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1. 发明申请

US20170326850A1 LAMINATE PRODUCTION METHOD, SUBSTRATE PROCESSING METHOD, AND LAMINATE 审中-公开
公开(公告)号：US20170326850A1
公开(公告)日：2017-11-16
申请号：US15531527
申请日：2015-10-29
申请人： Tokyo Ohka Kogyo Co., Ltd.
发明人： Takahiro YOSHIOKA , Koki TAMURA , Hirofumi IMAI , Atsushi KUBO
IPC分类号： B32B27/28 , H01L21/02 , B32B37/12 , C09J7/02 , C09J181/06
CPC分类号： B32B27/283 , B32B7/12 , B32B9/005 , B32B9/04 , B32B9/045 , B32B17/00 , B32B27/00 , B32B27/06 , B32B27/286 , B32B27/308 , B32B37/12 , B32B43/006 , B32B2037/243 , B32B2037/268 , B32B2250/02 , B32B2255/00 , B32B2255/26 , B32B2307/30 , B32B2307/306 , B32B2307/412 , B32B2307/714 , B32B2307/732 , B32B2307/748 , B32B2309/02 , B32B2310/0843 , B32B2457/14 , C09J181/06 , C09J2203/326 , C09J2400/10 , C09J2481/00 , C09J2483/005 , H01L21/02008 , H01L21/02381 , H01L21/6835 , H01L2221/68327 , H01L2221/68381
摘要： A production method of a laminate including a substrate and a light-transmitting support plate that are laminated each other via an adhesive layer and a release layer that is altered through absorption of light, the method including a release layer forming step of coating a reactive polysilsesquioxane on a surface of the support plate, the surface being opposed to the substrate, and heating the reactive polysilsesquioxane to perform polymerization, thereby forming the release layer.

2. 发明授权

US5457149A Reworkable adhesive for electronic applications 失效
标题翻译：用于电子应用的返修胶
公开(公告)号：US5457149A
公开(公告)日：1995-10-10
申请号：US166271
申请日：1993-12-13
申请人： Joyce B. Hall , Peter B. Hogerton , Jean-Marc Pujol
发明人： Joyce B. Hall , Peter B. Hogerton , Jean-Marc Pujol
IPC分类号： H05K3/36 , C09J9/02 , C09J129/14 , C09J159/00 , C09J163/00 , C09J167/00 , C09J167/02 , C09J169/00 , C09J171/00 , C09J177/00 , C09J181/06 , C09J201/00 , H01B1/22 , H01L21/58 , H01L23/482 , H05K3/32 , C08L81/06 , C08L29/14 , C08L63/02
CPC分类号： H01L24/83 , C09J181/06 , C09J201/00 , H01B1/22 , H01L23/4828 , H01L24/28 , H01L24/98 , H05K3/323 , H05K3/361 , H01L2224/2919 , H01L2224/8319 , H01L2224/8388 , H01L2924/01005 , H01L2924/01006 , H01L2924/0101 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01016 , H01L2924/01019 , H01L2924/01023 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01044 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01052 , H01L2924/01055 , H01L2924/01067 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H05K2201/0129 , H05K2201/0145 , H05K2201/0154 , H05K2201/0239
摘要： Reworkable adhesive that has a high shear strength through a range of use temperatures but which has a low strength and is reworkable at a suitable processing temperature.
摘要翻译：可重复使用的粘合剂，其在一定范围的使用温度下具有高剪切强度，但是具有低强度并且在合适的加工温度下可再加工。

