37575 , G05B2219/45096 , G05B2219/50063 , G05B2219/50087
摘要： Embodiments of present disclosure relate to adjusting a robot motion path. In the method for adjusting a robot motion path, a first processing procedure may be performed on a first workpiece to obtain a first product. Then, first process data may be obtained, where the first process data describes an attribute of the first processing procedure for obtaining the first product from the first workpiece. Next, based on the obtained first process data, a robot motion path of a second processing procedure that is to be performed on the first product by a robot may be adjusted. Further, embodiments of present disclosure provide apparatuses, systems, and computer readable media for adjusting a robot motion path.

2. 发明授权

US06415191B1 Intelligent machining and manufacturing 有权
标题翻译：智能加工制造
公开(公告)号：US06415191B1
公开(公告)日：2002-07-02
申请号：US09342245
申请日：1999-06-29
申请人： Timothy R. Pryor
发明人： Timothy R. Pryor
IPC分类号： G06F1900
CPC分类号： G05B19/41875 , G05B19/4189 , G05B2219/32181 , G05B2219/32182 , G05B2219/32186 , G05B2219/32188 , G05B2219/32212 , G05B2219/32372 , G05B2219/33002 , G05B2219/33027 , G05B2219/33192 , G05B2219/36105 , G05B2219/36284 , G05B2219/37008 , G05B2219/37014 , G05B2219/37074 , G05B2219/37205 , G05B2219/37206 , G05B2219/37326 , G05B2219/37355 , G05B2219/37369 , G05B2219/37555 , G05B2219/37559 , G05B2219/37563 , G05B2219/37575 , G05B2219/45055 , G05B2219/49025 , G05B2219/49031 , G05B2219/49219 , G05B2219/50099 , G05B2219/50125 , G05B2219/50185 , G05B2219/50197 , G05B2219/50214 , G05B2219/50376 , Y02P90/04 , Y02P90/16 , Y02P90/22 , Y02P90/26 , Y02P90/28 , Y10T29/25 , Y10T29/53052
摘要： Methods and apparatus for “Intelligent” control of production processes such as machining, casting, heat treating and welding are disclosed. The key enabler of such control is electro-optical or other suitable sensors, generally non contact, capable of rapidly and accurately acquiring data from parts and tools used to produce them in a production “in-process” environment. Systems are disclosed to control not only the instant operation, but those processes connected therewith, both upstream and downstream. Data bases are generated and knowledge bases are used. Application of the invention can improve quality and productivity, and allow the production of parts which have unusual or individual material characteristics.
摘要翻译：公开了用于“智能”控制加工，铸造，热处理和焊接等生产工艺的方法和装置。这种控制的关键推动因素是电光或其他合适的传感器，通常是非接触式的，能够快速准确地从生产“在制程”环境中生产的部件和工具获取数据。公开了系统来控制即时操作，但是控制与上游和下游相关的那些处理。生成数据库并使用知识库。本发明的应用可以提高质量和生产率，并允许生产具有异常或单独材料特性的零件。

3. 发明授权

US07844357B2 Controlling device for substrate processing apparatus and method therefor 有权
标题翻译：基板处理装置的控制装置及其方法
公开(公告)号：US07844357B2
公开(公告)日：2010-11-30
申请号：US11874626
申请日：2007-10-18
申请人： Shinji Sakano
发明人： Shinji Sakano
IPC分类号： G06F19/00
CPC分类号： G05B19/41875 , G05B2219/32097 , G05B2219/32182 , G05B2219/32198 , G05B2219/37575 , G05B2219/37576 , G05B2219/45031 , H01L21/32135 , Y02P90/20 , Y02P90/22
摘要： A target value that serves as a control value with feed forward control is optimized. A TL performs a feed forward and a feedback control of a PM. A storage unit stores a plurality of recipes indicating different processing sequences, and a target value that serves as a control value when performing an etching process. A communication unit causes an IMM to measure a processing state of the wafer and receives measurement information. A computation unit computes a feedback value for the current wafer processed in the current cycle, based on pre-processing and post-processing measurement information for the wafer. An update unit updates the target value using the feedback value. A recipe adjustment unit changes the recipe to change the process performed in the same PM. When the process is performed after changing, the updated target value is used to perform feed forward control of the wafer in the same PM.
摘要翻译：作为具有前馈控制的控制值的目标值被优化。 TL执行PM的前馈和反馈控制。存储单元存储指示不同处理顺序的多个配方，以及当执行蚀刻处理时用作控制值的目标值。通信单元使IMM测量晶片的处理状态并接收测量信息。计算单元基于晶片的预处理和后处理测量信息来计算当前周期中处理的当前晶片的反馈值。更新单元使用反馈值更新目标值。配方调整单元更改配方以更改在同一个PM中执行的过程。当改变之后执行处理时，更新的目标值被用于在相同的PM中执行晶片的前馈控制。

