专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 再颁专利

USRE45279E1 Process for silver plating in printed circuit board manufacture 有权
标题翻译：印刷电路板制造中的镀银工艺
公开(公告)号：USRE45279E1
公开(公告)日：2014-12-09
申请号：US13471203
申请日：2012-05-14
申请人： Andrew McIntosh Soutar , Peter Thomas McGrath
发明人： Andrew McIntosh Soutar , Peter Thomas McGrath
IPC分类号： C25D3/46 , C25D5/02
CPC分类号： H05K3/244 , C23C18/42
摘要： In PCB manufacture, the pads and/or through-holes of a bare board are protected prior to mounting of other components by a silver plating process. The silver plate is applied from a plating composition by a replacement process in which silver ions oxidized copper and deposit a layer of silver at the surface. In the aqueous plating composition the silver ions are maintained in solution by the incorporation of a multidentate complexing agent. The compositions may contain a silver tarnish inhibitor and are free of reducing agent capable of reducing silver ions to silver metal, halide ions and substantially free of non-aqueous solvent. Surface mounted components can be soldered direct to the silver coated contact using any commercially available solder. Silver does not deposit onto solder mask, but only onto metal which is less electropositive than silver.REEXAMINATION RESULTSThe questions raised in reexamination proceedings Nos. 90/012,336 and 90/009,934, filed Jun. 4, 2012 and Aug. 3, 2011 respectively, have been considered, and the results thereof are reflected in this reissue patent which constitutes the reexamination certificate required by 35 U.S.C. 307 as provided in 37 CFR 1.570(e) for ex parte reexaminations, and/or the reexamination certificate required by 35 U.S.C. 316 as provided in 37 CFR 1.997(e) for inter partes reexaminations.
摘要翻译：在PCB制造中，裸板的焊盘和/或通孔在通过镀银工艺安装其它部件之前得到保护。通过银离子氧化铜并在表面沉积一层银的替换过程，由镀覆组合物施加银板。在水性电镀组合物中，通过掺入多齿络合剂将银离子保持在溶液中。组合物可以含有银晦暗抑制剂，并且不含能够将银离子还原成银金属，卤离子并基本上不含非水溶剂的还原剂。表面安装的部件可以使用任何市售的焊料直接焊接到镀银触点。银不会沉积在焊料掩模上，而只能沉积在比银正电的金属上。重审结果2012年6月4日和2011年8月3日提交的复审程序第90 / 012,336号和第90 / 009,934号提出的问题已经被考虑，其结果反映在构成复审的重新发行专利中 35USC要求的证书根据37 CFR 1.570（e）规定，单方面复审，和/或35 U.S.C.所要求的复审证书。按照第37 CFR 1.997（e）条的规定进行跨部门重新审查。

2. 发明授权

US08312623B2 Methods for producing electrical conductors 有权
标题翻译：电导体的制造方法
公开(公告)号：US08312623B2
公开(公告)日：2012-11-20
申请号：US12052166
申请日：2008-03-20
申请人： Oscar Khaselev , Nitin Desai , Michael T. Marczi , Bawa Singh
发明人： Oscar Khaselev , Nitin Desai , Michael T. Marczi , Bawa Singh
IPC分类号： H05K3/02
CPC分类号： H01B1/02 , H05K1/0393 , H05K1/092 , H05K3/207 , H05K2201/0347 , Y10T29/49117 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144 , Y10T29/49155 , Y10T29/49165
摘要： A device including a heat sensitive substrate and an electrical conductor disposed thereon is provided. In certain examples, the heat sensitive substrate may be configured to degrade at or above a sintering temperature. In other examples, the electrical conductor may be processed, prior to disposal on the heat sensitive substrate, at the sintering temperature on a second substrate that can withstand the sintering temperature. Methods and kits are also disclosed.
摘要翻译：提供了一种包括热敏基板和设置在其上的电导体的装置。在某些实施例中，热敏基材可以被配置为在烧结温度以上或以上降解。在其他示例中，可以在处理在热敏基板上之前，在能够承受烧结温度的第二基板上的烧结温度下处理电导体。还公开了方法和试剂盒。

