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1. 发明授权

US10201866B2 Method and soldering device for selective soldering with at least one solder nozzle and another functional element which are moved synchronously by a movement device 有权
公开(公告)号：US10201866B2
公开(公告)日：2019-02-12
申请号：US14648959
申请日：2013-12-05
申请人： SEHO Systemtechnik GmbH
发明人： Bernd Dreikorn , Thomas Herz , Reiner Zoch , Markus Walter
IPC分类号： B23K3/06 , B23K1/00 , B23K37/00 , H05K3/34 , B23K1/08 , B23K1/20 , B23K3/08 , B23K37/04 , B23K37/06 , B23K101/42
摘要： A soldering apparatus for selective soldering, comprising a solder bath for holding the molten solder at least one solder nozzle a solder pump for conveying solder from the solder bath through the solder nozzle a movement device for the relative movement of the solder nozzle and an assembly to be soldered wherein several solder nozzles are provided in several solder nozzle assemblies, with each solder nozzle assembly having one or more solder nozzles and wherein each solder nozzle assembly may be assigned an assembly, and the movement device is designed for synchronous movement of the several solder nozzle assemblies relative to the respective assemblies in the horizontal X-Y plane, and the soldering machine is so designed that the individual solder nozzle assemblies and the respective assemblies may be moved towards one another and independently of one another in the vertical direction (Z-direction) by means of a coupling device.

2. 发明申请

US20090308912A1 DEVICE FOR THE CONTROLLED DISPLACEMENT OF A SPRAY NOZZLE TO INDIVIDUAL SPRAY POINTS, IN PARTICULAR FOR SPRAYING FLUX IN WAVE SOLDERING UNITS 审中-公开
标题翻译：用于将喷雾喷嘴控制到单独喷雾点的装置，特别是用于在波浪焊接单元中喷射通量
公开(公告)号：US20090308912A1
公开(公告)日：2009-12-17
申请号：US12306617
申请日：2007-07-18
申请人： Rolf Diehm , Volker Liedke
发明人： Rolf Diehm , Volker Liedke
IPC分类号： B23K3/00
CPC分类号： B23K3/082 , B05B13/0426 , B05C5/0216
摘要： The invention relates to a device for the controlled displacement of an upward-directed spray nozzle to individual spray points that are situated a distance apart, in particular for spraying flux in wave soldering units. The spray nozzle is situated axially on a rotary axle rotated by a rotary drive, to which a deflection force directly radially to the rotary axle is applied in such a way that, when the rotary axle rotates, the spray nozzle executes a self-contained annular motion whose contour is limited in the radial direction by a stationary mask surrounding the spray nozzle.
摘要翻译：本发明涉及一种用于将向上喷射喷嘴受控地移位到各个喷雾点的装置，该喷射点位于距离相隔一段距离处，特别是用于在波峰焊接单元中喷射焊剂。喷嘴轴向位于由旋转驱动器旋转的旋转轴上，直接径向到旋转轴的偏转力被施加到旋转轴上，使得当旋转轴旋转时，喷嘴执行自包含的环形其轮廓通过围绕喷嘴的固定掩模在径向方向上受到限制。

3. 发明授权

US07316308B2 Supporting device of a transport device of a soldering apparatus 失效
标题翻译：焊接设备的运输装置的支撑装置
公开(公告)号：US07316308B2
公开(公告)日：2008-01-08
申请号：US11591513
申请日：2006-11-02
申请人： Rudolf Ullrich , Thomas Schlembach
发明人： Rudolf Ullrich , Thomas Schlembach
IPC分类号： B65G23/44
CPC分类号： B65G21/10 , B65G23/44
摘要： The invention relates to a supporting device of the transport device of a soldering apparatus for the conveying of printed-circuit boards with at least two revolving, endless transport chains, said transport chains running in guide rails in the transport zone and each passing through two guide elements at the ends of the transport zone, wherein, for adaptation to the width of the respective printed-circuit boards, the guide elements are mounted on a carrier such as to be displaccable transverse to the conveying direction. The guide elements, each associated with a respective conveying chain, are interconnected by flexible tension elements, said tension elements being adjustable with regard to their tensile stress and running parallel to the respective conveying chain in the transport zone, the value of the tensile stress being so highly adjusted that the tension elements prevent the guide rails from deviating from a straight line.
摘要翻译：本发明涉及一种用于输送具有至少两个循环的环形输送链的印刷电路板的焊接装置的运送装置的支撑装置，所述输送链在运输区域中的导轨中运行，并且每个通过两个导轨在传送区域的端部处的元件，其中为了适应各个印刷电路板的宽度，引导元件安装在载体上，以便横向于输送方向可置换。每个与相应输送链相关联的引导元件通过柔性张力元件相互连接，所述张力元件相对于它们的拉伸应力是可调节的，并且平行于输送区域中相应的输送链行进，拉伸应力值如此高度调节，使得张力元件防止导轨偏离直线。

