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1. 发明公开

US20240199902A1 CURABLE COMPOSITION AND CURED PRODUCT THEREOF 审中-公开
公开(公告)号：US20240199902A1
公开(公告)日：2024-06-20
申请号：US18551054
申请日：2022-03-03
申请人： TAIYO Holding Co., Ltd.
发明人： Yutaka YOKOYAMA , Kazuyoshi YONEDA
IPC分类号： C09D11/38 , C09D11/101 , C09D11/107
CPC分类号： C09D11/38 , C09D11/101 , C09D11/107
摘要： [Objective] To provide a curable composition that is useful as, for example, a solder resist for printed wiring boards, is higher in flame retardancy, coatability, resolution, storage stability and low warpage and is also suitable for an inkjet printing method, and a cured product thereof.
[Solution] A curable composition containing (A) a compound having a (meth)acryloyl group, (B) a heat-curable component, (C) a photopolymerization initiator, (D) a crystalline flame retardant and (E) a wetting and dispersing additive, in which the content of the wetting and dispersing additive (E) is 1% by weight to 9% by weight with respect to the content of the crystalline flame retardant (D), a cured product obtained from the curable composition and an electronic component having the cured product.

2. 发明授权

US09282644B2 Photosensitive resin composition, cured product thereof, and printed wiring board 有权
标题翻译：感光树脂组合物，其固化产物和印刷线路板
公开(公告)号：US09282644B2
公开(公告)日：2016-03-08
申请号：US14470059
申请日：2014-08-27
申请人： TAIYO HOLDINGS CO., LTD.
发明人： Chiho Ueta , Seiryo Kamata
IPC分类号： H05K3/00 , H05K3/28 , H05K1/02 , H05K1/03 , G03F7/105 , G03F7/032 , G03F7/00
CPC分类号： H05K3/0076 , G03F7/0007 , G03F7/032 , G03F7/105 , H05K1/0296 , H05K1/0373 , H05K3/0055 , H05K3/287 , H05K2203/161 , Y10T428/31938
摘要： Disclosed is a photosensitive resin composition which has excellent concealing properties for appearance defects of a circuit and the like, while having excellent coloring power and resolution that enable the formation of a high-resolution solder resist layer. Specifically disclosed is a photosensitive resin composition which contains a perylene coloring agent, a coloring agent that is in a complementary color relation with the perylene coloring agent, a carboxyl group-containing resin, a compound that contains two or more ethylenically unsaturated groups in each molecule, and a photopolymerization initiator.
摘要翻译：公开了一种具有优异的电路外观缺陷隐蔽性的感光性树脂组合物，同时具有优异的着色力和分辨率，能够形成高分辨率阻焊层。具体公开了一种感光性树脂组合物，其含有苝着色剂，与苝着色剂具有互补色关系的着色剂，含羧基的树脂，在各分子中含有两个以上烯键式不饱和基团的化合物，和光聚合引发剂。

3. 发明授权

US08748502B2 Photocurable resin composition 有权
标题翻译：光固化树脂组合物
公开(公告)号：US08748502B2
公开(公告)日：2014-06-10
申请号：US13383324
申请日：2010-07-14
申请人： Yoko Shibasaki , Masao Arima
发明人： Yoko Shibasaki , Masao Arima
IPC分类号： C08F2/50 , B29C71/04 , C08F2/46 , A61L2/08 , A61L24/00 , C08G61/04
CPC分类号： C08F2/50 , G03F7/031 , G03F7/032 , G03F7/0388 , G03F7/40 , H05K3/287
摘要： Disclosed is a photocurable resin composition which comprises a photopolymerization initiator having two oxime ester groups in the molecule, a resin containing a carboxyl group, and a compound having two or more ethylenically unsaturated groups in the molecule. The composition can achieve high sensitivity, can provide a dried coating film having excellent touch dryness of fingers, can prevent the generation of an out gas during curing or the like, and can achieve all of excellent alignment accuracy, high productivity and high reliability in the formation of a solder resist for a printed wiring board or the like.
摘要翻译：公开了一种光固化树脂组合物，其包含分子中具有两个肟酯基的光聚合引发剂，含有羧基的树脂和在分子中具有两个或更多个烯键式不饱和基团的化合物。该组合物可以实现高灵敏度，可以提供具有优异的手指接触干燥度的干燥涂膜，可以防止在固化等期间产生气体，并且可以实现所有优异的对准精度，高生产率和高可靠性形成用于印刷线路板等的阻焊剂。

