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1. 发明公开

US20240355083A1 INSPECTION SYSTEM FOR EDGE AND BEVEL INSPECTION OF SEMICONDUCTOR STRUCTURES 审中-公开
公开(公告)号：US20240355083A1
公开(公告)日：2024-10-24
申请号：US18644312
申请日：2024-04-24
申请人： CAMTEK LTD
发明人： Carmel Yehuda DRILLMAN , Mordi DAHAN , Moshe EDRI , Ohad SHIMON , Shimon KOREN , Gil PERLBERG
IPC分类号： G06V10/145 , G01N21/95 , G06T7/00 , G06T7/13 , H04N23/56
CPC分类号： G06V10/145 , G01N21/9503 , G06T7/0004 , G06T7/13 , H04N23/56 , G06T2207/10152 , G06T2207/30148
摘要： An inspection system and method are presented for edge and bevel inspection of a semiconductor structure using and an optical system defining: a tangential imaging providing back-light tangential illumination propagating along a tangential illumination path with respect to a contour outline of a contour region of an edge of the structure and substantially along a detection path of a tangential imaging sensor unit which detects at least a part of said back-light tangential illumination and generates image data indicative of a tangential image of the contour outline to enable detection of defect data of the edge, and at least dark-field imaging setup directing dark-field illumination towards the contour region along at least one dark-field illumination path and providing collection of scattering of a response of the contour region to the dark-field illumination, to enable detection of a dark-field image indicative of location of defects along said profile of the edge.

2. 发明公开

US20240289945A1 METHOD AND SYSTEM FOR CLASSIFYING DEFECTS IN WAFER USING WAFER-DEFECT IMAGES, BASED ON DEEP LEARNING 审中-公开
公开(公告)号：US20240289945A1
公开(公告)日：2024-08-29
申请号：US18641395
申请日：2024-04-21
申请人： CAMTEK LTD.
发明人： Isaac Daniel Buzaglo , Nir Dromi
IPC分类号： G06T7/00 , G01N21/95 , G06T7/90 , H01L21/66
CPC分类号： G06T7/001 , G01N21/9501 , G06T7/90 , H01L22/12 , G06T2207/10024 , G06T2207/10116 , G06T2207/20081 , G06T2207/20084 , G06T2207/20221 , G06T2207/30148
摘要： The present disclosure provides method and system 100 for classifying defects in wafer using wafer defect images, based on deep learning network. Embodiments herein uses synergy between several modalities of the wafer defect images for the classification decision. Further, by adding a mixture of modalities, information may be obtained from different sources such as color image, ICI, the black and white image, to classify the defect image. In addition to mixture of modalities, a reference image may be used for each modality. The reference image of each modality image is provided to deep learning models to concentrate on the defect itself and not on the related underlying lithography of the defect image. Further, the reference image may be provided to the training process of the deep learning models that may significantly reduce the number of labelled images and the training epochs required for convergence of the deep learning model.

3. 发明公开

US20230280282A1 CONTINUOUS BUMP MEASUREMENT HEIGHT METROLOGY 审中-公开
公开(公告)号：US20230280282A1
公开(公告)日：2023-09-07
申请号：US18005351
申请日：2021-07-11
申请人： CAMTEK Ltd.
发明人： Eyal Segev
IPC分类号： G01N21/95 , G01N21/956 , G01B11/06
CPC分类号： G01N21/9501 , G01N21/956 , G01B11/06
摘要： A method that may include performing first measurements of the height differences between the bumps and the corresponding areas, by illuminating the bumps and the corresponding areas with first radiation; wherein the first measurements are subjected to first measurement errors resulting from a virtual penetration of the first illumination into the layer; wherein each bump has a corresponding area that is proximate to the bump; preforming second measurements of thickness of the layer at the corresponding areas; wherein at least some of the first measurements are executed in parallel to an executing of at least some of the second measurements; determining first measurement errors, based on the second measurements; and determining the height differences between the bumps and the corresponding areas based on the first measurements and the first measurements errors.

