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1. 发明授权

US08053253B2 Method for manufacturing semiconductor device 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US08053253B2
公开(公告)日：2011-11-08
申请号：US12473320
申请日：2009-05-28
申请人： Yuugo Goto , Teruyuki Fujii
发明人： Yuugo Goto , Teruyuki Fujii
IPC分类号： H01L21/00
CPC分类号： H01L21/6835 , H01L21/561 , H01L21/568 , H01L23/552 , H01L23/60 , H01L23/66 , H01L2223/6677 , H01L2924/0002 , H01L2924/12044 , H01L2924/19043 , H01L2924/30105 , H01L2924/3025 , H01L2924/00
摘要： An object is to provide a highly reliable semiconductor device that has tolerance to external stress and electrostatic discharge. Another object is to prevent defective shapes and defective characteristics due to the external stress or an electrostatic discharge in the manufacturing process, and to manufacture a semiconductor device with high yield. Still another object is to manufacture a semiconductor device at low cost and with high productivity. With the use of a conductive shield covering a semiconductor integrated circuit, electrostatic breakdown due to electrostatic discharge of the semiconductor integrated circuit is prevented. The conductive shield is formed so that at least the conductive shields on the top and bottom surfaces are electrically connected by a plating method. In addition, a semiconductor device can be formed at low cost with high productivity because a plating method is used for the formation of the conductive shield.
摘要翻译：目的是提供一种高度可靠的对外部应力和静电放电具有耐受性的半导体器件。另一个目的是防止在制造过程中由于外部应力或静电放电引起的形状不良和缺陷特性，并且以高产率制造半导体器件。另一个目的是以低成本和高生产率制造半导体器件。通过使用覆盖半导体集成电路的导电屏蔽，可以防止由于半导体集成电路的静电放电引起的静电击穿。导电屏蔽形成为使得至少顶表面和底表面上的导电屏蔽通过电镀方法电连接。此外，由于使用电镀方法来形成导电屏蔽，所以可以以低成本高生产率形成半导体器件。

2. 发明授权

US08420409B2 Method for manufacturing semiconductor device 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US08420409B2
公开(公告)日：2013-04-16
申请号：US13288207
申请日：2011-11-03
申请人： Yuugo Goto , Teruyuki Fujii
发明人： Yuugo Goto , Teruyuki Fujii
IPC分类号： H01L21/00
CPC分类号： H01L21/6835 , H01L21/561 , H01L21/568 , H01L23/552 , H01L23/60 , H01L23/66 , H01L2223/6677 , H01L2924/0002 , H01L2924/12044 , H01L2924/19043 , H01L2924/30105 , H01L2924/3025 , H01L2924/00
摘要： An object is to provide a highly reliable semiconductor device that has tolerance to external stress and electrostatic discharge. Another object is to prevent defective shapes and defective characteristics due to the external stress or an electrostatic discharge in the manufacturing process, and to manufacture a semiconductor device with high yield. Still another object is to manufacture a semiconductor device at low cost and with high productivity. With the use of a conductive shield, electrostatic breakdown (malfunctions of the circuit or damages of a semiconductor element) due to electrostatic discharge of the semiconductor integrated circuit is prevented. The conductive shield is formed so that at least the conductive shields on the top and bottom surfaces are electrically connected by a plating method. In addition, a semiconductor device can be formed at low cost with high productivity because a plating method is used for the formation of the conductive shield.
摘要翻译：目的是提供一种高度可靠的对外部应力和静电放电具有耐受性的半导体器件。另一个目的是防止在制造过程中由于外部应力或静电放电引起的形状不良和缺陷特性，并且以高产率制造半导体器件。另一个目的是以低成本和高生产率制造半导体器件。通过使用导电屏蔽，防止由于半导体集成电路的静电放电而导致的静电击穿（电路的故障或半导体元件的损坏）。导电屏蔽形成为使得至少顶表面和底表面上的导电屏蔽通过电镀方法电连接。此外，由于使用电镀方法来形成导电屏蔽，所以可以以低成本高生产率形成半导体器件。

