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1. 发明公开

US20240384022A1 RESIN COMPOSITION AND ARTICLE MADE THEREFROM 审中-公开
公开(公告)号：US20240384022A1
公开(公告)日：2024-11-21
申请号：US18221850
申请日：2023-07-13
申请人： ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD.
发明人： Yan ZHANG , Tianyu CAI , Diya LIU
IPC分类号： C08F261/02 , C08J5/24 , C08L51/08 , H05K1/03
CPC分类号： C08F261/02 , C08J5/244 , C08L51/08 , H05K1/0326 , C08J2351/08 , C08J2471/12 , C08L2205/025 , C08L2205/03
摘要： The present disclosure provides a resin composition and an article made therefrom, and the article comprises a prepreg, a resin film, a laminate, or a printed circuit board. The resin composition comprises (A) 100 parts by weight of an unsaturated C═C double bond-containing polyphenylene ether resin and (B) 20 parts by weight to 60 parts by weight of a phosphorus-containing compound represented by Formula (1). The article has an improvement in at least one or more or all of the glass transition temperature, the dielectric constant, the dissipation factor, the flame retardancy, the percent thermal expansion at Z-axis, the water absorption rate, the interlayer bonding strength, and alkali resistance.

2. 发明授权

US12098257B2 Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board 有权
公开(公告)号：US12098257B2
公开(公告)日：2024-09-24
申请号：US17626881
申请日：2020-07-16
申请人： PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
发明人： Hirosuke Saito , Yiqun Wang , Hiroharu Inoue
IPC分类号： C08J5/24 , B32B5/02 , B32B15/092 , B32B15/14 , B32B15/20 , B32B27/08 , B32B27/28 , B32B27/34 , B32B27/36 , B32B27/38 , C08L63/08 , H05K1/03 , H05K3/02
CPC分类号： C08J5/249 , B32B5/02 , B32B15/092 , B32B15/14 , B32B15/20 , B32B27/08 , B32B27/281 , B32B27/286 , B32B27/288 , B32B27/34 , B32B27/36 , B32B27/365 , B32B27/38 , C08J5/24 , C08L63/08 , H05K1/0353 , H05K1/036 , H05K3/022 , B32B2260/046 , B32B2307/206 , B32B2457/04 , B32B2457/08 , C08J2363/08 , C08J2453/00 , C08J2471/12 , C08L2205/03
摘要： An aspect of the present invention is a resin composition containing a polybutadiene compound having an epoxy group in a molecule, a polyphenylene ether compound having at least one of a group represented by the following Formula (1) and a group represented by the following Formula (2) in a molecule, a styrene-based block copolymer, and a curing agent.

In Formula (1), p represents 0 to 10, Z represents an arylene group, and R1 to R3 each independently represent a hydrogen atom or an alkyl group.

In Formula (2), R4 represents a hydrogen atom or an alkyl group.

3. 发明授权

US12091542B2 Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board 有权
公开(公告)号：US12091542B2
公开(公告)日：2024-09-17
申请号：US17059655
申请日：2019-05-31
申请人： Mitsubishi Gas Chemical Company, Inc.
发明人： Saori Honda , Katsuya Yamamoto , Kazuyuki Higashita , Yoshitaka Ueno
IPC分类号： C08L53/02 , B32B5/02 , B32B15/08 , B32B15/14 , B32B15/20 , C08J5/24 , C08L71/12 , C09D153/02 , C09D171/12 , H05K1/03
CPC分类号： C08L53/02 , B32B5/024 , B32B15/08 , B32B15/14 , B32B15/20 , C08J5/24 , C08L71/123 , C08L71/126 , C09D153/02 , C09D171/12 , H05K1/0346 , H05K1/0373 , B32B2260/046 , B32B2262/101 , B32B2264/1021 , B32B2307/204 , B32B2307/3065 , B32B2457/08 , C08J2325/10 , C08J2353/02 , C08J2371/12 , C08J2425/10 , C08J2453/02 , C08J2471/12 , C08L2205/025 , C08L53/02 , C08L71/126 , C08K3/36 , C08K5/315 , C08K5/3415 , C08L71/126 , C08L53/02 , C08K3/36 , C08K5/315 , C08K5/3415 , C08L25/16 , C08L53/02 , C08L71/126 , C08L71/126 , C08K3/36 , C08K5/315 , C08K5/3415 , C08L25/16 , C08L53/025 , C08L71/126 , C08L71/126 , C08K3/36 , C08K5/315 , C08K5/3415 , C08K5/521
摘要： A resin composition contains a maleimide compound (A), a cyanate ester compound (B), a polyphenylene ether compound (C) with a number average molecular weight of not lower than 1000 and not higher than 7000 and represented by Formula (1), and a block copolymer (D) having a styrene backbone. In Formula (1), X represents an aryl group; —(Y—O)n2- represents a polyphenylene ether moiety; R1, R2, and R3 each independently represent a hydrogen atom, an alkyl group, an alkenyl group, or an alkynyl group; n2 represents an integer of from 1 to 100; n1 represents an integer of from 1 to 6; and n3 represents an integer of from 1 to 4.