4. 发明授权

US11055836B2 Optical contrast enhancement for defect inspection 有权
公开(公告)号：US11055836B2
公开(公告)日：2021-07-06
申请号：US16273162
申请日：2019-02-12
申请人： CAMTEK LTD.
发明人： Zehava Ben Ezer
IPC分类号： G06T7/00 , G01N21/88 , G02B27/30 , H04N5/232
摘要： An inspection system and a method for inspection an object. The method may include acquiring a defocused image of an area of an object, and processing the defocused image of the area to find a phase shift between optical paths associated with certain proximate points of the area. The phase shift may be indicative of a defect. The acquiring of the defocused image may include illuminating the area with a radiation beam that may be spatially coherent and collimated when impinging on the area. The illuminating may include passing the radiation beam through an aperture that may be defined by an aperture stop that may be positioned within an aperture stop plane. The size of the aperture may be a fraction of a size of the aperture stop.

5. 发明授权

US11047807B2 Defect detection 有权
公开(公告)号：US11047807B2
公开(公告)日：2021-06-29
申请号：US16829118
申请日：2020-03-25
申请人： CAMTEK Ltd.
发明人： Daniel Buzaglo
IPC分类号： G01N21/95 , G06T9/00 , G06T15/00 , G06N3/02
摘要： There may be provided a method for determining three dimensional (3D) defect information, the method may include performing a two-dimensional (2D) inspection of an area of a wafer to generate 2D defect information related to defects of the area of the wafer; estimating 3D defect information regarding the defects of the area of the wafer, wherein the estimating is based on the 2D defect information related to defects of the area of the wafer, and a mapping between 2D defect information and 3D defect information, wherein the mapping is generated using a supervised deep learning machine process.

6. 发明授权

US10989670B1 Detection of pits using an automatic optical inspection system 有权
公开(公告)号：US10989670B1
公开(公告)日：2021-04-27
申请号：US16221630
申请日：2018-12-17
申请人： CAMTEK LTD.
发明人： Aki Shoukrun
IPC分类号： G01N21/95 , G01N21/956
摘要： A method for detecting defects in a thinned die, the method may include inspecting the thinned die with a two-dimensional inspection module, to find suspected defects that appear as non-reflecting regions that fulfill a size condition; measuring, using a depth measurement module, a depth of the suspected defects; and defining a suspected defects as a defects when the depth parameter exceeds a depth threshold.

7. 发明授权

US10203289B2 Inspection system and a method for inspecting a diced wafer 有权
公开(公告)号：US10203289B2
公开(公告)日：2019-02-12
申请号：US12064355
申请日：2006-08-29
申请人： Yuri Postolov , Menachem Regensburger
发明人： Yuri Postolov , Menachem Regensburger
IPC分类号： G01N21/95 , G01N21/956 , H01L21/67
摘要： An inspection system and a method for inspecting a diced wafer. The method includes: acquiring multiple images of multiple portions of the diced wafer according to a predefined image acquisition scheme; locating multiple unique features within the multiple images; and assigning a die index to each die of the multiple dice and associating between the multiple dice and multiple reference dice in response to locations of the multiple unique features and to at least one expected die dimension.