3. 发明申请

US20080299394A1 COATED METAL PARTICLES 有权
标题翻译：涂层金属颗粒
公开(公告)号：US20080299394A1
公开(公告)日：2008-12-04
申请号：US12191710
申请日：2008-08-14
申请人： Sanyogita Arora , Gerard R. Minogue
发明人： Sanyogita Arora , Gerard R. Minogue
IPC分类号： B32B15/04
CPC分类号： B22F1/0062 , B22F1/0059 , B22F2998/00 , B23K35/34 , H05K3/3484 , H05K2201/0224 , H05K2203/0425 , H05K2203/105 , Y10T428/2991 , Y10T428/2998
摘要： A method for preparing particles to retain a charge such that the particles are rendered electrostatically or electrokinetically mobile. The method involves coating the particles with a coating medium which facilitates attachment of a charge director material, and contacting the particles with the coating medium thereon with a charge director medium to impart a positive or negative charge thereto and thereby render the particles electrostatically or electrokinetically mobile. Electrostatically and electrokinetically mobile particles for use in an electrostatic or electrokinetic deposition process. The particles include a coating medium and a charge director on particle bodies.
摘要翻译：一种制备颗粒以保持电荷使得颗粒呈静电或电动移动的方法。该方法包括用涂覆介质涂覆颗粒，该涂层介质有助于附着电荷导向材料，并且使用电荷导向介质将颗粒与涂层介质接触，以向其施加正电荷或负电荷，从而使颗粒静电或电动移动。用于静电或电动沉积过程的静电和电动移动颗粒。颗粒包括涂层介质和颗粒体上的电荷导向器。

4. 发明授权

US06988652B2 Solder printing using a stencil having a reverse-tapered aperture 失效
公开(公告)号：US06988652B2
公开(公告)日：2006-01-24
申请号：US10156962
申请日：2002-05-29
申请人： Ian McPhee Fleck , Ron Tripp , Prashant Chouta , Scott Craig
发明人： Ian McPhee Fleck , Ron Tripp , Prashant Chouta , Scott Craig
IPC分类号： B23K31/00 , B23K31/02 , B23K1/08 , B23K37/06
CPC分类号： B41M1/12 , B41N1/24 , H05K3/1225
摘要： A stencil used for printing solder paste on a contact pad of a printed wiring board has one or more reverse-tapered apertures passing there through, wherein the apertures have a variable cross-section that is larger at the fill side of the stencil (i.e., where solder paste enters the apertures) than at the board side of the stencil (i.e., where the stencil contacts the contact pad of the printed wiring board).

5. 发明申请

US20050106329A1 Deposition and patterning process 有权
标题翻译：沉积和图案化过程
公开(公告)号：US20050106329A1
公开(公告)日：2005-05-19
申请号：US10888286
申请日：2004-07-09
申请人： Brian Lewis , Gerard Minogue , Robert Detig , Dietmar Eberlein , Bawa Singh , Michael Marczi , Kenneth Reilly
发明人： Brian Lewis , Gerard Minogue , Robert Detig , Dietmar Eberlein , Bawa Singh , Michael Marczi , Kenneth Reilly
IPC分类号： B01J19/08 , B05D1/06 , B05D1/32 , B23K3/06 , C23C20060101 , H01L21/288 , H01L21/48 , H01L21/60 , H05K3/34
CPC分类号： H05K3/3484 , B23K3/0607 , H01L21/288 , H01L21/2885 , H01L21/4853 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L2224/03622 , H01L2224/03912 , H01L2224/0401 , H01L2224/05023 , H01L2224/05155 , H01L2224/05568 , H01L2224/05647 , H01L2224/11005 , H01L2224/11332 , H01L2224/11334 , H01L2224/114 , H01L2224/11442 , H01L2224/116 , H01L2224/11849 , H01L2224/131 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01049 , H01L2924/01056 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04953 , H01L2924/09701 , H01L2924/12042 , H05K3/3478 , H05K2203/0338 , H05K2203/041 , H05K2203/0425 , H05K2203/0776 , H05K2203/09 , H05K2203/105 , H01L2224/13099 , H01L2924/00014 , H01L2924/00
摘要： A method for applying particles in a pattern to a substrate, either directly or by use of an intermediate tool, by electrokinetic or electrostatic means. A method for applying metal particles such as solder metal in a pattern to an electronic device substrate, either directly or by use of an intermediate tool, by electrokinetic or electrostatic means.
摘要翻译：通过电动或静电方式直接或通过使用中间工具将图案中的颗粒施加到基底上的方法。通过电动或静电方式直接地或通过使用中间工具将诸如焊料金属的金属颗粒以图案施加到电子器件基板的方法。