3. 发明授权

US5277947A Adhesives for laminating vinyl to various substrates 失效
标题翻译：用于将乙烯基层压到各种基材上的粘合剂
公开(公告)号：US5277947A
公开(公告)日：1994-01-11
申请号：US35989
申请日：1993-03-23
申请人： Ronald B. Case , Robert J. Statz
发明人： Ronald B. Case , Robert J. Statz
IPC分类号： B32B7/12 , C08L23/02 , C08L23/08 , C08L27/06 , C08L33/06 , C08L73/00 , C08L81/06 , C09J127/06 , C09J173/00 , C09J181/06 , C09J131/04 , B32B21/08 , B32B27/28
CPC分类号： C09J173/00 , B32B7/12 , C09J127/06 , C09J181/06 , C08L23/02 , C08L23/08 , C08L27/06 , C08L33/068 , C08L73/00 , C08L81/06 , Y10T428/31906 , Y10T428/3192 , Y10T428/31935
摘要： Adhesives suitable for preparing laminates of polyvinyl chloride or polyvinyl chloride copolymers with wood or metal are prepared from a three component polymer mixture of polyvinyl chloride or its copolymers itself, a direct ethylene copolymer and another direct ethylene copolymer containing units derived from a monomer containing glycidyl units. The adhesive is especially useful for preparing PVC/wood laminates which are subject to outdoor weathering.
摘要翻译：适用于制备聚氯乙烯或聚氯乙烯共聚物与木材或金属的层合物的粘合剂由聚氯乙烯或其共聚物本身的三组分聚合物混合物制备，直接乙烯共聚物和另一种直接乙烯共聚物，其含有衍生自含有缩水甘油基单元的单体的单元。粘合剂特别适用于制备经受室外风化的PVC /木材层压板。

4. 发明申请

US20190185626A1 AROMATIC POLYSULFONE AND AROMATIC POLYSULFONE COMPOSITION 审中-公开
公开(公告)号：US20190185626A1
公开(公告)日：2019-06-20
申请号：US16311239
申请日：2017-06-21
申请人： Sumitomo Chemical Company, Limited
发明人： Kazuyuki ITO , Yoshio SHODA
IPC分类号： C08G75/23 , C09J181/06
CPC分类号： C08G75/23 , C08G65/40 , C08G65/46 , C08G75/20 , C08L71/10 , C08L81/06 , C09J181/06 , G01N30/26 , G01N30/74 , G01N30/88
摘要： The invention provides an aromatic polysulfone including an aromatic polysulfone having at least one highly polar functional group at its terminus, wherein in the aromatic polysulfone, an area of a signal attributed to the aromatic polysulfone having a highly polar functional group with respect to a total area of all signals attributed to the aromatic polysulfone in a chromatogram obtained by measurement through a gel permeation chromatography method under the following conditions is 19% or more and 100% or less, wherein sample injection volume is 5 μL, column is “Shodex KF-803” manufactured by Showa Denko K.K., column temperature is 40° C., eluent is N,N-dimethylformamide, eluent flow rate is 0.5 mL/min, and detector is ultraviolet-visible spectrophotometer (UV).

5. 发明申请

US20130220677A1 Thermosetting Adhesive Composition, and Heat Resistant Adhesive Film and Wiring Film Using the Same 有权
标题翻译：热固性粘合剂组合物和耐热粘合剂膜和使用其的接线膜
公开(公告)号：US20130220677A1
公开(公告)日：2013-08-29
申请号：US13770225
申请日：2013-02-19
申请人： Hitachi Cable, Ltd. , Hitachi Cable Fine-Tech, Ltd.
发明人： Satoru AMOU , Tomiya ABE , Daisuke SHANAI , Hiroaki KOMATSU , Kenichi MURAKAMI
IPC分类号： C09J181/06 , H05K1/02 , B32B5/00
CPC分类号： C09J171/00 , B32B3/08 , B32B5/00 , B32B7/12 , B32B15/08 , B32B27/08 , B32B27/281 , B32B2307/306 , B32B2307/7246 , B32B2307/732 , B32B2457/08 , C08G2650/54 , C08L79/08 , C09J181/06 , H05K1/02 , H05K3/386 , H05K2201/0209 , H05K2201/0248 , Y10T428/26 , Y10T428/263 , Y10T428/264 , Y10T428/265 , Y10T428/266 , Y10T428/2826 , Y10T428/31681 , Y10T428/31721 , C08K5/3415 , C08K7/04
摘要： Provided are a thermosetting adhesive composition excellent in storage stability, reliability, and low-temperature adhesion properties; and a curl-resistant heat-resistant film and a wiring film obtained using the composition. The thermosetting adhesive composition includes 100 parts by weight of a phenoxy resin having a bisphenol S skeleton in the structure thereof; 5 to 30 parts by weight of a maleimide compound containing a plurality of maleimide groups in the structure thereof; and 3 to 20 vol % of an inorganic needle-like filler. The heat resistant adhesive film is obtained by applying the thermosetting adhesive composition onto a polyimide film, followed by drying. The wiring film is obtained by placing a conductor wiring layer on the heat resistant adhesive film.
摘要翻译：提供了保存稳定性，可靠性和低温粘合性优异的热固性粘合剂组合物; 以及使用该组合物得到的卷曲耐热膜和布线膜。热固性粘合剂组合物包含100重量份在其结构中具有双酚S骨架的苯氧基树脂; 5〜30重量份在其结构中含有多个马来酰亚胺基团的马来酰亚胺化合物; 和3〜20体积％的无机针状填料。通过将热固性粘合剂组合物涂布在聚酰亚胺膜上，然后干燥获得耐热粘合剂膜。通过将导体布线层放置在耐热粘合膜上而获得布线膜。