4. 发明公开

US20240101769A1 THERMOFORMABLE POLYMERIC SHEETS BASED ON PSEUDO-AMORPHOUS POLYARYLETHER KETONE 审中-公开
公开(公告)号：US20240101769A1
公开(公告)日：2024-03-28
申请号：US17768004
申请日：2020-10-14
申请人： Arkema France
发明人： Roderick REBER, III , Jason LYONS , Julien JOUANNEAU , Bruce CLAY
IPC分类号： C08J5/18 , B29C51/00 , B29C51/08
CPC分类号： C08J5/18 , B29C51/002 , B29C51/08 , C08J2471/12
摘要： Sheets having thicknesses of from 1000 to 10,000 microns which are useful for the production of thermoformed semi-crystalline articles are based on polyaryletherketones having viscosities at 360° C. of at least about 400 Pas at 100 s−1 as measured by parallel plate rheometer. The polyaryletherketones are in a pseudo-amorphous state in the thermoformable sheets.

5. 发明公开

US20230392002A1 METHOD FOR EVALUATING COMPATIBILITY OF THERMOSETTING RESIN COMPOSITION, THERMOSETTING RESIN COMPOSITION, PREPREG, RESIN FILM, LAMINATED PLATE, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE 审中-公开
公开(公告)号：US20230392002A1
公开(公告)日：2023-12-07
申请号：US18257146
申请日：2021-12-10
申请人： Resonac Corporation
发明人： Shuichi ISHIBASHI , Daisuke FUJIMOTO , Tomohiko KOTAKE
IPC分类号： C08L35/00 , C08K3/36 , C08J5/24 , C08J5/18 , G01N23/2251 , G01N33/44 , H01L23/498
CPC分类号： C08L35/00 , C08K3/36 , C08J5/249 , C08J5/18 , G01N23/2251 , G01N33/44 , H01L23/49894 , H01L23/49822 , C08L2205/035 , C08L2203/20 , C08J2335/00 , C08J2471/12 , C08J2447/00 , C08J2453/02
摘要： A method for evaluating the compatibility of a thermosetting resin composition containing at least two kinds of resins and an inorganic filler, the method including the following steps 1A and 2A: Step 1A: a step of obtaining a reflected electronic image of the cross section of a cured product of the thermosetting resin composition using a scanning electron microscope at an observation magnification of 50 to 250 times; and Step 2A: a step in which, in the reflected electronic image, a phase-separated resin region is referred to as a separation part and the remaining region is referred to as a non-separation part, and the image is binarized such that the separation part has one value and the non-separation part has the other value, and the area ratio of the region of the non-separation part of the resultant binarized image to the total region of the binarized image (area of the region of the non-separation part×100/area of the total region of the binarized image) is calculated as the area ratio Rw of the non-separation part.

6. 发明申请

US20180327558A1 HALOGEN-FREE RESIN COMPOSITION AND PREPREG AND LAMINATE PREPARED THEREFROM 审中-公开
公开(公告)号：US20180327558A1
公开(公告)日：2018-11-15
申请号：US15525884
申请日：2014-12-02
申请人： SHENGYI TECHNOLOGY CO., LTD.
发明人： Hui Li , Kehong Fang
IPC分类号： C08J5/24 , B32B5/02 , B32B27/12 , B32B27/38 , C08L63/00 , H05K1/03
CPC分类号： C08J5/24 , B32B5/022 , B32B5/024 , B32B27/04 , B32B27/12 , B32B27/38 , B32B2255/02 , B32B2255/26 , B32B2262/101 , B32B2457/08 , C08J2363/00 , C08J2435/06 , C08J2471/12 , C08J2479/04 , C08L63/00 , C08L2201/02 , H05K1/0373 , H05K1/038 , H05K2201/012 , H05K2201/0209 , H05K2201/029 , C08K3/36 , C08L35/06 , C08L71/12
摘要： A halogen-free resin composition and a prepreg and a laminate prepared therefrom. The halogen-free resin composition comprises the following ingredients in parts by weight: 50-100 parts of an epoxy resin, 20-70 parts of benzoxazine, 5-40 parts of polyphenyl ether, 5-30 parts of styrene-maleic anhydride, 5-40 parts of a halogen-free flame retardant, 0.2-5 parts of a curing accelerator, and 20-100 parts of a filler. The prepreg and the laminate, which are manufactured from the halogen-free resin composition, have the comprehensive properties of low dielectric constant, low dielectric loss, excellent heat resistance, adhesive property and wet resistance and the like, and are suitable for being applied to halogen-free high-frequency multilayer circuit boards.