4. 发明授权

US08642234B2 Photosensitive resin, curable resin composition containing the same, dry film thereof, and printed circuit board using them 有权
标题翻译：感光树脂，含有它们的可固化树脂组合物，其干膜和使用它们的印刷电路板
公开(公告)号：US08642234B2
公开(公告)日：2014-02-04
申请号：US13231498
申请日：2011-09-13
申请人： Nobuhito Ito , Masao Arima , Syouji Nishiguchi , Kouji Ogawa , Masayuki Kobayashi , Atsushi Sakamoto
发明人： Nobuhito Ito , Masao Arima , Syouji Nishiguchi , Kouji Ogawa , Masayuki Kobayashi , Atsushi Sakamoto
IPC分类号： G03C1/72 , G03C1/73 , G03C1/00 , C08F2/46 , C08J3/28 , C08G63/195 , C08G63/193
CPC分类号： H05K3/287 , C08G8/30 , C08G8/32 , C08L61/14 , G03F7/0388
摘要： A carboxyl group-containing photosensitive resin is obtained by reacting an α,β-ethylenically unsaturated group-containing monocarboxylic acid (c) with a phenolic compound (a) containing the structure represented by the following general formula (I) and having at least two phenolic hydroxyl groups in its molecule, wherein part or the whole of the phenolic hydroxyl groups being modified into an oxyalkyl group, and further reacting a polybasic acid anhydride (d) with the resultant reaction product; wherein R1 represents either one of a hydrocarbon radical of 1 to 11 carbon atoms, a SO2 group, an oxygen atom and sulfur atom, R2 represents a hydrocarbon radical of 1 to 11 carbon atoms, “a” represents an integer of 0 to 3, “n” represents an integer of 1 to 2, and “m” represents an integer of 1 to 10.
摘要翻译：含羧基的感光性树脂通过使含α，β-烯属不饱和基团的一元羧酸（c）与含有下述通式（I）所示的结构的酚类化合物（a）反应而得到，并具有至少两个酚羟基分子中的酚羟基，其中部分或全部酚羟基被修饰成氧烷基，并进一步使多元酸酐（d）与所得反应产物反应; 其中R1表示1〜11个碳原子的烃基，SO2基，氧原子和硫原子，R2表示碳原子数为1〜11的烃基，“a”表示0〜3的整数， “n”表示1〜2的整数，“m”表示1〜10的整数。

5. 发明申请

US20120301825A1 LAYERED STRUCTURE AND PHOTOSENSITIVE DRY FILM TO BE USED THEREFOR 审中-公开
标题翻译：使用的层状结构和感光干膜
公开(公告)号：US20120301825A1
公开(公告)日：2012-11-29
申请号：US13569715
申请日：2012-08-08
申请人： Takahiro YOSHIDA , Shouji Minegishi , Masao Arima
发明人： Takahiro YOSHIDA , Shouji Minegishi , Masao Arima
IPC分类号： G03F7/004
CPC分类号： G03F7/095 , G03F7/0047 , H05K3/287 , H05K3/3452 , H05K2201/0195 , H05K2201/0209 , H05K2201/0269
摘要： In a layered structure having at least a substrate and a photosensitive resin layer or cured film layer formed on the substrate and containing an inorganic filler, the content of the inorganic filler in the photosensitive resin layer or cured film layer is lower in a surface layer region away from the substrate than in other region, so that a linear thermal expansion coefficient of the layer as a whole is maintained as low as possible. Preferably, the photosensitive resin layer or cured film layer comprises at least two layers having different inorganic filler contents, wherein the inorganic filler content in the layer on the surface side away from the substrate is lower than the inorganic filler content in the other layer. A photosensitive dry film containing the photosensitive resin layer is suitable for use as a solder resist or an interlayer resin insulation layer of a printed wiring board.
摘要翻译：在至少具有基板和形成在基板上并含有无机填料的感光性树脂层或固化膜层的分层结构中，感光性树脂层或固化膜层中的无机填料的含量在表面层区域远离衬底而不是在其他区域，使得整个层的线性热膨胀系数保持尽可能低。优选地，感光性树脂层或固化膜层包含至少两层具有不同无机填料含量的层，其中离开基材的表面侧的层中的无机填料含量低于另一层中的无机填料含量。含有感光性树脂层的感光性干膜适合用作印刷电路板的阻焊剂或层间树脂绝缘层。

