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    • 8. 发明授权
    • Tracking and focus servo system with defect detection
    • 跟踪和聚焦具有缺陷检测的伺服系统
    • US07016280B2
    • 2006-03-21
    • US09950379
    • 2001-09-10
    • Ron J. Kadlec
    • Ron J. Kadlec
    • G11B7/00
    • G11B7/08576G11B7/0948G11B7/123
    • A defect detector in an optical disk drive is presented. The defect detector indicates a defect by monitoring a sum signal. The sum signal is calculated from optical signals from detectors in an optical pick-up unit of the optical disk drive. A defect can be indicated when a filtered sum signal, the filtered sum signal being the sum signal filtered with a high pass filter, is above a threshold value. In some embodiments, the defect detector can recognize changes in laser power or transitions between media types and not indicate defects during those occurrences.
    • 介绍了光盘驱动器中的缺陷检测器。 缺陷检测器通过监视和信号来指示缺陷。 总和信号由光盘驱动器的光学拾取单元中的检测器的光信号计算。 当滤波后的和信号(滤波的和信号是用高通滤波器滤波的和信号)高于阈值时,可以指示缺陷。 在一些实施例中,缺陷检测器可以识别激光功率的变化或介质类型之间的转换,并且在这些事件期间不指示缺陷。
    • 10. 发明授权
    • Micro lens and method and apparatus for fabricating
    • 微透镜及其制造方法和装置
    • US06914724B2
    • 2005-07-05
    • US10278719
    • 2002-10-22
    • Ian R. Redmond
    • Ian R. Redmond
    • G02B3/00G11B7/135G11B7/22G02B27/10B29D11/00
    • G11B7/1353G02B3/00G11B7/1374G11B7/13922G11B7/22
    • Micro lenses are fabricated using processes which operate on multiple lenses at a time. In one embodiment, wafer-scale processing includes employing photolithography for defining gray-scale masks which permit relatively smooth or continuous curvatures of lens surfaces to be formed by, e.g., reactive ion etching. Processes and materials are used which achieve desired etching at a sufficiently rapid rate such as etching to a depth of about 200 micrometers in less than about 10 hours. Wafer-scale molding processes can also be used. Diffractive features can be formed on or adjacent lens surfaces to provide functions such as dispersion correction. Also, sub-wavelength scale features may be etched to provide quarter-wave plate functionality, birefringence, anti-reflective functions and the like. Structures such as mounting rings and/or crash stops can be formed integrally with the lens body, eliminating the need to glue or otherwise couple separate components.
    • 微透镜使用一次在多个透镜上操作的工艺来制造。 在一个实施例中,晶片级处理包括采用光刻法定义灰度掩模,其允许通过例如反应离子蚀刻形成透镜表面的相对平滑或连续的曲率。 使用以足够快的速率实现期望的蚀刻的工艺和材料,例如在小于约10小时内蚀刻到约200微米的深度。 也可以使用晶片级成型工艺。 衍射特征可以形成在透镜表面上或附近,以提供诸如色散校正的功能。 此外,亚波长尺度特征可以被蚀刻以提供四分之一波片的功能,双折射,抗反射功能等。 诸如安装环和/或碰撞止挡件的结构可以与镜体整体形成,从而不需要胶合或以其它方式耦合分开的部件。