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1. 发明授权

US06395329B2 Printed circuit board manufacture 无效
标题翻译：印刷电路板制造
公开(公告)号：US06395329B2
公开(公告)日：2002-05-28
申请号：US08939656
申请日：1997-09-29
申请人： Andrew McIntosh Soutar , Peter Thomas McGrath
发明人： Andrew McIntosh Soutar , Peter Thomas McGrath
IPC分类号： B05D512
CPC分类号： H05K3/244 , B05D5/12 , C23C18/42 , Y10T29/4913 , Y10T29/49144
摘要： A process used during manufacture of printed circuit boards comprises protecting metal pads and/or through-holes to provide a tarnish-resistant and solderable coating. In the method, the pads and/or through-holes are bright-etched, metal plated, preferably by an immersion process, and treated with a tarnish inhibitor. The tarnish inhibitor may be incorporated into the immersion plating bath. The metal plating is usually with silver or bismuth and the pads and/or through-holes comprise copper.
摘要翻译：在制造印刷电路板期间使用的方法包括保护金属焊盘和/或通孔以提供耐光泽和可焊接的涂层。在该方法中，优选通过浸渍工艺对焊盘和/或通孔进行光刻蚀，金属镀覆，并用晦暗抑制剂处理。可以将沉淀抑制剂掺入浸镀浴中。金属镀层通常具有银或铋，并且焊盘和/或通孔包括铜。

2. 发明授权

US5955141A Process for silver plating in printed circuit board manufacture 失效
标题翻译：印刷电路板制造中的镀银工艺
公开(公告)号：US5955141A
公开(公告)日：1999-09-21
申请号：US932392
申请日：1997-09-17
申请人： Andrew McIntosh Soutar , Peter Thomas McGrath
发明人： Andrew McIntosh Soutar , Peter Thomas McGrath
IPC分类号： H05K3/42 , C23C18/42 , H05K3/24 , B05D5/12
CPC分类号： H05K3/244 , C23C18/42
摘要： In PCB manufacture, the pads and/or through-holes of a bare board are protected prior to mounting of other components by a silver plating process. The silver plate is applied from a plating composition by a replacement process in which silver ions oxidized copper and deposit a layer of silver at the surface. In the aqueous plating composition the silver ions are maintained in solution by the incorporation of a multidentate complexing agent. The compositions may contain a silver tarnish inhibitor and are free of reducing agent capable of reducing silver ions to silver metal, halide ions and substantially free of non-aqueous solvent. Surface mounted components can be soldered direct to the silver coated contact using any commercially available solder. Silver does not deposit onto solder mask, but only onto metal which is less electropositive than silver.
摘要翻译：在PCB制造中，裸板的焊盘和/或通孔在通过镀银工艺安装其它部件之前得到保护。通过银离子氧化铜并在表面沉积一层银的替换过程，由镀覆组合物施加银板。在水性电镀组合物中，通过掺入多齿络合剂将银离子保持在溶液中。组合物可以含有银晦暗抑制剂，并且不含能够将银离子还原成银金属，卤离子并基本上不含非水溶剂的还原剂。表面安装的部件可以使用任何市售的焊料直接焊接到镀银触点。银不会沉积在焊料掩模上，而只能沉积在比银正电的金属上。

3. 发明授权

US06319543B1 Process for silver plating in printed circuit board manufacture 有权
标题翻译：印刷电路板制造中的镀银工艺
公开(公告)号：US06319543B1
公开(公告)日：2001-11-20
申请号：US09282729
申请日：1999-03-31
申请人： Andrew McIntosh Soutar , Peter Thomas McGrath
发明人： Andrew McIntosh Soutar , Peter Thomas McGrath
IPC分类号： B05D512
CPC分类号： H05K3/244 , C23C18/42
摘要： In PCB manufacture, the pads and/or through-holes of a bare board are protected prior to mounting of other components by a silver plating process. The silver plate is applied from a plating composition by a replacement process in which silver ions oxidized copper and deposit a layer of silver at the surface. In the aqueous plating composition the silver ions are maintained in solution by the incorporation of a multidentate complexing agent. The compositions may contain a silver tarnish inhibitor and are free of reducing agent capable of reducing silver ions to silver metal, halide ions and substantially free of non-aqueous solvent. Surface mounted components can be soldered direct to the silver coated contact using any commercially available solder. Silver does not deposit onto solder mask, but only onto metal which is less electropositive than silver.
摘要翻译：在PCB制造中，裸板的焊盘和/或通孔在通过镀银工艺安装其它部件之前得到保护。通过银离子氧化铜并在表面沉积一层银的置换方法从镀覆组合物中施加银板。在水性电镀组合物中，通过掺入多齿络合剂将银离子保持在溶液中。组合物可以含有银晦暗抑制剂，并且不含能够将银离子还原成银金属，卤离子并基本上不含非水溶剂的还原剂。表面安装的部件可以使用任何市售的焊料直接焊接到镀银触点。银不会沉积在焊料掩模上，而只能沉积在比银正电的金属上。