6. 发明授权

US06380322B1 Reworkable high temperature adhesives 失效
标题翻译：可重复使用的高温胶粘剂
公开(公告)号：US06380322B1
公开(公告)日：2002-04-30
申请号：US09335082
申请日：1999-06-17
申请人： Ching-Ping Wong , Jiali Wu
发明人： Ching-Ping Wong , Jiali Wu
IPC分类号： C09J16300
CPC分类号： C09J171/00 , C08L63/00 , C08L2666/22 , C09J163/00 , C09J181/02 , C09J181/06
摘要： A reworkable high temperature adhesive, comprising the reaction product of (a) a thermoplastic adhesive selected from the group consisting of polyetherimides, polyamide-imides, polysulfones, polyethersulfones, silicon-carbon thermosets, polyphenylene sulfides and mixtures thereof; (b) a metal acetonate; (c) an epoxy resin; (d) a crosslinker; (e) and a catalyst.
摘要翻译：一种可再加工的高温粘合剂，其包含（a）选自聚醚酰亚胺，聚酰胺 - 酰亚胺，聚砜，聚醚砜，硅 - 碳热固性材料，聚苯硫醚及其混合物的热塑性粘合剂的反应产物; （b）金属丙酮酸酯; （c）环氧树脂; （d）交联剂; （e）和催化剂。

7. 发明授权

US06359035B1 Adhesive for electroless plating and method of producing the same 有权
标题翻译：无电镀用粘合剂及其制造方法
公开(公告)号：US06359035B1
公开(公告)日：2002-03-19
申请号：US09509554
申请日：2000-04-13
申请人： Yoshitaka Ono , Taki Adachi
发明人： Yoshitaka Ono , Taki Adachi
IPC分类号： C08K311
CPC分类号： C09J181/02 , C09J171/12 , C09J181/06 , H05K3/4661 , H05K2201/0129 , H05K2201/0154 , H05K2201/0195 , H05K2201/0212 , H05K2203/0773 , H05K2203/0789 , H05K2203/0796
摘要： This adhesive for electroless plating can be produced without causing dust explosion and is excellent as an interlaminar resin insulating layer and is obtained by mixing an organic solvent dispersion of cured particles of heat resistant resin soluble or decomposable in an acid or an oxidizing agent with an uncured resin. The dispersion of the cured particles of the heat resistant resin in the organic solvent is obtained by dispersing cured particles formed in the production of heat resistant resin cured particles into the organic solvent without drying, and the uncured resin is a resin becoming hardly soluble in an acid or an oxidizing agent through curing treatment and capable of forming a heat resistant cured resin.
摘要翻译：可以制造无电镀用粘合剂，而不会引起粉尘爆炸，作为层间树脂绝缘层是优异的，并且通过将在酸或氧化剂中可溶或可分解的耐热树脂的固化颗粒的有机溶剂分散体与未固化的树脂。耐热树脂的固化颗粒在有机溶剂中的分散是通过将生产耐热树脂固化颗粒中形成的固化颗粒分散在有机溶剂中而不干燥而获得的，未固化树脂是难溶于酸或氧化剂通过固化处理并能够形成耐热固化树脂。

