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1. 发明授权

US08765831B2 Photocurable resin composition 有权
标题翻译：光固化树脂组合物
公开(公告)号：US08765831B2
公开(公告)日：2014-07-01
申请号：US13384716
申请日：2010-07-21
申请人： Shoji Minegishi , Masao Arima
发明人： Shoji Minegishi , Masao Arima
IPC分类号： C08F2/46 , C08G61/04
CPC分类号： C08F2/50 , C08F2/38 , C08F283/00 , C09D4/06 , G03F7/027 , G03F7/032 , G03F7/0388 , G03F7/40 , Y10T428/31855
摘要： Provided is a photocurable resin composition, which has sensitivity equal to or greater than existing compositions, has alkali development properties, and which produces a cured product that does not become brittle with changes in temperature, and which also has excellent reliability in terms of water resistance, electrical insulating properties, PCT resistance, and the like. The photocurable resin composition comprises a carboxyl group-containing resin, a photopolymerization initiator, a vinyl group-containing elastomer, and a styryl group-containing compound.
摘要翻译：提供具有等于或大于现有组合物的灵敏度的光固化树脂组合物，具有碱显影性能，并且产生不会因温度变化而变脆的固化产物，并且在耐水性方面也具有优异的可靠性，电绝缘性，PCT电阻等。光固化性树脂组合物含有含羧基的树脂，光聚合引发剂，含乙烯基的弹性体和含苯乙烯基的化合物。

2. 发明申请

US20120125672A1 PHOTOCURABLE RESIN COMPOSITION 有权
标题翻译：光固化树脂组合物
公开(公告)号：US20120125672A1
公开(公告)日：2012-05-24
申请号：US13384716
申请日：2010-07-21
申请人： Shoji Minegishi , Masao Arima
发明人： Shoji Minegishi , Masao Arima
IPC分类号： H05K1/03 , C08L63/04 , C08L61/10 , B32B27/30
CPC分类号： C08F2/50 , C08F2/38 , C08F283/00 , C09D4/06 , G03F7/027 , G03F7/032 , G03F7/0388 , G03F7/40 , Y10T428/31855
摘要： Provided is a photocurable resin composition, which has sensitivity equal to or greater than existing compositions, has alkali development properties, and which produces a cured product that does not become brittle with changes in temperature, and which also has excellent reliability in terms of water resistance, electrical insulating properties, PCT resistance, and the like. The photocurable resin composition comprises a carboxyl group-containing resin, a photopolymerization initiator, a vinyl group-containing elastomer, and a styryl group-containing compound.
摘要翻译：提供具有等于或大于现有组合物的灵敏度的光固化树脂组合物，具有碱显影性能，并且产生不会因温度变化而变脆的固化产物，并且在耐水性方面也具有优异的可靠性，电绝缘性，PCT电阻等。光固化性树脂组合物含有含羧基的树脂，光聚合引发剂，含乙烯基的弹性体和含苯乙烯基的化合物。