4. 发明授权

US09072203B2 Solderability enhancement by silver immersion printed circuit board manufacture 有权
标题翻译：银浸渍印刷电路板制造的可焊性提高
公开(公告)号：US09072203B2
公开(公告)日：2015-06-30
申请号：US10099936
申请日：2002-03-13
申请人： Andrew McIntosh Soutar , Peter Thomas McGrath
发明人： Andrew McIntosh Soutar , Peter Thomas McGrath
IPC分类号： B05D5/12 , B05D1/18 , C04B41/51 , C23C18/40 , H05K3/24 , C23C18/42
CPC分类号： H05K3/244 , B05D5/12 , C23C18/42 , Y10T29/4913 , Y10T29/49144
摘要： A process used during manufacture of printed circuit boards comprises protecting metal pads and/or through-holes to provide a tarnish-resistant and solderable coating. In the method, the pads and/or through-holes are bright-etched, metal plated, preferably by an immersion process, and treated with a tarnish inhibitor. The tarnish inhibitor may be incorporated into the immersion plating bath. The metal plating is usually with silver or bismuth and the pads and/or through-holes comprise copper.
摘要翻译：在制造印刷电路板期间使用的方法包括保护金属焊盘和/或通孔以提供耐光泽和可焊接的涂层。在该方法中，优选通过浸渍工艺对焊盘和/或通孔进行光刻蚀，金属镀覆，并用晦暗抑制剂处理。可以将沉淀抑制剂掺入浸镀浴中。金属镀层通常具有银或铋，并且焊盘和/或通孔包括铜。

5. 再颁专利

USRE45279E1 Process for silver plating in printed circuit board manufacture 有权
标题翻译：印刷电路板制造中的镀银工艺
公开(公告)号：USRE45279E1
公开(公告)日：2014-12-09
申请号：US13471203
申请日：2012-05-14
申请人： Andrew McIntosh Soutar , Peter Thomas McGrath
发明人： Andrew McIntosh Soutar , Peter Thomas McGrath
IPC分类号： C25D3/46 , C25D5/02
CPC分类号： H05K3/244 , C23C18/42
摘要： In PCB manufacture, the pads and/or through-holes of a bare board are protected prior to mounting of other components by a silver plating process. The silver plate is applied from a plating composition by a replacement process in which silver ions oxidized copper and deposit a layer of silver at the surface. In the aqueous plating composition the silver ions are maintained in solution by the incorporation of a multidentate complexing agent. The compositions may contain a silver tarnish inhibitor and are free of reducing agent capable of reducing silver ions to silver metal, halide ions and substantially free of non-aqueous solvent. Surface mounted components can be soldered direct to the silver coated contact using any commercially available solder. Silver does not deposit onto solder mask, but only onto metal which is less electropositive than silver.REEXAMINATION RESULTSThe questions raised in reexamination proceedings Nos. 90/012,336 and 90/009,934, filed Jun. 4, 2012 and Aug. 3, 2011 respectively, have been considered, and the results thereof are reflected in this reissue patent which constitutes the reexamination certificate required by 35 U.S.C. 307 as provided in 37 CFR 1.570(e) for ex parte reexaminations, and/or the reexamination certificate required by 35 U.S.C. 316 as provided in 37 CFR 1.997(e) for inter partes reexaminations.
摘要翻译：在PCB制造中，裸板的焊盘和/或通孔在通过镀银工艺安装其它部件之前得到保护。通过银离子氧化铜并在表面沉积一层银的替换过程，由镀覆组合物施加银板。在水性电镀组合物中，通过掺入多齿络合剂将银离子保持在溶液中。组合物可以含有银晦暗抑制剂，并且不含能够将银离子还原成银金属，卤离子并基本上不含非水溶剂的还原剂。表面安装的部件可以使用任何市售的焊料直接焊接到镀银触点。银不会沉积在焊料掩模上，而只能沉积在比银正电的金属上。重审结果2012年6月4日和2011年8月3日提交的复审程序第90 / 012,336号和第90 / 009,934号提出的问题已经被考虑，其结果反映在构成复审的重新发行专利中 35USC要求的证书根据37 CFR 1.570（e）规定，单方面复审，和/或35 U.S.C.所要求的复审证书。按照第37 CFR 1.997（e）条的规定进行跨部门重新审查。