4. 发明申请

US20030024966A1 Process and device for soldering electrical components on a plastic sheet 失效
标题翻译：用于焊接塑料片上的电气部件的工艺和装置
公开(公告)号：US20030024966A1
公开(公告)日：2003-02-06
申请号：US10190618
申请日：2002-07-09
申请人： SEHO Systemtechnik GmbH
发明人： Rolf Ludwig Diehm , Volker Liedke
IPC分类号： B23K001/08 , B23K037/06 , B23K031/02
CPC分类号： B23K1/012 , B23K2101/36 , B23K2101/42 , H05K1/189 , H05K3/3494 , H05K2203/0557 , H05K2203/081 , H05K2203/111 , H05K2203/1581
摘要： The invention relates to a process for soldering electrical components to soldering positions, which are provided with soldering material, on a plastic sheet provided with applied conductor tracks. The plastic sheet is heated, from the side which is remote from the components, to a below its damage temperature and after heating its side which is remote from the components is thermally insulated. Then, the side which faces the components is acted on by a heating-gas stream which is concentrated onto the locations which are to be soldered by a template which has windows.
摘要翻译：本发明涉及一种将电气部件焊接到设置有焊接材料的焊接位置到设置有施加导体轨迹的塑料片上的工艺。塑料片从远离部件的一侧被加热到低于其损坏温度，并且在加热之后，远离部件的一侧被隔热。然后，面对组件的一侧由加热气流作用，该加热气体流集中在由具有窗口的模板被焊接的位置上。

5. 发明申请

US20210060677A1 Soldering nozzle and method for the production thereof 有权
公开(公告)号：US20210060677A1
公开(公告)日：2021-03-04
申请号：US16942878
申请日：2020-07-30
申请人： SEHO Systemtechnik GmbH
发明人： Thomas Herz , Andreas Reinhardt , Markus Walter
IPC分类号： B23K3/06
摘要： A soldering nozzle (100) for selectively soldering assemblies by means of molten solder supplied through a soldering nozzle (100) from a solder bath. The soldering nozzle (100) is designed as a deep-drawn part. A method for the production of a soldering nozzle (100) is specified as well, including the provision of a blank (401); the drawing of the blank (401) through at least one female die (411, 421) by means of at least one male die (413, 422, 431) to produce an oblong shape (439) of locally annular or substantially annular cross-section, with a first end (436) corresponding to an action point of the male die (413, 422, 431) and a second end (437) corresponding to an introduction cross-section of the male die (413, 422, 431), the cross-section preferably increasing from the first end (436) towards the second end (437); and the formation of an opening (446) at the tip end (436).

6. 发明申请

US20050247301A1 Process chamber of an installation for thermally treating printed circuit boards 失效
标题翻译：用于热处理印刷电路板的设备的处理室
公开(公告)号：US20050247301A1
公开(公告)日：2005-11-10
申请号：US10517522
申请日：2003-06-11
申请人： Rolf Diehm , Rudolf Ullrich
发明人： Rolf Diehm , Rudolf Ullrich
IPC分类号： B23K1/008 , B23K1/012 , F24H3/00
CPC分类号： B23K1/012 , B23K1/008
摘要： The invention relates to a process chamber of an installation for the thermal treatment of printed circuit boards, with a fan wheel supported on a shaft parallel to the printed circuit boards, said fan wheel being disposed between two walls of the process chamber. The fan wheel is open at its two end faces and the two end faces are at such a distance from the walls of the process chamber that gas flows in unimpeded in two substreams between the end faces of the fan wheel and the walls and flows out from the cylindrical surface of the fan wheel over the length thereof and in the extent of the process chamber in the form of a ribbon-shaped gas stream, said gas stream being directed essentially in said cross section through a channel onto the printed circuit boards.
摘要翻译：本发明涉及一种用于热处理印刷电路板的设备的处理室，其中风扇轮支撑在平行于印刷电路板的轴上，所述风扇轮设置在处理室的两个壁之间。风扇叶轮在其两个端面处是开放的，并且两个端面距离处理室的壁距离一小的距离，气体在风扇叶轮的端面和壁之间的两个子流中不受阻碍地流动，并从风扇叶轮的圆柱形表面在其长度上，并且在处理室的范围内为带状气流的形式，所述气流基本上在所述横截面中通过通道引导到印刷电路板上。

