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    • 8. 发明申请
    • CLEANER COMPOSITION FOR REMOVAL OF LEAD-FREE SOLDERING FLUX, RINSING AGENT FOR REMOVAL OF LEAD-FREE SOLDERING FLUX, AND METHOD FOR REMOVAL OF LEAD-FREE SOLDERING FLUX
    • 用于去除无铅焊料的清洁剂组合物,用于去除无铅焊接焊剂的清洗剂,以及用于除去无铅焊料的方法
    • US20090042762A1
    • 2009-02-12
    • US12280720
    • 2007-03-16
    • Kazutaka Zenfuku
    • Kazutaka Zenfuku
    • C11D7/36
    • C11D1/78C11D3/43C11D11/0029C23G5/032C23G5/06H05K3/26
    • The present invention provides a cleaner composition that can satisfactorily remove lead-free soldering flux adhered to the object to be cleaned, has little impact on the environment, and has odor, inflammability, etc., which are of an acceptable level for practical use; a rinsing agent for rinsing the cleaned object after cleaning with the cleaner composition to remove lead-free soldering flux more effectively; and a removal method using the composition (and the rinsing agent). The cleaner composition for the removal of lead-free soldering flux contains: (A) a polyoxyalkylene phosphate-based surfactant, (B) a metal chelating agent, and (C) a halogen-free organic solvent; and the rinsing agent for removal of lead-free soldering flux contains a carbonate represented by MaHb(CO3)C  General Formula (7) where a is an integer of 1 or 2, b is an integer of 0 to 2, c is an integer of 1 or 2, and M is a volatile organic base.
    • 本发明提供一种清洁剂组合物,其能够令人满意地除去附着在待清洗对象物上的无铅焊剂,对环境影响小,具有实用可接受水平的气味,易燃性等; 一种用清洁剂组合物清洁后清洗被清洁物体的清洗剂,以更有效地除去无铅焊剂; 和使用组合物(和漂洗剂)的去除方法。 用于去除无铅焊剂的清洁剂组合物包含:(A)聚氧化烯磷酸酯类表面活性剂,(B)金属螯合剂和(C)无卤素有机溶剂; 用于除去无铅焊剂的漂洗剂含有由<?in-line-formula description =“In-line Formulas”end =“lead”→> MaHb(CO3)C表示的碳酸酯通式(7)< ?in-line-formula description =“In-line Formulas”end =“tail”?>其中a为1或2的整数,b为0至2的整数,c为1或2的整数,以及 M是挥发性有机碱。