4. 发明申请

US20100234977A1 Controlling Cutting of Continuously Fabricated Composite Parts with Nondestructive Evaluation 有权
标题翻译：连续制造复合零件的切削控制与非破坏性评估
公开(公告)号：US20100234977A1
公开(公告)日：2010-09-16
申请号：US12404453
申请日：2009-03-16
申请人： Roger W. Engelbart , Steven J. Burpo , Michael P. Renieri
发明人： Roger W. Engelbart , Steven J. Burpo , Michael P. Renieri
IPC分类号： B23P11/02 , G05B19/18 , G06F19/00 , B23K26/00 , G05B13/02
CPC分类号： G05B19/41875 , B26D5/005 , B26F1/3826 , B29C70/545 , G01N29/04 , G01N29/275 , G01N2291/0231 , G01N2291/2694 , G05B19/4097 , G05B2219/35162 , G05B2219/37269 , G05B2219/37575 , G05B2219/45234 , Y02P90/22 , Y10T29/49867
摘要： An apparatus may comprise a nondestructive evaluation system and a cutting system. The nondestructive evaluation system may be configured to inspect a processed portion of a structure. The nondestructive evaluation system may be configured to determine whether an inconsistency is present in the processed portion. The nondestructive evaluation system may also be configured to generate information about a location of the inconsistency. The cutting system may be configured to cut a number of parts out of the processed portion of the structure in which the inconsistency may be at least substantially excluded from the number of parts.
摘要翻译：装置可以包括非破坏性评估系统和切割系统。非破坏性评估系统可以被配置为检查结构的处理部分。非破坏性评估系统可以被配置为确定处理部分中是否存在不一致。非破坏性评估系统还可以被配置为生成关于不一致位置的信息。切割系统可以被配置为从结构的处理部分中切割出多个零件，其中不一致性可以至少基本上从零件数量排除。

5. 发明授权

US6161055A Method of determining tool breakage 失效
标题翻译：确定刀具破损的方法
公开(公告)号：US6161055A
公开(公告)日：2000-12-12
申请号：US566449
申请日：1995-12-01
申请人： Timothy R. Pryor
发明人： Timothy R. Pryor
IPC分类号： G05B19/4065 , G06F19/00
CPC分类号： G05B19/4065 , B23Q17/0957 , G05B2219/37227 , G05B2219/37233 , G05B2219/37234 , G05B2219/37246 , G05B2219/37575
摘要： A method of determining the breakage of a tool in a machine tool is disclosed. The method automatically senses a physical characteristic of the operation of the machine during a cutting operation. Then, if the sensed value indicates a potential break in the cutting edge of the tool, an electro-optical sensor used to examine the shape of the tool and to automatically determine whether the tool shape is also indicative of tool breakage.
摘要翻译：公开了一种确定机床中刀具断裂的方法。该方法在切割操作期间自动感测机器的操作的物理特性。然后，如果检测到的值表示刀具的切削刃中的潜在断裂，则用于检查刀具的形状并自动确定刀具形状是否也表示刀具断裂的电光传感器。

