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    • 5. 发明申请
    • Trim Assembly And Methods For Forming The Same
    • 修剪装配和形成方法
    • US20150202840A1
    • 2015-07-23
    • US14160933
    • 2014-01-22
    • Coach, Inc.
    • Raul H. AndrialFarid S. Gadalla
    • B32B7/12B32B9/02B32B37/12
    • B32B7/12A41D27/08A41F9/002B29C63/003B32B9/025B32B37/1207B32B38/10B32B2317/08B32B2437/00Y10T428/2495
    • An assembly includes a substrate, a trim member and a heat-activated adhesive member. The substrate defines at least two surfaces including a finished surface and an unfinished surface. The trim member defines at least two surfaces including an outwardly-facing finished surface and an inwardly-facing attachment surface. The inwardly-facing attachment surface of the trim member is arranged over and trims the unfinished surface of the substrate. The finished surface of the substrate and the outwardly-facing surface of the trim member form a cooperating finished surface of the assembly. The heat-activated adhesive member is disposed over both of the unfinished surface and the inwardly-facing attachment surface of the trim member to indirectly attach the unfinished surface of the substrate to the inwardly-facing attachment surface of the trim member. A method is also disclosed.
    • 组件包括衬底,修整构件和热活化粘合构件。 衬底限定至少两个表面,包括精加工表面和未完成表面。 装饰构件限定至少两个表面,包括面向外的完成表面和面向内的附接表面。 装饰构件的面向内的附接表面布置在衬底的未完成表面上并修整。 衬底的成品表面和装饰构件的面向外的表面形成组件的协作完成的表面。 热活化粘合剂构件设置在装饰构件的未完成表面和面向内的附接表面的两个上,以将衬底的未完成表面间接地附接到装饰构件的向内的附接表面。 还公开了一种方法。
    • 6. 发明申请
    • REDUCING COSMETIC SURFACE INTERFERENCE FROM EMBEDDED COMPONENTS
    • 降低嵌入式组件的化妆表面干扰
    • US20150158284A1
    • 2015-06-11
    • US14259907
    • 2014-04-23
    • Apple Inc.
    • Harry W. SMITH, IVPeter F. COXETERJonathan T. MECHAKAdam L. NEKIMKENJulio C. QUINTERO
    • B32B38/00
    • B32B38/0004B29C59/02B32B38/10B32B2317/08B32B2457/00H01L21/568Y10T156/1026Y10T156/12
    • The described embodiments relate to a method for embedding one or more electrical components in a flexible substrate. The method includes receiving a substrate of a flexible material, wherein the substrate includes a cosmetic surface and an opposing surface. The method further includes applying a carrier form to the substrate to create a carrier assembly, wherein the carrier form includes one or more positive images representative a design to be transferred to the opposing surface of the substrate. The method further includes removing or cutting a portion of material from the opposing surface of the substrate to form a new opposing surface. Subsequently, the carrier form is removed from the substrate to reveal one or more embedding cavities extending into the substrate at the new opposing surface. In some embodiments, the embedding cavities can thereafter receive one or more electrical components.
    • 所描述的实施例涉及用于将一个或多个电气部件嵌入柔性基板中的方法。 所述方法包括接收柔性材料的基底,其中所述基底包括化妆品表面和相对表面。 所述方法还包括将载体形式施加到所述基底以产生载体组件,其中所述载体形式包括代表要传递到所述基底的相对表面的设计的一个或多个正图像。 该方法还包括从基板的相对表面去除或切割一部分材料以形成新的相对表面。 随后,将载体形式从衬底上移除以露出在新的相对表面处延伸到衬底中的一个或多个嵌入腔。 在一些实施例中,嵌入腔随后可以接收一个或多个电气部件。