6. 发明申请

US20120125672A1 PHOTOCURABLE RESIN COMPOSITION 有权
标题翻译：光固化树脂组合物
公开(公告)号：US20120125672A1
公开(公告)日：2012-05-24
申请号：US13384716
申请日：2010-07-21
申请人： Shoji Minegishi , Masao Arima
发明人： Shoji Minegishi , Masao Arima
IPC分类号： H05K1/03 , C08L63/04 , C08L61/10 , B32B27/30
CPC分类号： C08F2/50 , C08F2/38 , C08F283/00 , C09D4/06 , G03F7/027 , G03F7/032 , G03F7/0388 , G03F7/40 , Y10T428/31855
摘要： Provided is a photocurable resin composition, which has sensitivity equal to or greater than existing compositions, has alkali development properties, and which produces a cured product that does not become brittle with changes in temperature, and which also has excellent reliability in terms of water resistance, electrical insulating properties, PCT resistance, and the like. The photocurable resin composition comprises a carboxyl group-containing resin, a photopolymerization initiator, a vinyl group-containing elastomer, and a styryl group-containing compound.
摘要翻译：提供具有等于或大于现有组合物的灵敏度的光固化树脂组合物，具有碱显影性能，并且产生不会因温度变化而变脆的固化产物，并且在耐水性方面也具有优异的可靠性，电绝缘性，PCT电阻等。光固化性树脂组合物含有含羧基的树脂，光聚合引发剂，含乙烯基的弹性体和含苯乙烯基的化合物。

7. 发明申请

US20110278053A1 DRY FILM AND MULTILAYER PRINTED WIRING BOARD 审中-公开
标题翻译：干膜和多层印刷接线板
公开(公告)号：US20110278053A1
公开(公告)日：2011-11-17
申请号：US13195802
申请日：2011-08-01
申请人： Makoto HAYASHI , Koshin Nakai , Katsuto Murata
发明人： Makoto HAYASHI , Koshin Nakai , Katsuto Murata
IPC分类号： H05K1/03 , C08L63/00
CPC分类号： H05K3/4661 , C08G59/38 , C08L63/00 , H05K3/381 , H05K2201/0209 , C08L2666/22
摘要： A dry film includes a supporting base film and a thin membrane of a thermosetting resin composition. The thin membrane of the thermosetting resin composition is formed on the supporting base film. The thermosetting resin composition includes a liquid epoxy resin, a solid epoxy resin, a semisolid epoxy resin, an epoxy curing agent and a filler. The liquid epoxy resin is liquid at 20° C. and has at least two epoxy groups in a molecule. The solid epoxy resin is solid at 40° C. and has at least three epoxy groups in a molecule. The semisolid epoxy resin is solid at 20° C. and liquid at 40° C. and has at least two epoxy groups in a molecule. A ratio of mass of the liquid epoxy resin to a sum of mass of the solid epoxy resin and mass of the semisolid epoxy resin is about 1:1 to about 1:10 A ratio of the mass of the solid epoxy resin to the mass of the semisolid epoxy resin is about 1:0.5 to about 1:2.
摘要翻译：干膜包括支撑基膜和热固性树脂组合物的薄膜。热固性树脂组合物的薄膜形成在支撑基底膜上。热固性树脂组合物包括液体环氧树脂，固体环氧树脂，半固体环氧树脂，环氧固化剂和填料。液体环氧树脂在20℃下为液体，在分子中具有至少两个环氧基。固体环氧树脂在40℃是固体，在分子中具有至少三个环氧基团。半固态环氧树脂在20℃为固体，在40℃为液体，在分子中具有至少两个环氧基。液体环氧树脂的质量与固体环氧树脂的质量之和与半固态环氧树脂的质量之比为约1:1至约1:10A，固体环氧树脂的质量与质量的比例为半固体环氧树脂为约1:0.5至约1:2。

