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1. 发明授权

US06525429B1 Methods of making microelectronic assemblies including compliant interfaces 有权
公开(公告)号：US06525429B1
公开(公告)日：2003-02-25
申请号：US09517852
申请日：2000-03-02
申请人： Zlata Kovac , Craig Mitchell , Thomas Distefano , John Smith
发明人： Zlata Kovac , Craig Mitchell , Thomas Distefano , John Smith
IPC分类号： H01L2348
CPC分类号： H01L24/81 , H01L21/56 , H01L21/563 , H01L23/49811 , H01L23/49827 , H01L23/4985 , H01L24/72 , H01L24/75 , H01L2224/16 , H01L2224/73203 , H01L2224/73204 , H01L2224/75 , H01L2224/75301 , H01L2224/81801 , H01L2224/83136 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01033 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/15311 , H01L2924/1532 , H01L2924/16152 , H01L2924/19041 , H01L2924/19043 , H05K1/118 , H05K3/361 , H05K3/4084 , H05K2201/0133 , H05K2201/0394 , H05K2201/0397 , H05K2201/09081 , H05K2201/091 , H05K2203/063 , Y10T29/4913 , Y10T29/49144 , Y10T29/49174 , H01L2924/00014
摘要： A method of making a microelectronic assembly including a compliant interface includes providing a first support structure, such as a flexible dielectric sheet, having a first surface and a porous resilient layer on the first surface of the first support structure, stretching the first support structure and bonding the stretched first support structure to a ring structure. The first surface of a second support structure, such as a semiconductor wafer, is then abutted against the porous layer and, desirably after the abutting step, a first curable liquid is disposed between the first and second support structures and within the porous layer. The first curable liquid may then be at least partially cured.

2. 发明授权

US06870272B2 Methods of making microelectronic assemblies including compliant interfaces 失效
公开(公告)号：US06870272B2
公开(公告)日：2005-03-22
申请号：US10123547
申请日：2002-04-16
申请人： Zlata Kovac , Craig Mitchell , Thomas Distefano , John Smith
发明人： Zlata Kovac , Craig Mitchell , Thomas Distefano , John Smith
IPC分类号： H01L21/56 , H01L21/60 , H01L23/31 , H01L23/48 , H01L23/498 , H05K1/11 , H05K3/36 , H05K3/40
CPC分类号： H01L24/81 , H01L21/56 , H01L21/563 , H01L21/565 , H01L23/3114 , H01L23/49811 , H01L23/49816 , H01L23/49827 , H01L23/4985 , H01L24/29 , H01L24/72 , H01L24/97 , H01L2224/16 , H01L2224/73203 , H01L2224/81136 , H01L2224/81801 , H01L2224/83136 , H01L2224/83192 , H01L2224/83194 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01033 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/1532 , H01L2924/16152 , H01L2924/19041 , H01L2924/19043 , H01L2924/351 , H05K1/118 , H05K3/361 , H05K3/4084 , H05K2201/0133 , H05K2201/0394 , H05K2201/0397 , H05K2201/09081 , H05K2203/063 , H01L2224/81 , H01L2924/3512 , H01L2924/00
摘要： An assembly includes a structure, a plurality of terminals and a plurality of compliant pads disposed between said terminals and said structure. The terminals are aligned with at least some of said pads, with the pads providing a standoff between the structure and the terminals. The compliant pads are preferably made of a non-conductive material such as a silicone elastomer.