6. 发明申请

US20040251561A1 Thermoplastic fluxing underfill composition and method 有权
标题翻译：热塑性助熔剂底部填充剂组合物和方法
公开(公告)号：US20040251561A1
公开(公告)日：2004-12-16
申请号：US10458925
申请日：2003-06-11
申请人： Fry's Metals, Inc.
发明人： Mark Wilson , David Garrett
IPC分类号： H01L021/44 , H01L021/48 , H01L021/50 , H01L023/29
CPC分类号： H01L21/563 , H01L23/293 , H01L2224/73104 , H01L2224/73203 , H01L2924/01004 , H01L2924/01025 , H01L2924/01079 , H01L2924/01087 , H01L2924/01322 , H01L2924/09701
摘要： A flip chip having solder bumps and an underfill that is thermoplastic and fluxing, as well as methods for making such a device. The resulting device is well suited for a simple one-step application to a printed circuit board, thereby simplifying flip chip manufacturing processes.
摘要翻译：具有焊料凸点和热塑性和助熔剂的底部填充物的倒装芯片以及制造这种器件的方法。所得到的器件非常适用于印刷电路板的简单的一步应用，从而简化了倒装芯片制造工艺。

7. 发明授权

US08641964B2 Solder alloy 有权
标题翻译：焊锡合金
公开(公告)号：US08641964B2
公开(公告)日：2014-02-04
申请号：US12036497
申请日：2008-02-25
申请人： Brian G. Lewis , Bawa Singh , John Laughlin , Ranjit Pandher
发明人： Brian G. Lewis , Bawa Singh , John Laughlin , Ranjit Pandher
IPC分类号： C22C13/00 , C22C13/02
CPC分类号： C22C13/00
摘要： An alloy suitable for use in a ball grid array or chip scale package comprising from 0.05-1.5 wt. % copper, from 0.1-2 wt. % silver, from 0.005-0.3 wt % nickel, from 0.003-0.3 wt % chromium, from 0-0.1 wt. % phosphorus, from 0-0.1 wt. % germanium, from 0-0.1 wt. % gallium, from 0-0.3 wt. % of one or more rare earth elements, from 0-0.3 wt. % indium, from 0-0.3 wt. % magnesium, from 0-0.3 wt. % calcium, from 0-0.3 wt. % silicon, from 0-0.3 wt. % aluminum, from 0-0.3 wt. % zinc, from 0-2 wt. % bismuth, from 0-1 wt. % antimony, from 0-0.2 wt % manganese, from 0-0.3 wt % cobalt, from 0-0.3 wt % iron, and from 0-0.1 wt % zirconium, and the balance tin, together with unavoidable impurities.
摘要翻译：适用于球栅阵列或芯片级封装的合金，其包含0.05-1.5wt。％铜，0.1-2重量％％银，0.005-0.3重量％镍，0.003-0.3重量％铬，0-0.1重量％％磷，0-0.1重量％％锗，0-0.1重量％％镓，0-0.3重量％％的一种或多种稀土元素，0-0.3wt。％铟，0-0.3重量％％镁，0-0.3重量％％钙，0-0.3重量％％硅，0-0.3重量％％铝，0-0.3重量％％锌，0-2重量％％铋，0-1重量％％的锑，0-0.2重量％的锰，0-0.3重量％的钴，0-0.3重量％的铁和0-0.1重量％的锆，余量为的锡以及不可避免的杂质。