3. 发明授权

US09069215B2 Semiconductor device and method of fabricating the same 有权
公开(公告)号：US09069215B2
公开(公告)日：2015-06-30
申请号：US12556135
申请日：2009-09-09
申请人： Yoshiharu Hirakata , Yuugo Goto , Yuko Kobayashi , Shunpei Yamazaki
发明人： Yoshiharu Hirakata , Yuugo Goto , Yuko Kobayashi , Shunpei Yamazaki
IPC分类号： H01L27/14 , H01L29/04 , H01L29/15 , H01L31/036 , G02F1/1339 , H01L29/786 , G02F1/1333 , G02F1/1345
CPC分类号： G02F1/13394 , G02F1/13306 , G02F1/133345 , G02F1/13338 , G02F1/133512 , G02F1/1341 , G02F1/134309 , G02F1/13454 , G02F1/1368 , G02F2001/133302 , H01L27/12 , H01L27/1214 , H01L27/1222 , H01L27/124 , H01L27/1288 , H01L29/167 , H01L29/78621 , H01L29/78627 , H01L29/78669 , H01L2029/7863 , H01L2924/0002 , Y10S438/924 , Y10S438/98 , H01L2924/00
摘要： There is provided a high quality liquid crystal panel having a thickness with high accuracy, which is designed, without using a particulate spacer, within a free range in accordance with characteristics of a used liquid crystal and a driving method, and is also provided a method of fabricating the same. The shape of a spacer for keeping a substrate interval constant is made such that it is a columnar shape, a radius R of curvature is 2 μm or less, a height H is 0.5 μm to 10 μm, a diameter is 20 μm or less, and an angle α is 65° to 115°. By doing so, it is possible to prevent the lowering of an opening rate and the lowering of light leakage due to orientation disturbance.

4. 发明授权

US08674493B2 IC card and booking-account system using the IC card 有权
标题翻译： IC卡和预订账号系统使用IC卡
公开(公告)号：US08674493B2
公开(公告)日：2014-03-18
申请号：US13618384
申请日：2012-09-14
申请人： Toru Takayama , Junya Maruyama , Yuugo Goto , Yumiko Ohno , Mai Akiba
发明人： Toru Takayama , Junya Maruyama , Yuugo Goto , Yumiko Ohno , Mai Akiba
IPC分类号： H01L23/498
CPC分类号： G06K19/077 , G06K19/07703 , G06Q20/105 , G06Q20/3415 , G07F7/1008 , H01L2224/48091 , H01L2224/48465 , H01L2224/73265 , H01L2924/00011 , H01L2924/01015 , H01L2924/01047 , H01L2924/10253 , H01L2924/10271 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/01005 , H01L2224/45147
摘要： It is an object of the present invention to provide a highly sophisticated functional IC card that can ensure security by preventing forgery such as changing a picture of a face, and display other images as well as the picture of a face. An IC card comprising a display device and a plurality of thin film integrated circuits; wherein driving of the display device is controlled by the plurality of thin film integrated circuits; a semiconductor element used for the plurality of thin film integrated circuits and the display device is formed by using a polycrystalline semiconductor film; the plurality of thin film integrated circuits are laminated; the display device and the plurality of thin film integrated circuits are equipped for the same printed wiring board; and the IC card has a thickness of from 0.05 mm to 1 mm.
摘要翻译：本发明的目的是提供一种高度复杂的功能IC卡，其可以通过防止诸如改变脸部图像的伪造，以及显示其他图像以及脸部照片来确保安全性。一种IC卡，包括显示装置和多个薄膜集成电路; 其中所述显示装置的驱动由所述多个薄膜集成电路控制; 通过使用多晶半导体膜形成用于多个薄膜集成电路的半导体元件和显示装置; 层叠多个薄膜集成电路; 显示装置和多个薄膜集成电路被配备用于相同的印刷线路板; IC卡的厚度为0.05mm〜1mm。

