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    • 2. 发明授权
    • Adhesive chuck, and apparatus and method for assembling substrates using the same
    • 粘合剂卡盘,以及使用其组装基板的装置和方法
    • US08361267B2
    • 2013-01-29
    • US13035007
    • 2011-02-25
    • Seok-Hee Shim
    • Seok-Hee Shim
    • B29C65/18B32B37/14B23K37/04H05K3/36
    • H01L21/6831H01L21/67092H01L21/6875Y10S29/90Y10T29/49126Y10T29/49133Y10T29/53265Y10T279/34
    • An adhesive chuck, and an apparatus and method for assembling substrates using the same are disclosed. The apparatus comprises a chamber, a first adhesive chuck inside the chamber and having a plurality of adhesive protrusions to adhere to a first substrate conveyed from an outside into the chamber via an intermolecular attractive force, and a driving unit to move the first substrate adhered to the first adhesive chuck and a second substrate toward each other to be compressed and assembled to each other. The apparatus can achieve adhesion and separation of a substrate with minimal power consumption, enhancing an to operating efficiency. Additionally, the adhesive chuck can overcome a problem of spot generation on a display panel caused by remaining static electricity. Furthermore, since the adhesive chuck is almost free from a problem of electric instability, it can exhibit high stability and efficiency and can be fabricated at lower costs.
    • 公开了一种粘合卡盘,以及用于组装使用其的基板的装置和方法。 该装置包括腔室,腔室内的第一粘合卡盘,并且具有多个粘合突起,以通过分子间吸引力粘附到从外部输送到腔室中的第一基底;以及驱动单元,用于将第一基底粘附到 第一粘合剂卡盘和彼此朝向彼此压缩和组装的第二基板。 该设备可以以最小的功耗实现基板的粘合和分离,从而提高了操作效率。 此外,粘合卡盘可以克服由剩余静电引起的显示面板上的斑点产生的问题。 此外,由于粘合卡盘几乎没有电不稳定性的问题,因此可以表现出高的稳定性和效率,并且可以以较低的成本制造。
    • 4. 发明申请
    • ADHESIVE CHUCK, AND APPARATUS AND METHOD FOR ASSEMBLING SUBSTRATES USING THE SAME
    • 胶粘剂,以及使用其组装基材的装置和方法
    • US20110187063A1
    • 2011-08-04
    • US13035007
    • 2011-02-25
    • Seok-Hee SHIM
    • Seok-Hee SHIM
    • B23B31/02
    • H01L21/6831H01L21/67092H01L21/6875Y10S29/90Y10T29/49126Y10T29/49133Y10T29/53265Y10T279/34
    • An adhesive chuck, and an apparatus and method for assembling substrates using the same are disclosed. The apparatus comprises a chamber, a first adhesive chuck inside the chamber and having a plurality of adhesive protrusions to adhere to a first substrate conveyed from an outside into the chamber via an intermolecular attractive force, and a driving unit to move the first substrate adhered to the first adhesive chuck and a second substrate toward each other to be compressed and assembled to each other. The apparatus can achieve adhesion and separation of a substrate with minimal power consumption, enhancing an to operating efficiency. Additionally, the adhesive chuck can overcome a problem of spot generation on a display panel caused by remaining static electricity. Furthermore, since the adhesive chuck is almost free from a problem of electric instability, it can exhibit high stability and efficiency and can be fabricated at lower costs.
    • 公开了一种粘合卡盘,以及用于组装使用其的基板的装置和方法。 该装置包括腔室,腔室内的第一粘合卡盘,并且具有多个粘合突起,以通过分子间吸引力粘附到从外部输送到腔室中的第一基底;以及驱动单元,用于将第一基底粘附到 第一粘合剂卡盘和彼此朝向彼此压缩和组装的第二基板。 该设备可以以最小的功耗实现基板的粘合和分离,从而提高了操作效率。 此外,粘合卡盘可以克服由剩余静电引起的显示面板上的斑点产生的问题。 此外,由于粘合卡盘几乎没有电不稳定性的问题,因此可以表现出高的稳定性和效率,并且可以以较低的成本制造。
    • 8. 发明授权
    • Substrate bonding apparatus
    • 基板接合装置
    • US08245751B2
    • 2012-08-21
    • US12260529
    • 2008-10-29
    • Jae Seok Hwang
    • Jae Seok Hwang
    • B32B37/10
    • B32B37/1018B32B37/0046B32B2457/20G02F1/1303G02F1/1339Y10T156/1126Y10T156/15Y10T156/17Y10T156/1928
    • A substrate bonding apparatus and method are provided. The substrate bonding apparatus may include a board having a receiving surface opposite to a substrate fixed at one side thereof, a plurality of chucking members located between the receiving surface of the board and the substrate, and a substrate separation device to separate the substrate from the chucking members. The substrate separation device includes a pusher for pushing the substrate to separate the substrate from the chucking members, and a base plate installed at the receiving surface of the board, the base plate having an installation space to install the pusher formed therein. The pusher protrudes out of the base plate through an inlet and outlet port located at one end of the installation space to pressurize the substrate.
    • 提供了一种基板接合装置和方法。 基板接合装置可以包括具有与固定在其一侧的基板相对的接收表面的板,位于板的接收表面和基板之间的多个夹紧构件,以及将基板与基板分离的基板分离装置 夹紧构件。 基板分离装置包括用于推动基板以将基板与夹紧构件分离的推动器以及安装在基板的接收表面上的基板,该基板具有安装在其中的推动器的安装空间。 推动器通过位于安装空间一端的入口和出口突出出基板,以对基板加压。