8. 发明公开

US20240287373A1 THERMOSETTING RESIN COMPOSITION, CURED PRODUCT, AND PRINTED WIRING BOARD 审中-公开
公开(公告)号：US20240287373A1
公开(公告)日：2024-08-29
申请号：US18587698
申请日：2024-02-26
申请人： TAIYO HOLDINGS CO., LTD.
发明人： Yoshikazu DAIGO
IPC分类号： C09K5/14 , C08K3/36 , C08K7/18 , C08L63/00 , H05K1/03
CPC分类号： C09K5/14 , C08K3/36 , C08K7/18 , C08L63/00 , H05K1/0373 , C08K2201/001 , H05K2201/0209
摘要： Provided is a thermosetting resin composition capable of achieving both thermal conductivity and dielectric breakdown resistance at high levels and forming a cured product with a surface having high smoothness. In a thermosetting resin composition, a thermosetting resin, a thermally conductive filler, a rheology modifier, and a wet dispersant are mixed to be solvent-free, and a thermal conductivity of a cured product of the thermosetting resin composition is adjusted to 2.5 W/m·K or more.

9. 发明授权

US11891474B2 Curable resin composition, dry film, resin-clad copper foil, cured product, and electronic component 有权
公开(公告)号：US11891474B2
公开(公告)日：2024-02-06
申请号：US17299719
申请日：2019-12-04
申请人： TAIYO HOLDINGS CO., LTD.
发明人： Kazuhisa Yamoto , Yoshitomo Aoyama , Hidekazu Miyabe
IPC分类号： C08G59/42 , C08K3/013 , H05K1/03 , H05K1/18 , H05K3/28 , C08K3/36 , C08G59/32 , C08K5/12 , C08K9/06 , C08L63/00
CPC分类号： C08G59/42 , C08K3/013 , H05K1/03 , H05K1/188 , H05K3/28 , H05K2201/0358
摘要： To provide a curable resin composition, from which a cured product having high heat resistance, a low dielectric loss tangent, high adhesion to a conductor can be obtained. A dry film, a resin-clad copper foil, a cured product, and an electronic component containing the curable resin composition are to be provided. A curable resin composition containing (A) an epoxy resin and (B) a compound having an active ester group is obtained, which has ratio of the total amount of epoxy group(s) in (A) the epoxy resin/the total amount of active ester group(s) in (B) the compound having an active ester group in the composition in the range of 0.2 to 0.6. A dry film, a resin-clad copper foil, a cured product, and an electronic component containing the curable resin composition are also obtained.

10. 发明授权

US11746227B2 Thermosetting resin composition, cured product thereof, and printed wiring board 有权
公开(公告)号：US11746227B2
公开(公告)日：2023-09-05
申请号：US16962707
申请日：2019-01-15
申请人： TAIYO HOLDINGS CO., LTD.
发明人： Tomotaka Noguchi , Yasuyo Kanazawa , Eiji Harima , Yasuaki Arai
IPC分类号： C08L63/00 , C08G59/50 , H05K1/03 , H05K3/00 , C08K3/36 , C08K3/26
CPC分类号： C08L63/00 , C08G59/50 , C08K3/36 , H05K1/0353 , H05K1/0373 , C08K2003/265 , H05K3/0094
摘要： Provided is a thermosetting resin composition which can suppress liquid dripping or bleeding from generating even when used for filling a hole in a printed wiring board having a large opening diameter of a hole part such as a through hole, and in particular, which can suppress cracks from generating even when used for filling a hole in a multilayer printed wiring board having a conductive part and an insulating part on the inner wall of a hole part such as a through hole. The thermosetting resin composition according to the present invention has a viscosity ratio R expressed by formula V2/V1 in the range of 5.0×10−2 to 1.0×102, wherein V1 (dPa·s) is the viscosity measured by a cone-flat plate type rotational viscometer (cone-plate type) in accordance with JIS-Z 8803:2011 and V2 (dPa·s) is the minimum value of the melt viscosity measured at 60° C. to 100° C. in accordance with JIS-K7244-10:2005, and a pencil hardness of HB or more measured by a pencil hardness test according to JIS-K5600-5-4:1999 in a state of heating at 100° C. for 160 minutes.

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