7. 发明授权

US07534978B2 Process chamber of an installation for the thermal treatment of printed circuit boards 失效
标题翻译：印刷电路板热处理设备的处理室
公开(公告)号：US07534978B2
公开(公告)日：2009-05-19
申请号：US10517522
申请日：2003-06-11
申请人： Rolf Ludwig Diehm , Rudolf Ullrich
发明人： Rolf Ludwig Diehm , Rudolf Ullrich
IPC分类号： F27B5/14 , F24H3/00
CPC分类号： B23K1/012 , B23K1/008
摘要： A process chamber of an installation for the thermal treatment of printed circuit boards is described. The process chamber may include a fan wheel supported on a shaft parallel to the printed circuit boards, the fan wheel being disposed between two walls of the process chamber. The fan wheel is open at its two end faces and the two end faces are at such a distance from the walls of the process chamber that gas flows in unimpeded in two substreams between the end faces of the fan wheel and the walls and flows out from the cylindrical surface of the fan wheel over the length thereof and in the extent of the process chamber in the form of a ribbon-shaped gas stream, the gas stream being directed essentially in the cross section through a channel onto the printed circuit boards.
摘要翻译：对印刷电路板的热处理装置的处理室进行说明。处理室可以包括支撑在平行于印刷电路板的轴上的风扇轮，风扇轮设置在处理室的两个壁之间。风扇叶轮在其两个端面处是开放的，并且两个端面距离处理室的壁距离一小的距离，气体在风扇叶轮的端面和壁之间的两个子流中不受阻碍地流动，并从风扇叶轮的圆柱形表面在其长度上并且处于以带状气流形式的处理室的范围内，气流基本上在横截面中通过通道引导到印刷电路板上。

8. 发明申请

US20080185421A1 Process for reflow soldering 审中-公开
标题翻译：回流焊接工艺
公开(公告)号：US20080185421A1
公开(公告)日：2008-08-07
申请号：US12010105
申请日：2008-01-18
申请人： Rolf Ludwig Diehm , Markus Walter , Horst Lettner
发明人： Rolf Ludwig Diehm , Markus Walter , Horst Lettner
IPC分类号： B23K1/00
CPC分类号： B23K1/008 , H05K3/3494
摘要： The invention relates to a process for the reflow soldering of printed circuit board assemblies provided with solder paste in a sealed chamber with heating in the chamber. In a first process step, the pressure in the chamber is amplified in comparison with the atmospheric pressure and the temperature in the chamber is increased by convection heating to melt the solder paste and, in a second process step, the pressure is again lowered to atmospheric pressure in controlled manner while maintaining the temperature.
摘要翻译：本发明涉及一种在腔室内加热密封的室中提供焊膏的印刷电路板组件的回流焊接方法。在第一工艺步骤中，与大气压力相比，腔室中的压力被放大，并且通过对流加热来增加腔室中的温度以熔化焊膏，并且在第二工艺步骤中，将压力再次降低至大气压压力以受控方式同时保持温度。

9. 发明申请

US20070114265A1 Supporting device of a transport device of a soldering apparatus 失效
标题翻译：焊接设备的运输装置的支撑装置
公开(公告)号：US20070114265A1
公开(公告)日：2007-05-24
申请号：US11591513
申请日：2006-11-02
申请人： Rudolf Ullrich , Thomas Schlembach
发明人： Rudolf Ullrich , Thomas Schlembach
IPC分类号： A47J36/02
CPC分类号： B65G21/10 , B65G23/44
摘要： The invention relates to a supporting device of the transport device of a soldering apparatus for the conveying of printed-circuit boards with at least two revolving, endless transport chains, said transport chains running in guide rails in the transport zone and each passing through two guide elements at the ends of the transport zone, wherein, for adaptation to the width of the respective printed-circuit boards, the guide elements are mounted on a carrier such as to be displaceable transverse to the conveying direction. The guide elements, each associated with a respective conveying chain, are interconnected by flexible tension elements, said tension elements being adjustable with regard to their tensile stress and running parallel to the respective conveying chain in the transport zone, the value of the tensile stress is being so highly adjusted that the tension elements prevent the guide rails from deviating from a straight line.
摘要翻译：本发明涉及一种用于输送具有至少两个循环的环形输送链的印刷电路板的焊接装置的运送装置的支撑装置，所述输送链在运输区域中的导轨中运行，并且每个通过两个导轨在传送区域的端部处的元件，其中为了适应各个印刷电路板的宽度，引导元件安装在载体上，以便横向于输送方向可移动。每个与相应输送链相关联的引导元件通过柔性张力元件相互连接，所述张力元件可相对于它们的拉伸应力可调，并平行于输送区域中相应的输送链行进，拉伸应力值被如此高度地调节，使得张力元件防止导轨偏离直线。

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