3. 发明申请

US20050139986A1 Methods of making microelectronic assemblies including compliant interfaces 审中-公开
标题翻译：制造微电子组件的方法包括兼容接口
公开(公告)号：US20050139986A1
公开(公告)日：2005-06-30
申请号：US11064630
申请日：2005-02-24
申请人： Zlata Kovac , Craig Mitchell , Thomas Distefano , John Smith
发明人： Zlata Kovac , Craig Mitchell , Thomas Distefano , John Smith
IPC分类号： H01L21/56 , H01L21/60 , H01L23/31 , H01L23/48 , H01L23/498 , H05K1/11 , H05K3/36 , H05K3/40 , H01L23/04 , H01L23/52 , H01L29/40
CPC分类号： H01L24/81 , H01L21/56 , H01L21/563 , H01L21/565 , H01L23/3114 , H01L23/49811 , H01L23/49816 , H01L23/49827 , H01L23/4985 , H01L24/29 , H01L24/72 , H01L24/97 , H01L2224/16 , H01L2224/73203 , H01L2224/81136 , H01L2224/81801 , H01L2224/83136 , H01L2224/83192 , H01L2224/83194 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01033 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/1532 , H01L2924/16152 , H01L2924/19041 , H01L2924/19043 , H01L2924/351 , H05K1/118 , H05K3/361 , H05K3/4084 , H05K2201/0133 , H05K2201/0394 , H05K2201/0397 , H05K2201/09081 , H05K2203/063 , H01L2224/81 , H01L2924/3512 , H01L2924/00
摘要： An assembly includes a structure, a plurality of terminals and a plurality of compliant pads disposed between said terminals and said structure. The terminals are aligned with at least some of said pads, with the pads providing a standoff between the structure and the terminals. The compliant pads are preferably made of a non-conductive material such as a silicone elastomer.
摘要翻译：组件包括设置在所述端子和所述结构之间的结构，多个端子和多个柔性焊盘。端子与至少一些所述焊盘对准，焊盘在结构和端子之间提供间隔。柔性衬垫优选地由诸如硅氧烷弹性体的非导电材料制成。

4. 发明授权

US06723584B2 Methods of making microelectronic assemblies including compliant interfaces 失效
标题翻译：制造微电子组件的方法包括兼容接口
公开(公告)号：US06723584B2
公开(公告)日：2004-04-20
申请号：US10255297
申请日：2002-09-26
申请人： Zlata Kovac , Craig Mitchell , Thomas Distefano , John Smith
发明人： Zlata Kovac , Craig Mitchell , Thomas Distefano , John Smith
IPC分类号： H01L2148
CPC分类号： H01L24/81 , H01L21/56 , H01L21/563 , H01L23/49811 , H01L23/49827 , H01L23/4985 , H01L24/72 , H01L24/75 , H01L2224/16 , H01L2224/73203 , H01L2224/73204 , H01L2224/75 , H01L2224/75301 , H01L2224/81801 , H01L2224/83136 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01033 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/15311 , H01L2924/1532 , H01L2924/16152 , H01L2924/19041 , H01L2924/19043 , H05K1/118 , H05K3/361 , H05K3/4084 , H05K2201/0133 , H05K2201/0394 , H05K2201/0397 , H05K2201/09081 , H05K2201/091 , H05K2203/063 , Y10T29/4913 , Y10T29/49144 , Y10T29/49174 , H01L2924/00014
摘要： A method of making a microelectronic assembly including a compliant interface includes providing a first support structure such as a flexible dielectric sheet having a first surface and a porous resilient layer on the first surface of the first support structure, stretching the first support structure and bonding the stretched first support structure to a ring structure. A platen is provided in engagement with a second surface of the first support structure. The first surface of a second support structure, such as a semiconductor wafer, is abutted against the porous layer and, after the abutting step, a first curable liquid is disposed between the first and second support structures and within the porous layer. The first curable liquid may be at least partially cured.
摘要翻译：制造包括柔性界面的微电子组件的方法包括提供第一支撑结构，例如在第一支撑结构的第一表面上具有第一表面和多孔弹性层的柔性电介质片，拉伸第一支撑结构并将将第一支撑结构拉伸成环结构。提供与第一支撑结构的第二表面接合的压板。第二支撑结构（例如半导体晶片）的第一表面抵靠多孔层，并且在邻接步骤之后，第一可固化液体设置在第一和第二支撑结构之间以及多孔层内。第一可固化液体可以至少部分固化。