6. 发明申请

US20150142167A1 Method for producing structures or contours on a workpiece, and moulder 有权
标题翻译：用于在工件上制造结构或轮廓的方法，以及模具
公开(公告)号：US20150142167A1
公开(公告)日：2015-05-21
申请号：US14386422
申请日：2013-03-15
申请人： Michaek Weinig AG
发明人： Andreas Konrad , Jürgen Schmidt
IPC分类号： G05B19/19 , B27M1/08 , B27C5/02 , B23Q17/22
CPC分类号： G05B19/19 , B23Q17/2233 , B27C1/08 , B27C5/02 , B27M1/08 , G05B19/182 , G05B2219/37304 , G05B2219/37575 , G05B2219/37576 , G05B2219/45229
摘要： In a moulder, at least one rotatably driven tool (7, 8, 10, 11) is used to produce the structure (27) or contour on the workpiece (1) by workpiece removal. The workpiece positions along the workpiece (1) for producing the structure or contour are set depending on the data of the workpiece (1) and of the tool (7, 8, 10, 11). The data are transmitted to the machine controller which processes the CNC program based on the data during the passage of the workpiece (1) through the moulder and moves the tool (7, 8, 10, 11) into the required positions via CNC drives depending on the workpiece position. The workpiece position is sensed during the passage of the workpiece (1) through the moulder. In order to sense the workpiece position in the moulder, at least one measuring element (18) is provided upstream and downstream of the tool (1), said measuring element (18) being connected to the machine controller and supplying signals that describe the advancing travel of the workpiece (1) to the machine controller. By way of the machine controller, the tool (7, 8, 10, 11) is moved into the respective tool positions in accordance with the signals.
摘要翻译：在成型机中，至少一个可旋转驱动的工具（7,8,10,11）用于通过工件移除来在工件（1）上产生结构（27）或轮廓。根据工件（1）和工具（7,8,10,11）的数据，设置用于生产结构或轮廓的工件（1）的工件位置。将数据传送到机床控制器，该控制器根据工件（1）通过模具的数据，处理CNC程序，并通过CNC驱动将工具（7,8,10,11）移动到所需的位置在工件位置。工件位置在工件（1）通过模子期间被感测到。为了感测模具中的工件位置，至少一个测量元件（18）设置在工具（1）的上游和下游，所述测量元件（18）连接到机器控制器并提供描述前进的信号将工件（1）移动到机器控制器。通过机器控制器，工具（7,8,10,11）根据信号移动到相应的工具位置。

7. 发明授权

US08583271B2 Controlling cutting of continuously fabricated composite parts with nondestructive evaluation 有权
标题翻译：通过无损评估控制连续制造复合材料零件的切割
公开(公告)号：US08583271B2
公开(公告)日：2013-11-12
申请号：US12404453
申请日：2009-03-16
申请人： Roger W. Engelbart , Steven J. Burpo , Michael P. Renieri
发明人： Roger W. Engelbart , Steven J. Burpo , Michael P. Renieri
IPC分类号： B23P11/02 , G05B19/18 , G06F19/00 , B23K26/00 , G05B13/02
CPC分类号： G05B19/41875 , B26D5/005 , B26F1/3826 , B29C70/545 , G01N29/04 , G01N29/275 , G01N2291/0231 , G01N2291/2694 , G05B19/4097 , G05B2219/35162 , G05B2219/37269 , G05B2219/37575 , G05B2219/45234 , Y02P90/22 , Y10T29/49867
摘要： An apparatus may comprise a nondestructive evaluation system and a cutting system. The nondestructive evaluation system may be configured to inspect a processed portion of a structure. The nondestructive evaluation system may be configured to determine whether an inconsistency is present in the processed portion. The nondestructive evaluation system may also be configured to generate information about a location of the inconsistency. The cutting system may be configured to cut a number of parts out of the processed portion of the structure in which the inconsistency may be at least substantially excluded from the number of parts.
摘要翻译：装置可以包括非破坏性评估系统和切割系统。非破坏性评估系统可以被配置为检查结构的处理部分。非破坏性评估系统可以被配置为确定处理部分中是否存在不一致。非破坏性评估系统还可以被配置为生成关于不一致位置的信息。切割系统可以被配置为从结构的处理部分中切割出多个零件，其中不一致性可以至少基本上从零件数量排除。