8. 发明授权

US12116504B2 Fluorinated poly(imide-phthalonitrile) adhesive formulations and related methods 有权
公开(公告)号：US12116504B2
公开(公告)日：2024-10-15
申请号：US17829521
申请日：2022-06-01
申请人： The Boeing Company
发明人： Ashley Marie Dustin , Kevin James Drummey , Phuong Bui , Gregory Phillip Nowak , Andrew P. Nowak
IPC分类号： C09J127/24 , C09J7/35 , C09J179/08 , C09J181/06
CPC分类号： C09J127/24 , C09J7/35 , C09J179/08 , C09J181/06 , C09J2203/35
摘要： Adhesive formulations for forming a fluorinated poly(imide-phthalonitrile) thermoset polymer are provided. Such an adhesive formulation may comprise a fluorinated imide-phthalonitrile oligomer having Formula IV

wherein R1 is an unsubstituted or substituted aryl group and does not comprise an ether group; R2 is an unsubstituted or substituted aryl group and does not comprise an ether group; at least one of R1 and R2 comprises a fluorine substituent; and n has a value of from 1 to 30.

9. 发明公开

US20230392055A1 FLUORINATED POLY(IMIDE-PHTHALONITRILE) ADHESIVE FORMULATIONS AND RELATED METHODS 审中-公开
公开(公告)号：US20230392055A1
公开(公告)日：2023-12-07
申请号：US17829521
申请日：2022-06-01
申请人： The Boeing Company
发明人： Ashley Marie Dustin , Kevin James Drummey , Phuong Bui , Gregory Phillip Nowak , Andrew P. Nowak
IPC分类号： C09J127/24 , C09J179/08 , C09J181/06 , C09J7/35
CPC分类号： C09J127/24 , C09J179/08 , C09J181/06 , C09J7/35 , C09J2203/35
摘要： Adhesive formulations for forming a fluorinated poly(imide-phthalonitrile) thermoset polymer are provided. Such an adhesive formulation may comprise a fluorinated imide-phthalonitrile oligomer having Formula IV

wherein R1 is an unsubstituted or substituted aryl group and does not comprise an ether group; R2 is an unsubstituted or substituted aryl group and does not comprise an ether group; at least one of R1 and R2 comprises a fluorine substituent; and n has a value of from 1 to 30.

10. 发明授权

US08518208B2 High performance adhesive compositions 有权
标题翻译：高性能粘合剂组合物
公开(公告)号：US08518208B2
公开(公告)日：2013-08-27
申请号：US12868836
申请日：2010-08-26
申请人： Dalip Kohli
发明人： Dalip Kohli
IPC分类号： C09J163/00 , B32B27/38 , C08L63/00 , C08G59/20 , C08G59/50
CPC分类号： C09J163/00 , C08J5/128 , C08L63/00 , C08L81/00 , C08L81/06 , C09J181/06 , Y10T428/31511 , Y10T428/31525
摘要： Thermosetting adhesive compositions formed from an epoxy resin containing nano-sized core-shell particles, one or more thermoplastic toughening agent containing an amine-terminated polyethersulfone, and at least one multi-functional epoxy resin, together with at least one amine curing agent to allow full cure of the adhesive composition up to 400° F. are provided herein. Such compositions are useful for forming adhesive films that can bond composite/metal/honeycomb structures for aerospace including bonding of aircraft leading or trailing edges, acoustic nacelle structures, horizontal and vertical tail, and various other structures, as well as for other high performance industrial applications.
摘要翻译：由包含纳米尺寸核 - 壳颗粒的环氧树脂，含有胺封端的聚醚砜的一种或多种热塑性增韧剂和至少一种多官能环氧树脂以及至少一种胺固化剂形成的热固性粘合剂组合物，以允许本文提供了高达400°F的粘合剂组合物的完全固化。这样的组合物可用于形成粘合剂膜，该粘合剂膜可以粘合用于航空航天的复合/金属/蜂窝结构，包括飞行器前缘或后缘的结合，声学机舱结构，水平和垂直尾部以及各种其它结构，以及用于其它高性能工业应用程序。

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