5. 发明申请

US20060049498A1 Methods of making microelectronic assemblies including compliant interfaces 失效
标题翻译：制造微电子组件的方法包括兼容接口
公开(公告)号：US20060049498A1
公开(公告)日：2006-03-09
申请号：US11259398
申请日：2005-10-26
申请人： Zlata Kovac , Craig Mitchell , Thomas DiStefano , John Smith
发明人： Zlata Kovac , Craig Mitchell , Thomas DiStefano , John Smith
IPC分类号： H01L23/02
CPC分类号： H01L24/81 , H01L21/56 , H01L21/563 , H01L21/565 , H01L23/3114 , H01L23/49811 , H01L23/49816 , H01L23/49827 , H01L23/4985 , H01L24/29 , H01L24/72 , H01L24/97 , H01L2224/16 , H01L2224/73203 , H01L2224/81136 , H01L2224/81801 , H01L2224/83136 , H01L2224/83192 , H01L2224/83194 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01033 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/1532 , H01L2924/16152 , H01L2924/19041 , H01L2924/19043 , H01L2924/351 , H05K1/118 , H05K3/361 , H05K3/4084 , H05K2201/0133 , H05K2201/0394 , H05K2201/0397 , H05K2201/09081 , H05K2203/063 , H01L2224/81 , H01L2924/3512 , H01L2924/00
摘要： An assembly includes a structure, a plurality of terminals and a plurality of compliant pads disposed between said terminals and said structure. The terminals are aligned with at least some of said pads, with the pads providing a standoff between the structure and the terminals. The compliant pads are preferably made of a non-conductive material such as a silicone elastomer.
摘要翻译：组件包括设置在所述端子和所述结构之间的结构，多个端子和多个柔性焊盘。端子与至少一些所述焊盘对准，焊盘在结构和端子之间提供间隔。柔性衬垫优选地由诸如硅氧烷弹性体的非导电材料制成。

6. 发明授权

US6133639A Compliant interface for semiconductor chip and method therefor 失效
标题翻译：用于半导体芯片的兼容接口及其方法
公开(公告)号：US6133639A
公开(公告)日：2000-10-17
申请号：US842313
申请日：1997-04-24
申请人： Zlata Kovac , Craig Mitchell , Thomas H. Distefano , John W. Smith
发明人： Zlata Kovac , Craig Mitchell , Thomas H. Distefano , John W. Smith
IPC分类号： H01L23/12 , H01L21/56 , H01L21/60 , H01L23/28 , H01L23/48 , H01L23/498 , H05K1/11 , H05K3/36 , H05K3/40 , H01L23/52 , H01L29/40
CPC分类号： H01L24/81 , H01L21/56 , H01L21/563 , H01L23/49811 , H01L23/49827 , H01L23/4985 , H01L24/72 , H01L24/75 , H05K3/4084 , H01L2224/16 , H01L2224/73203 , H01L2224/73204 , H01L2224/75 , H01L2224/75301 , H01L2224/81801 , H01L2224/83136 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01033 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/15311 , H01L2924/1532 , H01L2924/16152 , H01L2924/19041 , H01L2924/19043 , H05K1/118 , H05K2201/0133 , H05K2201/0394 , H05K2201/0397 , H05K2201/09081 , H05K2201/091 , H05K2203/063 , H05K3/361 , Y10T29/4913 , Y10T29/49144 , Y10T29/49174
摘要： A method and an apparatus for providing a planar and compliant interface between a semiconductor chip and its supporting substrate to accommodate for the thermal coefficient of expansion mismatch therebetween. The complaint interface is comprised of a plurality of compliant pads defining channels between adjacent pads. The pads are typically compressed between a flexible film chip carrier and the chip. A compliant filler is further disposed within the channels to form a uniform encapsulation layer having a controlled thickness.
摘要翻译：一种用于在半导体芯片和其支撑衬底之间提供平面和兼容接口以适应其间的热膨胀失配的方法和装置。投诉界面由在相邻的焊盘之间限定通道的多个柔性焊盘构成。垫通常在柔性膜芯片载体和芯片之间被压缩。在通道内进一步布置柔顺填料以形成具有受控厚度的均匀包封层。

