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1. 发明申请

US20180327558A1 HALOGEN-FREE RESIN COMPOSITION AND PREPREG AND LAMINATE PREPARED THEREFROM 审中-公开
公开(公告)号：US20180327558A1
公开(公告)日：2018-11-15
申请号：US15525884
申请日：2014-12-02
申请人： SHENGYI TECHNOLOGY CO., LTD.
发明人： Hui Li , Kehong Fang
IPC分类号： C08J5/24 , B32B5/02 , B32B27/12 , B32B27/38 , C08L63/00 , H05K1/03
CPC分类号： C08J5/24 , B32B5/022 , B32B5/024 , B32B27/04 , B32B27/12 , B32B27/38 , B32B2255/02 , B32B2255/26 , B32B2262/101 , B32B2457/08 , C08J2363/00 , C08J2435/06 , C08J2471/12 , C08J2479/04 , C08L63/00 , C08L2201/02 , H05K1/0373 , H05K1/038 , H05K2201/012 , H05K2201/0209 , H05K2201/029 , C08K3/36 , C08L35/06 , C08L71/12
摘要： A halogen-free resin composition and a prepreg and a laminate prepared therefrom. The halogen-free resin composition comprises the following ingredients in parts by weight: 50-100 parts of an epoxy resin, 20-70 parts of benzoxazine, 5-40 parts of polyphenyl ether, 5-30 parts of styrene-maleic anhydride, 5-40 parts of a halogen-free flame retardant, 0.2-5 parts of a curing accelerator, and 20-100 parts of a filler. The prepreg and the laminate, which are manufactured from the halogen-free resin composition, have the comprehensive properties of low dielectric constant, low dielectric loss, excellent heat resistance, adhesive property and wet resistance and the like, and are suitable for being applied to halogen-free high-frequency multilayer circuit boards.

2. 发明申请

US20180134856A1 Press-Molded Product and Composite Material 审中-公开
公开(公告)号：US20180134856A1
公开(公告)日：2018-05-17
申请号：US15571429
申请日：2016-08-02
申请人： Teijin Limited
发明人： Akihisa Nomura , Katsuaki Yuasa , Guofei Hua
IPC分类号： C08J5/04 , C08K7/02 , C08L77/00
CPC分类号： C08J5/042 , C08J5/04 , C08J5/06 , C08J2371/10 , C08J2371/12 , C08J2377/02 , C08J2377/06 , C08J2425/06 , C08J2471/10 , C08J2471/12 , C08J2477/02 , C08J2477/06 , C08K7/02 , C08K7/06 , C08L71/12 , C08L77/00
摘要： A press-molded product includes: carbon fibers having a weight average fiber length of 1 mm or more; a polyamide-based resin (X); and a polyarylene ether-based resin (Y). The carbon fibers include carbon fiber bundles. The polyamide-based resin (X) and the polyarylene ether-based resin (Y) form a sea-island structure inside and outside the carbon fiber bundles. In the sea-island structure, one of the polyamide-based resin (X) and the polyarylene ether-based resin (Y) forms a sea phase and the other forms an island phase having a particle diameter Dr of 0.05 μm or more and less than 50 μm.

3. 发明申请

US20170247566A1 PARTICULATE POLY(PHENYLENE ETHER)-CONTAINING VARNISH COMPOSITION, COMPOSITE AND LAMINATE PREPARED THEREFROM, AND METHOD OF FORMING COMPOSITE 审中-公开
公开(公告)号：US20170247566A1
公开(公告)日：2017-08-31
申请号：US15519300
申请日：2015-09-24
申请人： SABIC GLOBAL TECHNOLOGIES B.V.
发明人： Eylem TARKIN-TAS , Edward Norman PETERS
IPC分类号： C09D171/12 , C09D163/04 , C08J5/24 , B32B5/26 , C09D179/04 , C09D163/00 , B32B5/02 , C09D7/00 , C08J5/04
CPC分类号： C09D171/12 , B32B5/02 , B32B5/022 , B32B5/08 , B32B5/22 , B32B5/26 , B32B2250/20 , B32B2260/021 , B32B2260/023 , B32B2260/046 , B32B2262/0269 , B32B2262/101 , B32B2262/106 , B32B2262/14 , B32B2264/02 , B32B2264/0214 , B32B2307/204 , B32B2457/08 , C08J5/043 , C08J5/24 , C08J2363/02 , C08J2363/04 , C08J2371/12 , C08J2379/04 , C08J2471/12 , C08L71/12 , C09D7/20 , C09D163/00 , C09D163/04 , C09D179/04 , C08L63/00 , C08L79/04 , C08L9/00 , C08L83/04
摘要： A curable composition includes specific amounts of a ketone, a curable component, and particulate poly(phenylene ether) having a mean particle size of 3 to 12 micrometers and a particle size relative standard deviation of 20 to 60 percent. The composition has a low viscosity that facilitates wetting of reinforcing structures, and composites formed from the composition and a reinforcing structure cure to form a dielectric material with a low dielectric constant and loss tangent.