8. 发明授权

US08304062B2 Electrical conductors and methods of making and using them 有权
标题翻译：电导体及其制造和使用方法
公开(公告)号：US08304062B2
公开(公告)日：2012-11-06
申请号：US12175381
申请日：2008-07-17
申请人： Oscar Khaselev , Nitin Desai , Supriya Deverajen , Michael T. Marczi , Bawa Singh
发明人： Oscar Khaselev , Nitin Desai , Supriya Deverajen , Michael T. Marczi , Bawa Singh
IPC分类号： B32B15/01 , C03C29/00
CPC分类号： H05K3/38 , H01L31/022425 , H05K1/0306 , H05K1/097 , H05K3/125 , H05K3/246 , H05K2201/0347 , H05K2203/013 , H05K2203/1131 , Y02E10/50 , Y10T428/12535 , Y10T428/12583 , Y10T428/12597 , Y10T428/12896 , Y10T428/24802 , Y10T428/24917
摘要： Certain examples disclosed herein are directed to devices that include a substrate and conductor disposed on the substrate. In some examples, each of the conductor and the substrate may include materials that are mutually insoluble in each other. In other examples, the conductor may further comprise a substantially pure metal. In certain examples, the disposed conductor may be configured to pass adhesion tape test ASTM D3359-02. Methods of forming the conductors are also provided.
摘要翻译：本文公开的某些示例涉及包括设置在基板上的基板和导体的装置。在一些实例中，导体和基底中的每一个可以包括彼此相互不溶解的材料。在其他示例中，导体还可以包括基本上纯的金属。在某些实例中，布置的导体可以被配置为通过粘合带测试ASTM D3359-02。还提供了形成导体的方法。

9. 发明授权

US07413805B2 Preparation of metallic particles for electrokinetic or electrostatic deposition 有权
标题翻译：制备用于电动或静电沉积的金属颗粒
公开(公告)号：US07413805B2
公开(公告)日：2008-08-19
申请号：US11065764
申请日：2005-02-25
申请人： Oscar Khaselev , Brian G. Lewis
发明人： Oscar Khaselev , Brian G. Lewis
IPC分类号： B32B5/16 , H01B1/22 , B05D7/00 , B22F1/02 , B23K35/34
CPC分类号： G03G9/09708 , B22F1/0062 , B22F1/0074 , B22F2998/10 , G03G9/0902 , G03G9/09716 , H05K3/3484 , H05K2203/0425 , H05K2203/09 , H05K2203/105 , Y10T428/2982 , Y10T428/2991
摘要： Metallic particles for electrokinetic or electrostatic deposition, and a method for making such particles, comprising metallic particle bodies, an organic acid film on the particle bodies, and a charge director adhered to the organic acid film.
摘要翻译：用于电动或静电沉积的金属颗粒，以及制造这种颗粒的方法，包括金属颗粒体，颗粒体上的有机酸膜和附着到有机酸膜的电荷引导剂。

10. 发明授权

US07413771B2 Coating solder metal particles with a charge director medium 有权
标题翻译：用电荷导向剂介质涂覆焊料金属颗粒
公开(公告)号：US07413771B2
公开(公告)日：2008-08-19
申请号：US10888619
申请日：2004-07-09
申请人： Sanyogita Arora , Gerard R. Minogue
发明人： Sanyogita Arora , Gerard R. Minogue
IPC分类号： B05D7/14 , C25D15/00 , B32B5/16
CPC分类号： B22F1/0062 , B22F1/0059 , B22F2998/00 , B23K35/34 , H05K3/3484 , H05K2201/0224 , H05K2203/0425 , H05K2203/105 , Y10T428/2991 , Y10T428/2998
摘要： A method for preparing particles to retain a charge such that the particles are rendered electrostatically or electrokinetically mobile. The method involves coating the particles with a coating medium which facilitates attachment of a charge director material, and contacting the particles with the coating medium thereon with a charge director medium to impart a positive or negative charge thereto and thereby render the particles electrostatically or electrokinetically mobile. Electrostatically and electrokinetically mobile particles for use in an electrostatic or electrokinetic deposition process. The particles include a coating medium and a charge director on particle bodies.
摘要翻译：一种制备颗粒以保持电荷使得颗粒呈静电或电动移动的方法。该方法包括用涂覆介质涂覆颗粒，该涂层介质有助于附着电荷导向材料，并且使用电荷导向介质将颗粒与涂层介质接触，以向其施加正电荷或负电荷，从而使颗粒静电或电动移动。用于静电或电动沉积过程的静电和电动移动颗粒。颗粒包括涂层介质和颗粒体上的电荷导向器。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式