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    • 3. 发明申请
    • REDUCING COSMETIC SURFACE INTERFERENCE FROM EMBEDDED COMPONENTS
    • 降低嵌入式组件的化妆表面干扰
    • US20150158284A1
    • 2015-06-11
    • US14259907
    • 2014-04-23
    • Apple Inc.
    • Harry W. SMITH, IVPeter F. COXETERJonathan T. MECHAKAdam L. NEKIMKENJulio C. QUINTERO
    • B32B38/00
    • B32B38/0004B29C59/02B32B38/10B32B2317/08B32B2457/00H01L21/568Y10T156/1026Y10T156/12
    • The described embodiments relate to a method for embedding one or more electrical components in a flexible substrate. The method includes receiving a substrate of a flexible material, wherein the substrate includes a cosmetic surface and an opposing surface. The method further includes applying a carrier form to the substrate to create a carrier assembly, wherein the carrier form includes one or more positive images representative a design to be transferred to the opposing surface of the substrate. The method further includes removing or cutting a portion of material from the opposing surface of the substrate to form a new opposing surface. Subsequently, the carrier form is removed from the substrate to reveal one or more embedding cavities extending into the substrate at the new opposing surface. In some embodiments, the embedding cavities can thereafter receive one or more electrical components.
    • 所描述的实施例涉及用于将一个或多个电气部件嵌入柔性基板中的方法。 所述方法包括接收柔性材料的基底,其中所述基底包括化妆品表面和相对表面。 所述方法还包括将载体形式施加到所述基底以产生载体组件,其中所述载体形式包括代表要传递到所述基底的相对表面的设计的一个或多个正图像。 该方法还包括从基板的相对表面去除或切割一部分材料以形成新的相对表面。 随后,将载体形式从衬底上移除以露出在新的相对表面处延伸到衬底中的一个或多个嵌入腔。 在一些实施例中,嵌入腔随后可以接收一个或多个电气部件。