4. 发明申请

US20170088669A1 PHOSPHORUS-CONTAINING POLYPHENYLENE OXIDE RESIN, ITS PREPARATION METHOD, METHOD FOR PREPARING PREPOLYMER OF PHOSPHORUS-CONTAINING POLYPHENYLENE OXIDE, RESIN COMPOSITION AND ITS APPLICATION 审中-公开
公开(公告)号：US20170088669A1
公开(公告)日：2017-03-30
申请号：US15224773
申请日：2016-08-01
申请人： Elite Material Co., Ltd.
发明人： Chen-Yu HSIEH , Tse-An LEE , Hui-Ting SHIH
IPC分类号： C08G65/48 , C08K5/5399 , C08K5/3415 , H05K1/03 , C08K5/14 , C08J5/24 , C09D179/00 , C08L73/00 , C08K3/36
CPC分类号： C08G65/485 , C08J5/24 , C08J2371/12 , C08J2379/00 , C08J2471/12 , C08K3/36 , C08K5/14 , C08K5/3415 , C08K5/5399 , C08L73/00 , C09D179/00 , H05K1/0373 , H05K2201/012
摘要： The present invention relates to a phosphorus-containing polyphenylene oxide resin, its preparation method, a method for preparing the prepolymer of the phosphorus-containing polyphenylene oxide, a resin composition and an article thereof, wherein the phosphorus-containing polyphenylene oxide resin has a chemical structure represented by the following formula (I): wherein R′ is R″ is R′″ is hydrogen, Through the use of the above phosphorus-containing polyphenylene oxide resin, an article made from the resin composition can has good flame retardance, good thermal resistance and a lower percent of thermal expansion while dielectric properties can be maintained, such that the present invention is suitable for use in products such as copper clad laminate and printed circuit board.

5. 发明申请

US20150159016A1 THERMOSET RESIN COMPOSITION, AND PREPREG AND LAMINATE FOR PRINTED CIRCUIT BOARD MANUFACTURED THEREFROM 有权
标题翻译：热固性树脂组合物及其制造的印刷电路板的制备和层压板
公开(公告)号：US20150159016A1
公开(公告)日：2015-06-11
申请号：US14367337
申请日：2011-12-29
申请人： Yungdong Meng , Kehong Fang
发明人： Yungdong Meng , Kehong Fang
IPC分类号： C08L79/00 , C08L71/12 , C08L63/00 , C08J5/24
CPC分类号： C08L79/00 , C08J5/24 , C08J2363/00 , C08J2371/12 , C08J2379/00 , C08J2463/00 , C08J2471/12 , C08J2479/00 , C08K5/5313 , C08L63/00 , C08L71/12 , C08L71/126 , C08L2201/02 , C08L2205/03 , H05K2201/029 , H05K2201/0293 , Y10T428/31522 , Y10T442/20 , C08L79/04
摘要： The present invention relates to a thermoset resin composition, and a prepreg and a laminate for a printed circuit board manufactured therefrom. The thermoset resin composition comprises the following components: a phosphorus-containing polyphenyl ether resin having low molecular weight, an epoxy resin, a cyanate resin and an accelerator. The prepreg manufactured using the resin composition comprises a base material and the thermoset resin composition adhered to the base material by impregnation and drying. The laminate for a printed circuit board manufactured using the resin composition comprises a plurality of laminated prepregs, a metal foil covering one or two faces of the laminated prepregs by pressing, with each prepreg comprising a base material and the thermoset resin composition adhered to the base material by impregnation and drying. The thermoset resin composition of the present invention has properties such as a low dielectric constant and a dielectric dissipation factor, high heat resistance, a high glass transition temperature, and flame retardancy, etc. The laminates for a printed circuit board manufactured using same have excellent metal foil peel strength, heat resistance and dielectric properties, and are suitable for high frequency and high speed electronic circuit boards.
摘要翻译：本发明涉及一种热固性树脂组合物，以及由其制成的用于印刷电路板的预浸料和层压材料。热固性树脂组合物包含以下组分：低分子量的含磷聚苯醚树脂，环氧树脂，氰酸酯树脂和促进剂。使用树脂组合物制造的预浸料包含基材，并且通过浸渍和干燥将热固性树脂组合物粘附到基材上。使用该树脂组合物制造的印刷电路板用层压体包括多层叠预浸料，通过压制覆盖层叠预浸料坯的一面或两面的金属箔，每个预浸料坯包含基材，并且热固性树脂组合物粘附于基材材料通过浸渍和干燥。本发明的热固性树脂组合物具有低介电常数和介电损耗因子，高耐热性，高玻璃化转变温度和阻燃性等性质。使用该印刷电路板制造的印刷电路板的层压板具有优异的金属箔剥离强度，耐热性和介电性能，适用于高频高速电路板。