7. 发明申请

US20180134856A1 Press-Molded Product and Composite Material 审中-公开
公开(公告)号：US20180134856A1
公开(公告)日：2018-05-17
申请号：US15571429
申请日：2016-08-02
申请人： Teijin Limited
发明人： Akihisa Nomura , Katsuaki Yuasa , Guofei Hua
IPC分类号： C08J5/04 , C08K7/02 , C08L77/00
CPC分类号： C08J5/042 , C08J5/04 , C08J5/06 , C08J2371/10 , C08J2371/12 , C08J2377/02 , C08J2377/06 , C08J2425/06 , C08J2471/10 , C08J2471/12 , C08J2477/02 , C08J2477/06 , C08K7/02 , C08K7/06 , C08L71/12 , C08L77/00
摘要： A press-molded product includes: carbon fibers having a weight average fiber length of 1 mm or more; a polyamide-based resin (X); and a polyarylene ether-based resin (Y). The carbon fibers include carbon fiber bundles. The polyamide-based resin (X) and the polyarylene ether-based resin (Y) form a sea-island structure inside and outside the carbon fiber bundles. In the sea-island structure, one of the polyamide-based resin (X) and the polyarylene ether-based resin (Y) forms a sea phase and the other forms an island phase having a particle diameter Dr of 0.05 μm or more and less than 50 μm.

8. 发明申请

US20170247566A1 PARTICULATE POLY(PHENYLENE ETHER)-CONTAINING VARNISH COMPOSITION, COMPOSITE AND LAMINATE PREPARED THEREFROM, AND METHOD OF FORMING COMPOSITE 审中-公开
公开(公告)号：US20170247566A1
公开(公告)日：2017-08-31
申请号：US15519300
申请日：2015-09-24
申请人： SABIC GLOBAL TECHNOLOGIES B.V.
发明人： Eylem TARKIN-TAS , Edward Norman PETERS
IPC分类号： C09D171/12 , C09D163/04 , C08J5/24 , B32B5/26 , C09D179/04 , C09D163/00 , B32B5/02 , C09D7/00 , C08J5/04
CPC分类号： C09D171/12 , B32B5/02 , B32B5/022 , B32B5/08 , B32B5/22 , B32B5/26 , B32B2250/20 , B32B2260/021 , B32B2260/023 , B32B2260/046 , B32B2262/0269 , B32B2262/101 , B32B2262/106 , B32B2262/14 , B32B2264/02 , B32B2264/0214 , B32B2307/204 , B32B2457/08 , C08J5/043 , C08J5/24 , C08J2363/02 , C08J2363/04 , C08J2371/12 , C08J2379/04 , C08J2471/12 , C08L71/12 , C09D7/20 , C09D163/00 , C09D163/04 , C09D179/04 , C08L63/00 , C08L79/04 , C08L9/00 , C08L83/04
摘要： A curable composition includes specific amounts of a ketone, a curable component, and particulate poly(phenylene ether) having a mean particle size of 3 to 12 micrometers and a particle size relative standard deviation of 20 to 60 percent. The composition has a low viscosity that facilitates wetting of reinforcing structures, and composites formed from the composition and a reinforcing structure cure to form a dielectric material with a low dielectric constant and loss tangent.

