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1. 发明授权

US08836780B2 Process control and manufacturing method for fan out wafers 有权
标题翻译：扇出晶圆的工艺控制和制造方法
公开(公告)号：US08836780B2
公开(公告)日：2014-09-16
申请号：US13047811
申请日：2011-03-15
申请人： Tommy Weiss , Nevo Laron , Thomas Molders , Aki Shoukrun , Nadav Wertsman
发明人： Tommy Weiss , Nevo Laron , Thomas Molders , Aki Shoukrun , Nadav Wertsman
IPC分类号： H04N7/18 , H01L21/66
CPC分类号： H01L22/20 , H01L21/568 , H01L22/12 , H01L2224/96 , H01L2924/014
摘要： A system and method for monitoring a manufacturing process of a fan-out wafer, the method may include acquiring a first set of images of dies after a completion of a first manufacturing stage of a manufacturing process of the fan-out wafer; processing the first set of images to detect defects; performing at least one corrective operation in response to at least one defect detected by processing the first set of images; acquiring a second set of images of dies after a completion of a second manufacturing stage of the manufacturing process of the fan-out wafer, the second manufacturing process follows the first manufacturing process; processing the second set of images to detect defects; and performing at least one corrective operation in response to at least one defect detected by processing the second set of images.
摘要翻译：一种用于监视扇出晶片的制造过程的系统和方法，所述方法可以包括在完成扇出晶片的制造过程的第一制造阶段之后获取模具的第一组图像; 处理第一组图像以检测缺陷; 响应于通过处理第一组图像检测到的至少一个缺陷来执行至少一个校正操作; 在扇出晶片的制造过程的第二制造阶段完成之后获取第二组模具图像，第二制造过程遵循第一制造过程; 处理第二组图像以检测缺陷; 以及响应于通过处理所述第二组图像检测到的至少一个缺陷来执行至少一个校正操作。

2. 发明申请

US20110249111A1 PROCESS CONTROL AND MANUFACTURING METHOD FOR FAN OUT WAFERS 有权
标题翻译：风扇的过程控制和制造方法
公开(公告)号：US20110249111A1
公开(公告)日：2011-10-13
申请号：US13047811
申请日：2011-03-15
申请人： Tommy Weiss , Nevo Laron , Thomas Molders , Aki Shoukrun , Nadav Wertsman
发明人： Tommy Weiss , Nevo Laron , Thomas Molders , Aki Shoukrun , Nadav Wertsman
IPC分类号： H01L21/66 , H04N7/18
CPC分类号： H01L22/20 , H01L21/568 , H01L22/12 , H01L2224/96 , H01L2924/014
摘要： A system and method for monitoring a manufacturing process of a fan-out wafer, the method may include acquiring a first set of images of dies after a completion of a first manufacturing stage of a manufacturing process of the fan-out wafer; processing the first set of images to detect defects; performing at least one corrective operation in response to at least one defect detected by processing the first set of images; acquiring a second set of images of dies after a completion of a second manufacturing stage of the manufacturing process of the fan-out wafer, the second manufacturing process follows the first manufacturing process; processing the second set of images to detect defects; and performing at least one corrective operation in response to at least one defect detected by processing the second set of images.
摘要翻译：一种用于监视扇出晶片的制造过程的系统和方法，所述方法可以包括在完成扇出晶片的制造过程的第一制造阶段之后获取模具的第一组图像; 处理第一组图像以检测缺陷; 响应于通过处理第一组图像检测到的至少一个缺陷来执行至少一个校正操作; 在扇出晶片的制造过程的第二制造阶段完成之后获取第二组模具图像，第二制造过程遵循第一制造过程; 处理第二组图像以检测缺陷; 以及响应于通过处理所述第二组图像检测到的至少一个缺陷来执行至少一个校正操作。

3. 发明申请

US20140113526A1 WAFER PROCESS CONTROL 审中-公开
标题翻译：滤波过程控制
公开(公告)号：US20140113526A1
公开(公告)日：2014-04-24
申请号：US14054861
申请日：2013-10-16
申请人： Ran Kipper , Tommy Weiss
发明人： Ran Kipper , Tommy Weiss
IPC分类号： B24B37/013 , H01L21/304 , B24B49/12
CPC分类号： H01L21/304 , B24B37/013 , B24B49/12 , H01L21/6835 , H01L21/6836 , H01L21/76898 , H01L22/12 , H01L22/20 , H01L22/26 , H01L2221/68327 , H01L2221/6834
摘要： A system for controlling a manufacturing process of a substrate, the system may include an illumination module that is arranged to illuminate multiple regions of a substrate with electromagnetic radiation; a detection module that is arranged to detect electromagnetic signals resulting from the illumination of the multiple regions; and a processor that is arranged to: determine dimensions of multiple vias that are deposited within a substrate of the substrate to provide first via measurement results; determine substrate thickness at multiple locations to provide first substrate thickness results; and provide information related to at least one out of (a) the first substrate thickness results and (b) the first via measurement results to at least one out of (i) a thinning device arranged to thin the substrate and (ii) a manufacturing device that differs from the thinning device and is arranged to participate in a manufacturing of the substrate.
摘要翻译：一种用于控制基板的制造工艺的系统，该系统可以包括照明模块，其被布置成用电磁辐射照射基板的多个区域; 检测模块，被配置为检测由多个区域的照明产生的电磁信号; 以及处理器，其被布置为：确定沉积在所述衬底的衬底内以提供第一通孔测量结果的多个通孔的尺寸; 在多个位置确定衬底厚度以提供第一衬底厚度结果; 并且提供与（a）第一基板厚度结果和（b）第一通孔测量结果中的至少一个相关的信息至（i）设置成薄化基板的薄化装置和（ii）制造该装置与稀疏装置不同，并且被布置成参与基板的制造。

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