5. 发明授权

US08673739B2 Method of manufacturing semiconductor device 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US08673739B2
公开(公告)日：2014-03-18
申请号：US13303519
申请日：2011-11-23
申请人： Toru Takayama , Yuugo Goto , Yumiko Fukumoto , Junya Maruyama , Takuya Tsurume
发明人： Toru Takayama , Yuugo Goto , Yumiko Fukumoto , Junya Maruyama , Takuya Tsurume
IPC分类号： H01L21/30
CPC分类号： H01L27/1266 , H01L27/1214 , H01L33/0079
摘要： It is an object of the invention to provide a lightweight semiconductor device having a highly reliable sealing structure which can prevent ingress of impurities such as moisture that deteriorate element characteristics, and a method of manufacturing thereof. A protective film having superior gas barrier properties (which is a protective film that is likely to damage an element if the protective film is formed on the element directly) is previously formed on a heat-resistant substrate other than a substrate with the element formed thereon. The protective film is peeled off from the heat-resistant substrate, and transferred over the substrate with the element formed thereon so as to seal the element.
摘要翻译：本发明的目的是提供一种具有高度可靠的密封结构的轻质半导体器件及其制造方法，该密封结构能够防止元素特性恶化的诸如水分等杂质的侵入。具有优异阻气性的保护膜（其是如果在元件上直接形成保护膜时可能损坏元件的保护膜）预先在其上形成有元件的基板之外的耐热基板上形成。保护膜从耐热基材上剥离，并在其上形成的元件在基板上转印以密封元件。

6. 发明授权

US08634041B2 Liquid crystal display device and manufacturing method of liquid crystal display device 有权
标题翻译：液晶显示装置及液晶显示装置的制造方法
公开(公告)号：US08634041B2
公开(公告)日：2014-01-21
申请号：US13466406
申请日：2012-05-08
申请人： Shunpei Yamazaki , Toru Takayama , Junya Maruyama , Yuugo Goto , Yumiko Ohno , Akio Endo , Yasuyuki Arai
发明人： Shunpei Yamazaki , Toru Takayama , Junya Maruyama , Yuugo Goto , Yumiko Ohno , Akio Endo , Yasuyuki Arai
IPC分类号： G02F1/1335
CPC分类号： G02F1/1362 , G02F1/133305 , G02F1/133603 , G02F2001/13613 , H01L27/14678 , H01L2221/68359 , H01L2221/68368 , H01L2224/48465 , H01L2224/73265 , H01L2224/8592
摘要： To sophisticate a portable electronic appliance without hindering reduction of the weight and the size, more specifically, to sophisticate a liquid crystal display apparatus installed in a portable electronic appliance without hindering the mechanical strength, a liquid crystal display apparatus includes a first plastic substrate, a light-emitting device which is disposed over the first plastic substrate, resin which covers the light-emitting device, an insulating film which is in contact with the resin, a semiconductor device which is in contact with the insulating film, a liquid crystal cell which is electrically connected to the semiconductor device, and a second plastic substrate, wherein the semiconductor device and the liquid crystal cell are disposed between the first plastic substrate and the second plastic substrate.
摘要翻译：为了使便携式电子设备复杂化而不妨碍重量和尺寸的减小，更具体地说，为了使安装在便携式电子设备中的液晶显示装置复杂化而不会妨碍机械强度，液晶显示装置包括第一塑料基板，布置在第一塑料基板上的发光装置，覆盖发光装置的树脂，与树脂接触的绝缘膜，与绝缘膜接触的半导体装置，液晶单元，电连接到半导体器件和第二塑料基板，其中半导体器件和液晶单元设置在第一塑料基板和第二塑料基板之间。

7. 发明授权

US08227851B2 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US08227851B2
公开(公告)日：2012-07-24
申请号：US12952766
申请日：2010-11-23
申请人： Tomoyuki Aoki , Koji Dairiki , Yuugo Goto
发明人： Tomoyuki Aoki , Koji Dairiki , Yuugo Goto
IPC分类号： H01L27/112
CPC分类号： H01L27/13 , G06K19/07749 , H01L21/6835 , H01L23/5227 , H01L23/552 , H01L23/576 , H01L23/585 , H01L27/105 , H01L27/11509 , H01L27/11526 , H01L27/11546 , H01L27/1203 , H01L27/124 , H01L27/1266 , H01L29/78618 , H01L2221/6835 , H01L2221/68368 , H01L2924/0002 , H01L2924/12044 , H01L2924/30105 , H01Q1/2208 , H01L2924/00
摘要： It is an object of the invention to provide semiconductor devices which can protect privacy of consumers or holders of commercial products and control the communication range according to use, even when the semiconductor device which can exchange data without contact is mounted on the commercial products. A semiconductor device of the invention includes an element group including a plurality of transistors over a substrate; a first conductive film functioning as an antenna over the element group; a second conductive film surrounding the first conductive film; an insulating film covering the first and second end portions; and a third conductive film over the insulating film. The first conductive film is provided in the shape of a coil, and each end portion of the first conductive film is connected to the element group. First and second end portions of the second conductive film are not connected to each other.
摘要翻译：本发明的目的是提供可以保护消费者或商业产品持有人的隐私的半导体器件，并且即使当可以将交换数据而没有接触的半导体器件安装在商业产品上时，也可以根据使用来控制通信范围。本发明的半导体器件包括在衬底上包括多个晶体管的元件组; 用作元件组上的天线的第一导电膜; 围绕所述第一导电膜的第二导电膜; 覆盖所述第一和第二端部的绝缘膜; 和绝缘膜上的第三导电膜。第一导电膜设置为线圈形状，并且第一导电膜的每个端部连接到元件组。第二导电膜的第一端部和第二端部彼此不连接。

