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    • 5. 发明申请
    • TILTED IMPLANT FOR POLY RESISTORS
    • 用于聚电阻的倾斜植入物
    • US20150333188A1
    • 2015-11-19
    • US14278114
    • 2014-05-15
    • Spansion LLC
    • Shenqing FANGTimothy ThurgateKuo Tung Chang
    • H01L29/8605H01L21/265
    • H01L21/26586H01L21/26513H01L28/20H01L29/8605
    • A semiconductor device having a substrate, a dielectric layer, a polycrystalline silicon (“poly”) resistor, a drain, and a source is disclosed. After implantation, the poly resistor may have a lateral doping profile with two peaks, one near each edge of the poly resistor, and a trough near the middle of the poly resistor. Such a doping profile can allow the poly resistor to have a resistance that is insensitive to small variations in critical dimension of the poly resistor. The resistance of the poly resistor may be determined by the doping dose of the tilted implant used to form the poly resistor. The tilted implant may be used to form the drain and the source of a transistor substantially simultaneously as forming the poly resistor.
    • 公开了具有基板,电介质层,多晶硅(“poly”)电阻,漏极和源极的半导体器件。 在植入之后,多晶硅电阻器可以具有横向掺杂分布,其具有两个峰值,一个在多个电阻器的每个边缘附近,以及靠近该多个电阻器中间的槽。 这种掺杂分布可以允许多晶硅电阻具有对聚电阻器的临界尺寸的小变化不敏感的电阻。 多晶硅电阻器的电阻可以通过用于形成多晶硅电阻器的倾斜注入的掺杂剂量来确定。 倾斜的植入物可以用于在形成多晶硅电阻器的同时基本上同时形成晶体管的漏极和源极。
    • 7. 发明申请
    • MULTI-LAYER INTER-GATE DIELECTRIC STRUCTURE
    • 多层间栅电介质结构
    • US20150194537A1
    • 2015-07-09
    • US14149628
    • 2014-01-07
    • Spansion LLC
    • Chun CHENShenqing Fang
    • H01L29/792H01L21/311H01L29/51H01L21/28H01L29/66H01L29/423
    • H01L29/792H01L29/40117H01L29/42344H01L29/66833
    • A semiconductor device having a first gate stack on a substrate is disclosed. The first gate stack may include a first gate conductor over a first gate dielectric structure. A dielectric structure can be formed over the first gate stack and the substrate. The dielectric structure layer can include four or more layers of two or more dielectric films disposed in an alternating manner. The dielectric structure can be selectively etched to form an inter-gate dielectric structure. A second gate conductor can be formed over a second gate dielectric structure, adjacent to the inter-gate dielectric structure. A dielectric layer can be formed over the substrate, the first and second gate conductors, and the inter-gate dielectric structure. The first gate conductor may be used to make a memory gate and the second gate conductor can be used to make a select gate of a split-gate memory cell.
    • 公开了一种在衬底上具有第一栅叠层的半导体器件。 第一栅极堆叠可以包括在第一栅极电介质结构之上的第一栅极导体。 可以在第一栅极堆叠和衬底上形成电介质结构。 电介质结构层可以包括以交替方式设置的两个或更多个介电膜的四层或更多层。 可以选择性地蚀刻电介质结构以形成栅极间电介质结构。 第二栅极导体可以形成在与栅极间电介质结构相邻的第二栅极电介质结构上。 可以在衬底,第一和第二栅极导体以及栅极间电介质结构之上形成电介质层。 第一栅极导体可以用于制造存储器栅极,并且第二栅极导体可以用于形成分离栅极存储器单元的选择栅极。