7. 发明授权

US06255738B1 Encapsulant for microelectronic devices 失效
标题翻译：微电子器件用密封剂
公开(公告)号：US06255738B1
公开(公告)日：2001-07-03
申请号：US08940477
申请日：1997-09-30
申请人： Thomas H. Distefano , Craig Mitchell , Mark Thorson , Zlata Kovac
发明人： Thomas H. Distefano , Craig Mitchell , Mark Thorson , Zlata Kovac
IPC分类号： H01L2329
CPC分类号： H01L23/4985 , H01L23/24 , H01L23/293 , H01L2924/0002 , H01L2924/00
摘要： Filled, curable siloxane encapsulant compositions containing a curable siloxane base resin with functional groups reactive with functional groups of a hardener compound to form a polysiloxane, and filler particles with surface functional groups reactive with the hardener compound functional groups, wherein the filler particles have at least a bi-modal particle packing distribution of first filler particles having a first diameter and second filler particles having a second diameter smaller than the first diameter, and the first and second filler particles are present in amounts effective to provide a particle packing distribution with a relative bulk volume of at least about 90 percent. Tri-modal particle packing distributions of the first and second filler particles with third filler particles having a third diameter smaller than the second diameter are preferred, with the first, second and third filler particles being present in amounts effective to provide a tri-modal particle packing distribution with a relative bulk volume of at least about 95 percent. Encapsulant kits, cured encapsulant compositions in which filler particles are individually covalently bonded to one or more polysiloxane polymer chains, microelectronic assemblies incorporating the cured encapsulant compositions, and methods for preparing the curable encapsulant compositions are also disclosed.
摘要翻译：含有具有与硬化剂化合物的官能团反应形成聚硅氧烷的官能团的可固化硅氧烷基础树脂的填充的可固化的硅氧烷密封剂组合物和具有与硬化剂化合物官能团反应的表面官能团的填料颗粒，其中填料颗粒至少具有具有第一直径的第一填料颗粒和具有小于第一直径的第二直径的第二填料颗粒的双模式颗粒填充分布，并且第一和第二填料颗粒以有效提供颗粒填充分布的量存在于相对体积至少约90％。优选具有第三直径小于第二直径的第三填料颗粒的第一和第二填料颗粒的三模式颗粒填充分布，其中第一，第二和第三填料颗粒以有效提供三模式颗粒的量存在填料分布的相对体积体积至少约95％。还公开了封装剂试剂盒，固化的密封剂组合物，其中填料颗粒单独地共价键合到一个或多个聚硅氧烷聚合物链上，结合固化的密封剂组合物的微电子组件以及制备可固化的密封剂组合物的方法。

8. 发明授权

US5659952A Method of fabricating compliant interface for semiconductor chip 失效
标题翻译：制造半导体芯片兼容接口的方法
公开(公告)号：US5659952A
公开(公告)日：1997-08-26
申请号：US365699
申请日：1994-12-29
申请人： Zlata Kovac , Craig Mitchell , Thomas H. Distefano , John W. Smith
发明人： Zlata Kovac , Craig Mitchell , Thomas H. Distefano , John W. Smith
IPC分类号： H01L23/12 , H01L21/56 , H01L21/60 , H01L23/28 , H01L23/48 , H01L23/498 , H05K1/11 , H05K3/36 , H05K3/40 , H05K3/34
CPC分类号： H01L24/81 , H01L21/56 , H01L21/563 , H01L23/49811 , H01L23/49827 , H01L23/4985 , H01L24/72 , H01L24/75 , H05K3/4084 , H01L2224/16 , H01L2224/73203 , H01L2224/73204 , H01L2224/75 , H01L2224/75301 , H01L2224/81801 , H01L2224/83136 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01033 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/15311 , H01L2924/1532 , H01L2924/16152 , H01L2924/19041 , H01L2924/19043 , H05K1/118 , H05K2201/0133 , H05K2201/0394 , H05K2201/0397 , H05K2201/09081 , H05K2201/091 , H05K2203/063 , H05K3/361 , Y10T29/4913 , Y10T29/49144 , Y10T29/49174
摘要： A method and an apparatus for providing a planar and compliant interface between a semiconductor chip and its supporting substrate to accommodate for the thermal coefficient of expansion mismatch therebetween. The compliant interface is comprised of a plurality of compliant pads defining channels between adjacent pads. The pads are typically compressed between a flexible film chip carrier and the chip. A compliant filler is further disposed within the channels to form a uniform encapsulation layer having a controlled thickness.
摘要翻译：一种用于在半导体芯片和其支撑衬底之间提供平面和兼容接口以适应其间的热膨胀失配的方法和装置。兼容接口包括限定相邻焊盘之间的通道的多个柔性焊盘。垫通常在柔性膜芯片载体和芯片之间被压缩。在通道内进一步布置柔顺填料以形成具有受控厚度的均匀包封层。