6. 发明申请

US20140050913A1 HIGHLY INSULATING FILM 有权
标题翻译：高绝缘膜
公开(公告)号：US20140050913A1
公开(公告)日：2014-02-20
申请号：US14113485
申请日：2012-04-25
申请人： Takashi Nakahiro , Dai Nakagawa , Tetsuo Yoshida , Masanori Nishiyama
发明人： Takashi Nakahiro , Dai Nakagawa , Tetsuo Yoshida , Masanori Nishiyama
IPC分类号： C08L25/06
CPC分类号： C08L25/06 , B29C37/0025 , B29C55/026 , B29C55/143 , B29K2025/04 , B29K2071/12 , C08J5/18 , C08J2325/04 , C08J2471/12 , H01B17/56 , Y10T428/265 , Y10T428/31663 , Y10T428/31801 , Y10T428/31938
摘要： An object of this invention is to provide a highly insulating film, which is excellent in the heat resistance and has increased breakdown voltage. This invention is a highly insulating film, which is characterized by comprising a biaxially stretched film containing a styrene polymer having a syndiotactic structure as a main component, containing a thermoplastic amorphous resin Y having a glass transition temperature Tg by DSC of 130° C. or higher in an amount of 5% by mass or more and 48% by mass or less, and having a plane orientation coefficient (ΔP) represented by the following equation (1) of −0.027 or less. ΔP=(Nx+Ny)/2−Nz (1) (Here, in the equation (1), Nx represents the minimum value of the refractive index in the plane direction of the film, Ny represents the refractive index in the direction perpendicular to Nx in the plane direction of the film, and Nz represents the refractive index in the thickness direction of the film.)
摘要翻译：本发明的目的是提供一种耐热性优异并且具有增加的击穿电压的高绝缘膜。本发明是一种高度绝缘的膜，其特征在于包含含有间同立构结构作为主要成分的苯乙烯聚合物的双轴拉伸膜，其含有DSC为130℃的玻璃化转变温度Tg的热塑性无定形树脂Y，或者 5质量％以上且48质量％以下的具有以下式（1）表示的面取向系数（ΔP）为-0.027以下的量。 ΔP=（Nx + Ny）/ 2-Nz（1）（这里，在式（1）中，Nx表示膜的平面方向的折射率的最小值，Ny表示垂直方向的折射率在膜的平面方向上为Nx，Nz表示膜的厚度方向的折射率。）

7. 发明申请

US20100081030A1 METHOD FOR PRODUCING POLYMER ELECTROLYTE MEMBRANE AND POLYMER ELECTROLYTE MEMBRANE 审中-公开
标题翻译：聚合物电解质膜和聚合物电解质膜的制备方法
公开(公告)号：US20100081030A1
公开(公告)日：2010-04-01
申请号：US12516314
申请日：2007-11-26
申请人： Mitsunori Nodono
发明人： Mitsunori Nodono
IPC分类号： H01M8/10 , B05D5/12
CPC分类号： H01B1/122 , C08G65/4012 , C08G75/23 , C08J5/2256 , C08J2381/06 , C08J2387/00 , C08J2471/12 , C08L2205/05 , H01M8/1004 , H01M8/1025 , H01M8/1027 , H01M8/1032 , H01M8/1039 , H01M8/1067 , H01M8/1088 , H01M2008/1095 , H01M2300/0082 , Y02P70/56
摘要： A method for producing a polymer electrolyte membrane including: (i) a preparation step for preparing a polymer electrolyte solution by dissolving a polymer electrolyte containing an ion conductive polymer having an ion-exchange group in an organic solvent capable of dissolving the polymer electrolyte, (ii) a coating step for obtaining a polymer electrolyte membrane intermediate containing the ion conductive polymer by a solution casting method using the polymer electrolyte solution obtained in the step (i), and (iii) a washing step for washing the polymer electrolyte membrane intermediate obtained in the step (ii) by bringing the polymer electrolyte membrane intermediate into contact with a washing solvent; wherein the concentration of the organic solvent in the washing solvent brought into contact with the polymer electrolyte membrane intermediate in the washing step (iii) is 2500 ppm by weight or lower.
摘要翻译：一种高分子电解质膜的制造方法，其特征在于，具备：（i）将含有具有离子交换基团的离子导电性聚合物的高分子电解质溶解在能够溶解高分子电解质的有机溶剂中的高分子电解质溶液的制备工序， ii）通过使用在步骤（i）中获得的聚合物电解质溶液的溶液流延法获得含有离子导电聚合物的聚合物电解质膜中间体的涂布步骤，和（iii）用于洗涤所获得的聚合物电解质膜中间体的洗涤步骤在步骤（ii）中使聚合物电解质膜中间体与洗涤溶剂接触; 其中在洗涤步骤（iii）中与所述聚合物电解质膜中间体接触的洗涤溶剂中的有机溶剂的浓度为2500ppm重量或更低。