9. 发明申请

US20170088669A1 PHOSPHORUS-CONTAINING POLYPHENYLENE OXIDE RESIN, ITS PREPARATION METHOD, METHOD FOR PREPARING PREPOLYMER OF PHOSPHORUS-CONTAINING POLYPHENYLENE OXIDE, RESIN COMPOSITION AND ITS APPLICATION 审中-公开
公开(公告)号：US20170088669A1
公开(公告)日：2017-03-30
申请号：US15224773
申请日：2016-08-01
申请人： Elite Material Co., Ltd.
发明人： Chen-Yu HSIEH , Tse-An LEE , Hui-Ting SHIH
IPC分类号： C08G65/48 , C08K5/5399 , C08K5/3415 , H05K1/03 , C08K5/14 , C08J5/24 , C09D179/00 , C08L73/00 , C08K3/36
CPC分类号： C08G65/485 , C08J5/24 , C08J2371/12 , C08J2379/00 , C08J2471/12 , C08K3/36 , C08K5/14 , C08K5/3415 , C08K5/5399 , C08L73/00 , C09D179/00 , H05K1/0373 , H05K2201/012
摘要： The present invention relates to a phosphorus-containing polyphenylene oxide resin, its preparation method, a method for preparing the prepolymer of the phosphorus-containing polyphenylene oxide, a resin composition and an article thereof, wherein the phosphorus-containing polyphenylene oxide resin has a chemical structure represented by the following formula (I): wherein R′ is R″ is R′″ is hydrogen, Through the use of the above phosphorus-containing polyphenylene oxide resin, an article made from the resin composition can has good flame retardance, good thermal resistance and a lower percent of thermal expansion while dielectric properties can be maintained, such that the present invention is suitable for use in products such as copper clad laminate and printed circuit board.

10. 发明申请

US20150159016A1 THERMOSET RESIN COMPOSITION, AND PREPREG AND LAMINATE FOR PRINTED CIRCUIT BOARD MANUFACTURED THEREFROM 有权
标题翻译：热固性树脂组合物及其制造的印刷电路板的制备和层压板
公开(公告)号：US20150159016A1
公开(公告)日：2015-06-11
申请号：US14367337
申请日：2011-12-29
申请人： Yungdong Meng , Kehong Fang
发明人： Yungdong Meng , Kehong Fang
IPC分类号： C08L79/00 , C08L71/12 , C08L63/00 , C08J5/24
CPC分类号： C08L79/00 , C08J5/24 , C08J2363/00 , C08J2371/12 , C08J2379/00 , C08J2463/00 , C08J2471/12 , C08J2479/00 , C08K5/5313 , C08L63/00 , C08L71/12 , C08L71/126 , C08L2201/02 , C08L2205/03 , H05K2201/029 , H05K2201/0293 , Y10T428/31522 , Y10T442/20 , C08L79/04
摘要： The present invention relates to a thermoset resin composition, and a prepreg and a laminate for a printed circuit board manufactured therefrom. The thermoset resin composition comprises the following components: a phosphorus-containing polyphenyl ether resin having low molecular weight, an epoxy resin, a cyanate resin and an accelerator. The prepreg manufactured using the resin composition comprises a base material and the thermoset resin composition adhered to the base material by impregnation and drying. The laminate for a printed circuit board manufactured using the resin composition comprises a plurality of laminated prepregs, a metal foil covering one or two faces of the laminated prepregs by pressing, with each prepreg comprising a base material and the thermoset resin composition adhered to the base material by impregnation and drying. The thermoset resin composition of the present invention has properties such as a low dielectric constant and a dielectric dissipation factor, high heat resistance, a high glass transition temperature, and flame retardancy, etc. The laminates for a printed circuit board manufactured using same have excellent metal foil peel strength, heat resistance and dielectric properties, and are suitable for high frequency and high speed electronic circuit boards.
摘要翻译：本发明涉及一种热固性树脂组合物，以及由其制成的用于印刷电路板的预浸料和层压材料。热固性树脂组合物包含以下组分：低分子量的含磷聚苯醚树脂，环氧树脂，氰酸酯树脂和促进剂。使用树脂组合物制造的预浸料包含基材，并且通过浸渍和干燥将热固性树脂组合物粘附到基材上。使用该树脂组合物制造的印刷电路板用层压体包括多层叠预浸料，通过压制覆盖层叠预浸料坯的一面或两面的金属箔，每个预浸料坯包含基材，并且热固性树脂组合物粘附于基材材料通过浸渍和干燥。本发明的热固性树脂组合物具有低介电常数和介电损耗因子，高耐热性，高玻璃化转变温度和阻燃性等性质。使用该印刷电路板制造的印刷电路板的层压板具有优异的金属箔剥离强度，耐热性和介电性能，适用于高频高速电路板。

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