会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 1. 发明申请
    • METHOD FOR MANUFACTURING MOLD FOR MOLDING OPTICAL ELEMENT
    • 用于模制光学元件的模具制造方法
    • US20090278270A1
    • 2009-11-12
    • US12441683
    • 2007-08-17
    • Yuzo NakatsukaAtsushi Naito
    • Yuzo NakatsukaAtsushi Naito
    • B29D11/00
    • B29C45/56B29L2011/00
    • A method for manufacturing a mold for molding an optical element, wherein the mold comprising a base material having a molding base face and a covering layer provided on the molding base face of the base material, and an upper surface portion of the covering layer located above the molding base face forms a molding face, the method including: a covering step for forming a covering layer on the molding base face of the base material; a pressurizing step for pressurizing a surface of the covering layer; and a high-precision processing step for forming a molding face by applying high-precision processing onto the surface of the covering layer subsequent to the pressurizing step.
    • 一种用于制造用于模制光学元件的模具的方法,其中所述模具包括具有模制基面的基材和设置在基材的模制基面上的覆盖层,以及覆盖层的位于上方的上表面部分 成型基面形成成型面,该方法包括:覆盖步骤,用于在基材的成型基面上形成覆盖层; 用于对覆盖层的表面加压的加压步骤; 以及用于通过在加压步骤之后对覆盖层的表面进行高精度加工来形成模制面的高精度加工步骤。
    • 2. 发明授权
    • Method for manufacturing mold for molding optical element
    • 光学元件成形用模具的制造方法
    • US08318058B2
    • 2012-11-27
    • US12441683
    • 2007-08-17
    • Yuzo NakatsukaAtsushi Naito
    • Yuzo NakatsukaAtsushi Naito
    • B29D11/00
    • B29C45/56B29L2011/00
    • A method for manufacturing a mold for molding an optical element, wherein the mold comprising a base material having a molding base face and a covering layer provided on the molding base face of the base material, and an upper surface portion of the covering layer located above the molding base face forms a molding face, the method including: a covering step for forming a covering layer on the molding base face of the base material; a pressurizing step for pressurizing a surface of the covering layer; and a high-precision processing step for forming a molding face by applying high-precision processing onto the surface of the covering layer subsequent to the pressurizing step.
    • 一种用于制造用于模制光学元件的模具的方法,其中所述模具包括具有模制基面的基材和设置在基材的模制基面上的覆盖层,以及覆盖层的位于上方的上表面部分 成型基面形成成型面,该方法包括:覆盖步骤,用于在基材的成型基面上形成覆盖层; 用于对覆盖层的表面加压的加压步骤; 以及用于通过在加压步骤之后对覆盖层的表面进行高精度加工来形成模制面的高精度加工步骤。
    • 8. 发明授权
    • Data selector circuit and method of selecting format of data output from
plural registers
    • 数据选择电路及从多个寄存器输出数据格式的方法
    • US5055717A
    • 1991-10-08
    • US398339
    • 1989-08-24
    • Atsushi NaitoKiyoshi NakatsukaSeiichi YamamotoTakashi InuiTomohiro Suzuki
    • Atsushi NaitoKiyoshi NakatsukaSeiichi YamamotoTakashi InuiTomohiro Suzuki
    • G09G5/395G11C7/10
    • G11C7/1075G09G5/395G11C7/103
    • Data selector circuit including a plurality of data registers connected in parallel via corresponding output buffers to a plurality of output drivers, wherein a decoder and selector portion is interposed between the output buffers and the output drivers for selectively providing one of a plurality of serial data output sequences from the data registers to the output drivers rather than a parallel data output format from the plurality of data registers which would otherwise occur. The decoder and selector portion is controlled by a partial address buffer which is provided with serial sequence selection data. Upon decoding the serial sequence selection data of the partial address buffer, a plurality of MOS transistors included in the selector portion are rendered conductive in sequence in response to respective control signals applied to the gates thereof to connect the plurality of data registers via their output buffers to respective output drivers in a sequence determined by the decoded selection data of the partial address buffer for serial data output in the selected serial data output sequence.
    • 数据选择器电路包括通过相应的输出缓冲器并行连接到多个输出驱动器的多个数据寄存器,其中解码器和选择器部分插在输出缓冲器和输出驱动器之间,用于选择性地提供多个串行数据输出 从数据寄存器到输出驱动器的序列,而不是否则将发生的多个数据寄存器的并行数据输出格式。 解码器和选择器部分由具有串行序列选择数据的部分地址缓冲器控制。 在对部分地址缓冲器的串行序列选择数据进行解码时,响应于施加到其栅极的相应控制信号,包括在选择器部分中的多个MOS晶体管依次被导通,以经由其输出缓冲器连接多个数据寄存器 以由所选择的串行数据输出序列中输出的串行数据的部分地址缓冲器的解码选择数据确定的序列分配给相应的输出驱动器。
    • 10. 发明授权
    • Optical component molding apparatus
    • 光学部件成型装置
    • US07914273B2
    • 2011-03-29
    • US11259395
    • 2005-10-26
    • Atsushi NaitoKanji SekiharaYoshihiro OkumuraAkihiko Matsumoto
    • Atsushi NaitoKanji SekiharaYoshihiro OkumuraAkihiko Matsumoto
    • B29C45/26
    • B29D11/00413B29C45/27B29C45/2708B29L2011/0016Y10S425/808
    • A purpose is to provide an optical component molding apparatus for producing a small-size and high-precision optical component and achieving good transferability and stability of a molded product. A multi-cavity molding machine 100 has a gate 51, a runner 52, and a sprue 53 each having the shape determined to meet conditions (1) to (5): (1) “Miminum gate thickness”/“Maximum runner thickness” is in a range of more than 0.2 to less than 1.0; (2) “Gate length”/“Maximum runner thickness” is in a range of more than 0.4 to less than 4.0; (3) “Outlet diameter of sprue” is in a range of more than 1.0 mm to less than 5.5 mm; (4) “Sprue length” is in a range of more than 10 mm to less than 40 mm; and (5) “Outlet diameter of sprue”/“Inlet diameter of sprue” is in a range of more than 1 to less than 8.
    • 目的是提供一种用于制造小尺寸和高精度光学部件的光学部件模制装置,并且实现模制产品的良好的可转移性和稳定性。 多空腔模塑机100具有浇口51,流道52和浇口53,每个浇口51具有确定满足条件(1)至(5)的形状:(1)“浇口厚度”/“最大流道厚度” 在0.2至小于1.0的范围内; (2)“门长”/“最大流道厚度”在大于0.4至小于4.0的范围内; (3)“浇口的出口直径”在1.0mm以上且小于5.5mm的范围内; (4)“浇口长度”在大于10mm至小于40mm的范围内; 和(5)“浇口的出口直径”/“浇口的入口直径”在大于1到小于8的范围内。