9. 发明授权

US06202299B1 Semiconductor chip connection components with adhesives and methods of making same 有权
标题翻译：半导体芯片连接组件与粘合剂及其制造方法
公开(公告)号：US06202299B1
公开(公告)日：2001-03-20
申请号：US09209216
申请日：1998-12-11
申请人： Thomas H. DiStefano , Gus Karavakis , Zlata Kovac , Craig Mitchell
发明人： Thomas H. DiStefano , Gus Karavakis , Zlata Kovac , Craig Mitchell
IPC分类号： H05K334
CPC分类号： H01L24/86 , H01L21/4821 , H01L21/6835 , H01L23/495 , H01L23/4985 , H01L24/32 , H01L24/81 , H01L24/83 , H01L2224/2919 , H01L2224/81801 , H01L2224/8319 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , Y10T29/49117 , Y10T29/49121 , Y10T29/49133 , Y10T29/49144 , Y10T29/49146 , Y10T29/49149 , Y10T29/49171 , H01L2924/00
摘要： A semiconductor chip connection component is provided with an adhesive, desirably in a solid, non-tacky condition on its bottom surface. The adhesive may be present in a pattern covering less than all of the component bottom surface, so as to provide a void-free interface when the adhesive bonds the component to the top surface of a chip. The adhesive desirably is brought to a flowable condition by heat transferred from the chip itself. The connection component may include leads having base metal strips in a trace area underlying the top surface and noble metal portions protruding beyond an edge of the top layer. A flowable, curable material encapsulates the base metal sections. Because the base metal sections desirably are free of undercuts, the same can be encapsulated in a void-free manner during formation of the component.
摘要翻译：半导体芯片连接部件在其底表面上设置有粘合剂，期望地为固体，非粘性状态。粘合剂可以以覆盖小于所有组分底部表面的图案存在，以便当粘合剂将组分粘合到芯片的顶表面时提供无空隙的界面。粘合剂期望地通过从芯片本身传递的热量而变成可流动状态。连接部件可以包括在顶表面下方的迹线区域中具有基底金属条的引线和突出超过顶层边缘的贵金属部分。可流动的可固化材料封装基体金属部分。因为贱金属部分理想地没有底切部分，所以在形成部件期间可以以无空隙的方式将其包封。

10. 发明授权

US6045655A Method of mounting a connection component on a semiconductor chip with adhesives 有权
标题翻译：用粘合剂将连接部件安装在半导体芯片上的方法
公开(公告)号：US6045655A
公开(公告)日：2000-04-04
申请号：US170906
申请日：1998-10-13
申请人： Thomas H. DiStefano , Gus Karavakis , Zlata Kovac , Craig Mitchell
发明人： Thomas H. DiStefano , Gus Karavakis , Zlata Kovac , Craig Mitchell
IPC分类号： H01L21/48 , H01L21/58 , H01L21/60 , H01L21/68 , H01L23/495 , H01L23/498 , H05K1/14
CPC分类号： H01L24/86 , H01L21/4821 , H01L21/6835 , H01L23/495 , H01L23/4985 , H01L24/32 , H01L24/81 , H01L24/83 , H01L2224/2919 , H01L2224/81801 , H01L2224/8319 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , Y10T29/49117 , Y10T29/49121 , Y10T29/49133 , Y10T29/49144 , Y10T29/49146 , Y10T29/49149 , Y10T29/49171
摘要： A semiconductor chip connection component is provided with an adhesive, desirably in a solid, non-tacky condition on its bottom surface. The adhesive may be present in a pattern covering less than all of the component bottom surface, so as to provide a void-free interface when the adhesive bonds the component to the top surface of a chip. The adhesive desirably is brought to a flowable condition by heat transferred from the chip itself. The connection component may include leads having base metal strips in a trace area underlying the top surface and noble metal portions protruding beyond an edge of the top layer. A flowable, curable material encapsulates the base metal sections. Because the base metal sections desirably are free of undercuts, the same can be encapsulated in a void-free manner during formation of the component.
摘要翻译：半导体芯片连接部件在其底表面上设置有粘合剂，期望地为固体，非粘性状态。粘合剂可以以覆盖小于所有组分底部表面的图案存在，以便当粘合剂将组分粘合到芯片的顶表面时提供无空隙的界面。粘合剂期望地通过从芯片本身传递的热量而变成可流动状态。连接部件可以包括在顶表面下方的迹线区域中具有基底金属条的引线和突出超过顶层边缘的贵金属部分。可流动的可固化材料封装基体金属部分。因为贱金属部分理想地没有底切部分，所以在形成部件期间可以以无空隙的方式将其包封。

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