8. 发明申请

US20150359094A1 SURFACE PRETREATMENT AND DROP SPREADING CONTROL ON MULTI COMPONENT SURFACES 有权
标题翻译：多组分表面的表面预处理和倒角扩展控制
公开(公告)号：US20150359094A1
公开(公告)日：2015-12-10
申请号：US14761380
申请日：2014-01-21
申请人： CAMTEK LTD.
发明人： Boaz NITZAN
IPC分类号： H05K1/05 , B41J11/00
CPC分类号： H05K1/056 , B41J11/0015 , B41M5/0011 , H01L21/306 , H05K3/3452 , H05K3/38 , H05K2203/013 , H05K2203/122 , Y10T428/24802
摘要： Methods, systems and produced printed substrates are provided, which include substrates composed of one or more materials which are treated by an intermediate layer for normalizing surface energies and a digitally printed formulation adapted to the normalized surface energies. Surface energy normalization may be carried out by physical processes or by selective chemical processes. In an example, a self-assembled monolayer is applied to the surface of a printed circuit board to control ink jet dots by reducing copper surface energy and to improve ink adhesion. The self-assembled monolayer binds via an α group selectively and covalently to the copper on the board and binds via a hydrophobic co group to solder mask ink that is applied to the board. The co group participates in the solidification process of the ink.
摘要翻译：提供了方法，系统和生产的印刷基板，其包括由用于归一化表面能的中间层处理的一种或多种材料构成的基板和适合归一化表面能的数字印刷配方。表面能归一化可以通过物理过程或选择性化学过程进行。在一个示例中，将自组装单层施加到印刷电路板的表面上，以通过减少铜表面能并改善墨粘附来控制喷墨点。自组装单层通过α基团选择性和共价地结合到板上的铜上，并通过疏水性基团结合施加到板上的焊料掩模油墨。集团参与墨水的凝固过程。

9. 发明授权

US09147102B2 Method and system for measuring bumps based on phase and amplitude information 有权
标题翻译：基于相位和幅度信息测量凸块的方法和系统
公开(公告)号：US09147102B2
公开(公告)日：2015-09-29
申请号：US13342119
申请日：2012-01-02
申请人： Shimon Koren , Or Shur , Gilad Golan
发明人： Shimon Koren , Or Shur , Yacov Malinovich , Gilad Golan
IPC分类号： G06K9/32 , G06K9/00 , G02B21/00 , G01N21/956 , G01B11/06
CPC分类号： G06K9/00127 , G01B11/0608 , G01N21/95607 , G01N21/95684 , G02B21/0016 , G02B21/0056
摘要： A method and device for measuring a height of a microscopic structure such as solder bumps. For simplicity of explanation, the invention is described with respect to phase information and amplitude information wherein phase detection and calculation algorithms are being used.
摘要翻译：用于测量诸如焊锡凸块的微观结构的高度的方法和装置。为了说明的简单，对相位检测和计算算法正在使用的相位信息和振幅信息进行说明。

10. 发明授权

US08836780B2 Process control and manufacturing method for fan out wafers 有权
标题翻译：扇出晶圆的工艺控制和制造方法
公开(公告)号：US08836780B2
公开(公告)日：2014-09-16
申请号：US13047811
申请日：2011-03-15
申请人： Tommy Weiss , Nevo Laron , Thomas Molders , Aki Shoukrun , Nadav Wertsman
发明人： Tommy Weiss , Nevo Laron , Thomas Molders , Aki Shoukrun , Nadav Wertsman
IPC分类号： H04N7/18 , H01L21/66
CPC分类号： H01L22/20 , H01L21/568 , H01L22/12 , H01L2224/96 , H01L2924/014
摘要： A system and method for monitoring a manufacturing process of a fan-out wafer, the method may include acquiring a first set of images of dies after a completion of a first manufacturing stage of a manufacturing process of the fan-out wafer; processing the first set of images to detect defects; performing at least one corrective operation in response to at least one defect detected by processing the first set of images; acquiring a second set of images of dies after a completion of a second manufacturing stage of the manufacturing process of the fan-out wafer, the second manufacturing process follows the first manufacturing process; processing the second set of images to detect defects; and performing at least one corrective operation in response to at least one defect detected by processing the second set of images.
摘要翻译：一种用于监视扇出晶片的制造过程的系统和方法，所述方法可以包括在完成扇出晶片的制造过程的第一制造阶段之后获取模具的第一组图像; 处理第一组图像以检测缺陷; 响应于通过处理第一组图像检测到的至少一个缺陷来执行至少一个校正操作; 在扇出晶片的制造过程的第二制造阶段完成之后获取第二组模具图像，第二制造过程遵循第一制造过程; 处理第二组图像以检测缺陷; 以及响应于通过处理所述第二组图像检测到的至少一个缺陷来执行至少一个校正操作。

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