8. 发明授权

US4390642A Flame-retardant, thermosetting foam product and method of preparing same 失效
标题翻译：阻燃，热固性泡沫产品及其制备方法
公开(公告)号：US4390642A
公开(公告)日：1983-06-28
申请号：US281290
申请日：1981-07-07
申请人： Stuart B. Smith
发明人： Stuart B. Smith
IPC分类号： C08G18/38 , C08G18/54 , C08G18/67 , C08J9/00 , C08G18/32
CPC分类号： C08J9/0061 , C08G18/3851 , C08G18/542 , C08G18/6705 , C08G2101/0025 , C08G2101/005 , C08G2101/0058 , C08J2361/06 , C08J2371/12 , C08J2461/06 , C08J2471/12 , Y10S521/902 , Y10S521/906
摘要： A flame-retardant, rigid, thermosetting foam product is prepared by reacting, in the presence of a blowing agent and a catalyst, particularly an organic metal catalyst, a furfural alcohol polymer, a phenol-formaldehyde resin, a melamine and methylene diphenyl isocyanate, which reaction provides for a rigid foam characterized by low friability and good heat- and flame-resistant properties.
摘要翻译：通过在发泡剂和催化剂存在下，特别是有机金属催化剂，糠醛醇聚合物，酚醛树脂，三聚氰胺和亚甲基二苯基异氰酸酯反应来制备阻燃，刚性，热固性泡沫产品，该反应提供了一种刚性泡沫，其特征在于具有低脆性和良好的耐热和阻燃性能。

9. 发明申请

US20180258245A1 FLEXIBLE FOAM WITH IMPROVED INSULATION PROPERTIES 审中-公开
公开(公告)号：US20180258245A1
公开(公告)日：2018-09-13
申请号：US15455734
申请日：2017-03-10
申请人： Armacell Enterprise GmbH & Co. KG
发明人： Christoph ZAUNER , Miroslav BETTERMANN
IPC分类号： C08J9/00 , C08J9/10
CPC分类号： C08J9/0061 , C08J9/0014 , C08J9/0019 , C08J9/0023 , C08J9/0038 , C08J9/0066 , C08J9/0095 , C08J9/103 , C08J2201/026 , C08J2201/03 , C08J2205/052 , C08J2205/06 , C08J2309/02 , C08J2311/00 , C08J2400/102 , C08J2409/00 , C08J2423/28 , C08J2427/06 , C08J2431/04 , C08J2463/00 , C08J2471/12
摘要： An expanded polymeric material which consists of at least 200 phr, preferably at least 300 phr, but less than 1000 phr, preferably less than 700 phr ingredients in total, comprising 100 phr of at least one polymer, of which at least one is a sulphur and/or metal oxide crosslinkable elastomer and at least 40 phr, preferably at least 55 phr of at least one polymeric flame retardant, preferably a brominated polymeric flame retardant.

10. 发明申请

US20180201737A1 COMPOSITIONS FOR USE IN FUSED FILAMENT 3D FABRICATION AND METHOD FOR MANUFACTURING SAME 审中-公开
公开(公告)号：US20180201737A1
公开(公告)日：2018-07-19
申请号：US15922302
申请日：2018-03-15
申请人： AREVO, INC.
发明人： Hemant Bheda , Kunal Patel
IPC分类号： C08J3/00 , B29C64/141 , C08J3/20
CPC分类号： C08J3/005 , B29C48/02 , B29C48/022 , B29C48/92 , B29C64/118 , B29C64/141 , B29L2031/731 , B33Y10/00 , B33Y70/00 , C08G2650/40 , C08J3/203 , C08J2367/02 , C08J2369/00 , C08J2377/00 , C08J2469/00 , C08J2471/12 , C08J2479/08 , C08J2481/06 , C08L67/02 , C08L69/00 , C08L71/00 , C08L71/123 , C08L81/06 , C08L79/08
摘要： A method for forming a blended material for use as a deposition material in a fused filament fabrication (FFF) printer is provided. A semi-crystalline material and an amorphous material are physically mixed at an appropriate ratio. The mixed material is then heated to a temperature that is above the melting point of the semi-crystalline material and above the glass transition temperature of the amorphous material to form a blended material. The blended material is then extruded through an extruder die for use in the FFF printer.

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