6. 发明申请

US20110279991A1 SOLDERABILITY ENHANCEMENT BY SILVER IMMERSION PRINTED CIRCUIT BOARD MANUFACTURE 审中-公开
标题翻译：镀锡印刷电路板制造的焊接性提高
公开(公告)号：US20110279991A1
公开(公告)日：2011-11-17
申请号：US13187248
申请日：2011-07-20
申请人： Andrew McIntosh Soutar , Peter Thomas McGrath
发明人： Andrew McIntosh Soutar , Peter Thomas McGrath
IPC分类号： H05K7/00 , C09D5/00 , H05K1/09 , B05D1/18
CPC分类号： H05K3/244 , B05D5/12 , C23C18/42 , Y10T29/4913 , Y10T29/49144
摘要： A process used during manufacture of printed circuit boards comprises protecting metal pads and/or through-holes to provide a tarnish-resistant and solderable coating. In the method, the pads and/or through-holes are bright-etched, metal plated, preferably by an immersion process, and treated with a tarnish inhibitor. The tarnish inhibitor may be incorporated into the immersion plating bath. The metal plating is usually with silver or bismuth and the pads and/or through-holes comprise copper.
摘要翻译：在制造印刷电路板期间使用的方法包括保护金属焊盘和/或通孔以提供耐光泽和可焊接的涂层。在该方法中，优选通过浸渍工艺对焊盘和/或通孔进行光刻蚀，金属镀覆，并用晦暗抑制剂处理。可以将沉淀抑制剂掺入浸镀浴中。金属镀层通常具有银或铋，并且焊盘和/或通孔包括铜。

7. 发明申请

US20110192638A1 SILVER IMMERSION PLATED PRINTED CIRCUIT BOARD 审中-公开
标题翻译：镀银印刷电路板
公开(公告)号：US20110192638A1
公开(公告)日：2011-08-11
申请号：US13092631
申请日：2011-04-22
申请人： Andrew McIntosh Soutar , Peter Thomas McGrath
发明人： Andrew McIntosh Soutar , Peter Thomas McGrath
IPC分类号： H05K1/09
CPC分类号： H05K3/244 , B05D5/12 , C23C18/42 , Y10T29/4913 , Y10T29/49144
摘要： A process used during manufacture of printed circuit boards comprises protecting metal pads and/or through-holes to provide a tarnish-resistant and solderable coating. In the method, the pads and/or through-holes are bright-etched, metal plated, preferably by an immersion process, and treated with a tarnish inhibitor. The tarnish inhibitor may be incorporated into the immersion plating bath. The metal plating is usually with silver or bismuth and the pads and/or through-holes comprise copper.
摘要翻译：在制造印刷电路板期间使用的方法包括保护金属焊盘和/或通孔以提供耐光泽和可焊接的涂层。在该方法中，优选通过浸渍工艺对焊盘和/或通孔进行光刻蚀，金属镀覆，并用晦暗抑制剂处理。可以将沉淀抑制剂掺入浸镀浴中。金属镀层通常具有银或铋，并且焊盘和/或通孔包括铜。