8. 发明授权

US06256546B1 System and method for numerical control processing of an in-processing part 失效
标题翻译：加工部件数控处理系统及方法
公开(公告)号：US06256546B1
公开(公告)日：2001-07-03
申请号：US09161367
申请日：1998-09-28
申请人： Michael Evans Graham , John Dennis Jackson
发明人： Michael Evans Graham , John Dennis Jackson
IPC分类号： G05B1304
CPC分类号： G05B19/4099 , G05B2219/37205 , G05B2219/37575 , G05B2219/42044
摘要： A system and method for numerical control processing of an in-process part. A mathematical mapping is generated which approximates the deformation of the in-process part as measured against a nominal model. The mapping is applied to nominal NC tool paths to generate modified tool paths that travel in the distorted coordinate space of the in-process part. A result is that local features may be machined into the in-process parts in reasonable locations, and non contact measurement systems as well as surface finishing systems can travel at a more constant distance from the surface of the in-process part.
摘要翻译：一种处理过程中数值控制处理的系统和方法。产生一个数学映射，其近似于针对标称模型测量的过程中部分的变形。映射应用于标称NC刀具路径，以生成在过程中部件的失真坐标空间中行进的修改刀具路径。结果是可以在合理的位置将局部特征加工到过程中部件中，并且非接触式测量系统以及表面精加工系统可以在距过程部件的表面更恒定的距离处行进。

9. 发明授权

US5664987A Methods and apparatus for control of polishing pad conditioning for wafer planarization 失效
标题翻译：用于控制晶片平面化抛光垫调节的方法和装置
公开(公告)号：US5664987A
公开(公告)日：1997-09-09
申请号：US707826
申请日：1996-09-04
申请人： Peter Henry Renteln
发明人： Peter Henry Renteln
IPC分类号： B24B37/005 , B24B53/00 , B24B53/017 , G05B19/401 , B24B49/00
CPC分类号： B24B53/017 , B24B37/005 , G05B19/401 , G05B2219/37574 , G05B2219/37575 , G05B2219/37577 , G05B2219/37602 , G05B2219/45199 , G05B2219/50063
摘要： A method and apparatus for determining the amount of conditioning required to be applied to a polishing pad to achieve a desired removal rate during the polishing of a semiconductor wafer utilizes a rotating conditioning wheel in contact with a rotating polishing pad. Preselected points on just polished wafers are measured for removal rate and such measurements are used to calculate the removal rate as a function of wafer radius. When the removal rate changes by a preselected amount, the polishing pad is conditioned in accordance with the calculations.
摘要翻译：一种用于确定在抛光垫中抛光期间所需的调理量达到理想的去除速率的方法和装置利用与旋转抛光垫接触的转动调节轮。测量刚刚抛光的晶片上的预选点，以移除速率，并且使用这种测量来计算作为晶片半径的函数的去除速率。当去除率以预选量改变时，抛光垫根据计算进行调节。

10. 发明申请

US20150142156A1 FLEXIBLE MANUFACTURING SYSTEM 有权
标题翻译：柔性制造系统
公开(公告)号：US20150142156A1
公开(公告)日：2015-05-21
申请号：US14540411
申请日：2014-11-13
申请人： JTEKT CORPORATION
发明人： Katsuhiro MASEKI , Tatsuhiko INAGAKI , Takaaki SUGIURA , Kazuhiro TSUJIMURA
IPC分类号： B23Q7/14 , G05B15/02
CPC分类号： B23Q7/1431 , B23Q7/1426 , B23Q17/0909 , B23Q41/02 , B23Q41/06 , G05B15/02 , G05B19/00 , G05B19/41815 , G05B2219/31268 , G05B2219/37575 , G05B2219/50373
摘要： There is provided a flexible manufacturing system that can reliably place a workpiece that isn't defective piece in a state where the workpiece will be machined again. After a pallet is conveyed to a standby position and before machining of the workpiece attached to the pallet is started, controllers determines whether machining of the workpiece with a corresponding machining device is possible. When it is determined that machining is possible, the controller starts machining with the machining device. When it is determined that machining is impossible, the controller make a conveyor convey the pallet from the standby position to a pallet storage room, and stores the machining status information on the conveyed pallet as the machining-waiting state.
摘要翻译：提供了一种柔性制造系统，其可以在再次加工工件的状态下可靠地放置不是有缺陷的工件的工件。在托盘被运送到待机位置之后，并且在附接到托盘的工件的加工开始之前，控制器确定是否可以使用相应的加工装置加工工件。当确定可以进行加工时，控制器使用加工装置开始加工。当确定不可能进行加工时，控制器使输送机将托盘从备用位置传送到托盘存放室，并将加工状态信息存储在运送的托盘上作为加工等待状态。

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