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    • 2. 发明授权
    • Flash memory cell and methods for programming and erasing
    • 闪存单元和编程和擦除的方法
    • US07120063B1
    • 2006-10-10
    • US10841850
    • 2004-05-07
    • Zhizheng LiuZengtao LiuYi HeMark Randolph
    • Zhizheng LiuZengtao LiuYi HeMark Randolph
    • G11C11/34G11C16/04
    • G11C16/0466G11C16/0491H01L21/28282H01L29/66833
    • Flash memory cells are presented which comprise a dielectric material formed above a substrate channel region, a charge trapping material formed over the dielectric material, and a control gate formed over the charge trapping material. The cell may be programmed by directing electrons from the control gate into the charge trapping material to raise the cell threshold voltage. The electrons may be directed from the control gate to the charge trapping material by coupling a substrate to a substrate voltage potential, and coupling the control gate to a gate voltage potential, where the gate voltage potential is lower than the substrate voltage potential. The cell may be erased by directing electrons from the charge trapping material into the control gate to lower a threshold voltage of the flash memory cell, such as by coupling the substrate to a substrate voltage potential, and coupling the control gate to a gate voltage potential, where the gate voltage potential is higher than the substrate voltage potential.
    • 提供了闪存单元,其包括形成在衬底沟道区上方的电介质材料,在电介质材料上形成的电荷俘获材料,以及形成在电荷俘获材料上的控制栅。 可以通过将电子从控制栅极引导到电荷捕获材料中来提高电池阈值电压来编程电池。 电子可以通过将衬底耦合到衬底电压电势,并将控制栅极耦合到栅极电压电位,其中栅极电压电位低于衬底电压电位,从控制栅极引导到电荷俘获材料。 可以通过将电子从电荷捕获材料引入控制栅极来降低闪速存储器单元的阈值电压,例如通过将衬底耦合到衬底电压电位,以及将控制栅极耦合到栅极电压电位来擦除电池 ,其中栅极电压电位高于衬底电压电位。
    • 3. 发明授权
    • Flash memory cell and methods for programming and erasing
    • 闪存单元和编程和擦除的方法
    • US07215577B2
    • 2007-05-08
    • US11511763
    • 2006-08-29
    • Zhizheng LiuZengtao LiuYi HeMark Randolph
    • Zhizheng LiuZengtao LiuYi HeMark Randolph
    • G11C11/34G11C16/04H01L29/78
    • G11C16/0466G11C16/0491H01L21/28282H01L29/66833
    • Flash memory cells are presented which comprise a dielectric material formed above a substrate channel region, a charge trapping material formed over the dielectric material, and a control gate formed over the charge trapping material. The cell may be programmed by directing electrons from the control gate into the charge trapping material to raise the cell threshold voltage. The electrons may be directed from the control gate to the charge trapping material by coupling a substrate to a substrate voltage potential, and coupling the control gate to a gate voltage potential, where the gate voltage potential is lower than the substrate voltage potential. The cell may be erased by directing electrons from the charge trapping material into the control gate to lower a threshold voltage of the flash memory cell, such as by coupling the substrate to a substrate voltage potential, and coupling the control gate to a gate voltage potential, where the gate voltage potential is higher than the substrate voltage potential.
    • 提供了闪存单元,其包括形成在衬底沟道区上方的电介质材料,在电介质材料上形成的电荷俘获材料,以及形成在电荷俘获材料上的控制栅。 可以通过将电子从控制栅极引导到电荷捕获材料中来提高电池阈值电压来编程电池。 电子可以通过将衬底耦合到衬底电压电势,并将控制栅极耦合到栅极电压电位,其中栅极电压电位低于衬底电压电位,从控制栅极引导到电荷俘获材料。 可以通过将电子从电荷捕获材料引入控制栅极来降低闪速存储器单元的阈值电压,例如通过将衬底耦合到衬底电压电位,以及将控制栅极耦合到栅极电压电位来擦除电池 ,其中栅极电压电位高于衬底电压电位。
    • 4. 发明授权
    • Ramp source hot-hole programming for trap based non-volatile memory devices
    • 用于基于陷阱的非易失性存储器设备的斜坡源热孔编程
    • US06934190B1
    • 2005-08-23
    • US10863933
    • 2004-06-09
    • Zengtao LiuZhizheng LiuYi HeSameer HaddadMark Randolph
    • Zengtao LiuZhizheng LiuYi HeSameer HaddadMark Randolph
    • G11C16/04G11C16/10G11C16/34
    • G11C16/10G11C16/3454
    • Methods of operating dual bit memory devices including programming with a range of values are provided. The present invention employs a range of ramp source program pulses to iteratively perform a program operation that employs hot hole injection. The range is related to channel lengths of individual dual bit memory cells within the memory device. To program a bit of a particular dual bit memory cell, a negative gate program voltage is applied to its gate, a positive drain voltage is applied to its acting drain, and its substrate is connected to ground. Additionally, a ramp source voltage of the range of ramp source program pulses is concurrently applied to an acting source of the dual bit memory cell. A verification operation is then performed and the programming is repeated with a decremented ramp source voltage on verification failure.
    • 提供了包括具有一定范围值的编程的双位存储器件的操作方法。 本发明采用一系列斜坡源程序脉冲来迭代地执行采用热空穴注入的程序操作。 该范围与存储器件内的各个双位存储单元的通道长度有关。 为了编程一个特定的双位存储单元,负栅极编程电压被施加到其栅极,正的漏极电压被施加到其作用漏极,并且其衬底连接到地。 此外,斜坡源程序脉冲范围的斜坡源电压同时施加到双位存储单元的作用源。 然后执行验证操作,并且在验证失败时以递减的斜坡源电压重复编程。
    • 6. 发明申请
    • Read-only memory array with dielectric breakdown programmability
    • 具有介电击穿可编程性的只读存储阵列
    • US20060268593A1
    • 2006-11-30
    • US11136981
    • 2005-05-25
    • Meng DingZhizheng LiuYi HeMark Randolph
    • Meng DingZhizheng LiuYi HeMark Randolph
    • G11C17/00
    • G11C17/16G11C2213/72H01L27/1021H01L27/112H01L27/11206H01L27/118
    • According to one exemplary embodiment, a programmable ROM array includes at least one bitline situated in a substrate. The programmable ROM array further includes at least one wordline situated over the at least one bitline. The programmable ROM array further includes a memory cell situated at an intersection of the at least one bitline and the at least one wordline, where the memory cell includes a dielectric region situated between the at least one bitline and the at least one wordline. A programming operation causes the memory cell to change from a first logic state to a second logic state by causing the dielectric region to break down. The programming operation causes the memory cell to operate as a diode. A resistance of the memory cell can be measured in a read operation to determine if the memory cell has the first or second logic state.
    • 根据一个示例性实施例,可编程ROM阵列包括位于衬底中的至少一个位线。 可编程ROM阵列还包括位于至少一个位线上的至少一个字线。 可编程ROM阵列还包括位于所述至少一个位线和所述至少一个字线的交叉点处的存储器单元,其中所述存储器单元包括位于所述至少一个位线和所述至少一个字线之间的电介质区域。 通过使介电区域分解,编程操作使存储单元从第一逻辑状态变为第二逻辑状态。 编程操作使存储单元作为二极管工作。 可以在读取操作中测量存储器单元的电阻,以确定存储单元是否具有第一或第二逻辑状态。