8. 发明授权

US06860925B2 Printed circuit board manufacture 失效
标题翻译：印刷电路板制造
公开(公告)号：US06860925B2
公开(公告)日：2005-03-01
申请号：US10118417
申请日：2002-04-08
申请人： Andrew McIntosh Soutar , Peter Thomas McGrath
发明人： Andrew McIntosh Soutar , Peter Thomas McGrath
IPC分类号： C23C18/31 , C23C18/32 , C23C18/42 , H05K3/24 , H05K3/42
CPC分类号： H05K3/244 , B05D5/12 , C23C18/42 , Y10T29/4913 , Y10T29/49144
摘要： A process used during manufacture of printed circuit boards comprises protecting metal pads and/or through-holes to provide a tarnish-resistant and solderable coating. In the method, the pads and/or through-holes are bright-etched, metal plated, preferably by an immersion process, and treated with a tarnish inhibitor. The tarnish inhibitor may be incorporated into the immersion plating bath. The metal plating is usually with silver or bismuth and the pads and/or through-holes comprise copper.
摘要翻译：在制造印刷电路板期间使用的方法包括保护金属焊盘和/或通孔以提供耐光泽和可焊接的涂层。在该方法中，优选通过浸渍工艺对焊盘和/或通孔进行光刻蚀，金属镀覆，并用晦暗抑制剂处理。可以将沉淀抑制剂掺入浸镀浴中。金属镀层通常具有银或铋，并且焊盘和/或通孔包括铜。

9. 发明授权

US6074803A Bonding inner layers in printed circuit board manufacture 失效
标题翻译：在印刷电路板制造中粘合内层
公开(公告)号：US6074803A
公开(公告)日：2000-06-13
申请号：US976906
申请日：1997-11-24
申请人： Peter Thomas McGrath , Wolfgang Hetterich
发明人： Peter Thomas McGrath , Wolfgang Hetterich
IPC分类号： G03F7/027 , H05K3/00 , H05K3/06 , H05K3/38 , H05K3/46
CPC分类号： H05K3/386 , H05K3/4626 , H05K2201/0195 , H05K2203/0571 , H05K3/0023 , H05K3/064
摘要： A process for manufacturing a multi-layer circuit board comprises applying a layer of a photo-resist to the conducting surface of an inner-layer and fixing the resin composition in a pre-selected pattern for example by exposing to UV radiation which results in polymerization in the exposed areas. After removing the non-fixed areas by developing in an aqueous developing solution and etching in an etching solution, the fixed areas of resin composition remain in place on the inner-layer and are directly adhered to the neighboring insulating layer in an adhesion step.The preferred resin compositions according to the invention comprise a first photo-polymerizable resin component having an acid number from 15 to 75, a second epoxy resin component having unreacted epoxy groups, and a photoinitator, the ratio or first to second resin components being at least 1:1.
摘要翻译：制造多层电路板的方法包括将一层光致抗蚀剂涂覆在内层的导电表面上，并将树脂组合物以预先选择的图案固定，例如通过暴露于导致聚合的UV辐射在暴露的地区。通过在水性显影液中显影而除去非固定区域并在蚀刻溶液中进行蚀刻，树脂组合物的固定区域在内层保持在适当位置，并且在粘合步骤中直接粘附到相邻的绝缘层。根据本发明的优选的树脂组合物包含酸值为15至75的第一可光聚合树脂组分，具有未反应的环氧基的第二环氧树脂组分和光引发剂，所述比例或第一至第二树脂组分至少为 1：1。

10. 发明授权

US5800859A Copper coating of printed circuit boards 失效
标题翻译：印刷电路板的铜涂层
公开(公告)号：US5800859A
公开(公告)日：1998-09-01
申请号：US570442
申请日：1995-12-11
申请人： Andrew David Price , Peter Thomas McGrath
发明人： Andrew David Price , Peter Thomas McGrath
IPC分类号： B32B15/08 , C23C22/16 , C23C22/52 , C23F1/18 , H05K3/00 , H05K3/38 , H05K3/46 , B05D5/12
CPC分类号： C23C22/16 , C23C22/52 , C23F1/18 , H05K3/383 , H05K2201/0355 , H05K2203/0796 , H05K2203/124 , H05K3/4611
摘要： A process for copper coating printed circuit boards is disclosed. The process includes a treating step in which a metal surface is contacted with an adhesion promotion composition material. The adhesion promotion material includes 0.1 to 20% by weight hydrogen peroxide, an inorganic acid, an organic corrosion inhibitor and a surfactant.
摘要翻译：公开了一种铜涂布印刷电路板的方法。该方法包括处理步骤，其中金属表面与粘附促进组合物材料接触。粘合促进材料包括0.1至20重量％的过氧化氢，无机酸，有机腐蚀抑制剂和表面活性剂。

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