3. 发明授权

US07718714B2 Resin curable with actinic energy ray, photocurable and thermosetting resin composition containing the same, and cured product obtained therefrom 有权
标题翻译：用光化能射线固化的树脂，含有它的光固化性和热固性树脂组合物以及由其获得的固化产物
公开(公告)号：US07718714B2
公开(公告)日：2010-05-18
申请号：US11529369
申请日：2006-09-29
申请人： Shoji Minegishi
发明人： Shoji Minegishi
IPC分类号： C08F2/42 , C08J3/28 , G03C1/00 , G03F7/00 , G03F7/031
CPC分类号： G03F7/027 , C08G59/4292 , C08G65/18 , H05K3/287 , H05K3/4676
摘要： An actinic energy ray-curable resin is obtained by reacting an unsaturated monocarboxylic acid (c) with a terminal epoxy group of an epoxy resin having an unsaturated group and a hydroxyl group in its side chains and an epoxy group in its terminal and further reacting a polybasic acid anhydride (d) with the hydroxyl group of the above-mentioned epoxy resin, wherein the above-mentioned epoxy resin is a product of the polyaddition reaction of a reaction product (I) of a polybasic acid anhydride (a) and a compound (b) having at least one unsaturated double bond and one alcoholic hydroxyl group in its molecule, a compound (II) having at least two carboxyl groups in its molecule, and a bifunctional epoxy compound (III), wherein at least either one of the carboxyl group-containing compound (II) and the bifunctional epoxy compound (III) is a compound containing no aromatic ring. A photocurable and thermosetting resin composition comprising this actinic energy ray-curable resin, a photopolymerization initiator, a diluent, and a cyclic ether compound is useful as a solder resist for a printed circuit board, interlaminar insulating materials for a multi-layer printed circuit board, and the like.
摘要翻译：通过使不饱和一元羧酸（c）与其侧链中具有不饱和基团和羟基的环氧树脂的末端环氧基和其末端的环氧基反应获得光活性能量射线固化树脂，并进一步使多元酸酐（d）与上述环氧树脂的羟基，其中上述环氧树脂是多元酸酐（a）的反应产物（I）和化合物（I）的加成反应的产物（b）在其分子中具有至少一个不饱和双键和一个醇羟基，在其分子中具有至少两个羧基的化合物（II）和双官能环氧化合物（III），其中至少一个含羧基化合物（II）和双官能环氧化合物（III）是不含芳环的化合物。包含该光化学能量射线固化树脂，光聚合引发剂，稀释剂和环状醚化合物的光固化性和热固性树脂组合物可用作印刷电路板的阻焊剂，用于多层印刷电路板的层间绝缘材料，等等。

4. 发明申请

US20070027298A1 Resin curable with actinic energy ray, photocurable and thermosetting resin composition containing the same, and cured product obtained therefrom 有权
标题翻译：用光化能射线固化的树脂，含有它的光固化性和热固性树脂组合物以及由其获得的固化产物
公开(公告)号：US20070027298A1
公开(公告)日：2007-02-01
申请号：US11529369
申请日：2006-09-29
申请人： Shoji Minegishi
发明人： Shoji Minegishi
IPC分类号： C08G59/68
CPC分类号： G03F7/027 , C08G59/4292 , C08G65/18 , H05K3/287 , H05K3/4676
摘要： An actinic energy ray-curable resin is obtained by reacting an unsaturated monocarboxylic acid (c) with a terminal epoxy group of an epoxy resin having an unsaturated group and a hydroxyl group in its side chains and an epoxy group in its terminal and further reacting a polybasic acid anhydride (d) with the hydroxyl group of the above-mentioned epoxy resin, wherein the above-mentioned epoxy resin is a product of the polyaddition reaction of a reaction product (I) of a polybasic acid anhydride (a) and a compound (b) having at least one unsaturated double bond and one alcoholic hydroxyl group in its molecule, a compound (II) having at least two carboxyl groups in its molecule, and a bifunctional epoxy compound (III), wherein at least either one of the carboxyl group-containing compound (II) and the bifunctional epoxy compound (III) is a compound containing no aromatic ring. A photocurable and thermosetting resin composition comprising this actinic energy ray-curable resin, a photopolymerization initiator, a diluent, and a cyclic ether compound is useful as a solder resist for a printed circuit board, interlaminar insulating materials for a multi-layer printed circuit board, and the like.
摘要翻译：通过使不饱和一元羧酸（c）与其侧链中具有不饱和基团和羟基的环氧树脂的末端环氧基和其末端的环氧基反应获得光活性能量射线固化树脂，并进一步使多元酸酐（d）与上述环氧树脂的羟基，其中上述环氧树脂是多元酸酐（a）的反应产物（I）和化合物（I）的加成反应的产物（b）在其分子中具有至少一个不饱和双键和一个醇羟基，在其分子中具有至少两个羧基的化合物（II）和双官能环氧化合物（III），其中至少一个含羧基化合物（II）和双官能环氧化合物（III）是不含芳环的化合物。包含该光化学能量射线固化树脂，光聚合引发剂，稀释剂和环状醚化合物的光固化性和热固性树脂组合物可用作印刷电路板的阻焊剂，用于多层印刷电路板的层间绝缘材料，等等。

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