8. 发明授权

US08040456B2 Liquid crystal display device and manufacturing method of liquid crystal display device 有权
标题翻译：液晶显示装置及液晶显示装置的制造方法
公开(公告)号：US08040456B2
公开(公告)日：2011-10-18
申请号：US10756833
申请日：2004-01-14
申请人： Shunpei Yamazaki , Toru Takayama , Junya Maruyama , Yuugo Goto , Yumiko Ohno , Akio Endo , Yasuyuki Arai
发明人： Shunpei Yamazaki , Toru Takayama , Junya Maruyama , Yuugo Goto , Yumiko Ohno , Akio Endo , Yasuyuki Arai
IPC分类号： G02F1/1335
CPC分类号： G02F1/1362 , G02F1/133305 , G02F1/133603 , G02F2001/13613 , H01L27/14678 , H01L2221/68359 , H01L2221/68368 , H01L2224/48465 , H01L2224/73265 , H01L2224/8592
摘要： To sophisticate a portable electronic appliance without hindering reduction of the weight and the size, more specifically, to sophisticate a liquid crystal display apparatus installed in a portable electronic appliance without hindering the mechanical strength, a liquid crystal display apparatus includes a first plastic substrate, a light-emitting device which is disposed over the first plastic substrate, resin which covers the light-emitting device, an insulating film which is in contact with the resin, a semiconductor device which is in contact with the insulating film, a liquid crystal cell which is electrically connected to the semiconductor device, and a second plastic substrate, wherein the semiconductor device and the liquid crystal cell are disposed between the first plastic substrate and the second plastic substrate.
摘要翻译：为了使便携式电子设备复杂化而不妨碍重量和尺寸的减小，更具体地说，为了使安装在便携式电子设备中的液晶显示装置复杂化而不会妨碍机械强度，液晶显示装置包括第一塑料基板，布置在第一塑料基板上的发光装置，覆盖发光装置的树脂，与树脂接触的绝缘膜，与绝缘膜接触的半导体装置，液晶单元，电连接到半导体器件和第二塑料基板，其中半导体器件和液晶单元设置在第一塑料基板和第二塑料基板之间。

9. 发明授权

US07767516B2 Semiconductor device, manufacturing method thereof, and manufacturing method of antenna 有权
标题翻译：半导体装置及其制造方法以及天线的制造方法
公开(公告)号：US07767516B2
公开(公告)日：2010-08-03
申请号：US11920273
申请日：2006-05-29
申请人： Tomoyuki Aoki , Yuugo Goto
发明人： Tomoyuki Aoki , Yuugo Goto
IPC分类号： H01L21/8234
CPC分类号： G06K19/07749 , H01L23/49855 , H01L23/5227 , H01L23/5328 , H01L27/12 , H01L27/1292 , H01L27/13 , H01L2924/0002 , H01Q1/38 , H01Q7/00 , H01Q9/27 , H01Q23/00 , H05K3/1216 , H01L2924/00
摘要： An element group having a transistor is formed over a substrate and a conductive film to be a dummy pattern is formed over the element group by pushing out a paste including conductive particles from a first opening portion, and then a conductive film functioning as an antenna is formed continuously thereafter so as to electrically connect with the transistor, by pushing out a paste including conductive particles from a second opening portion. Therefore, an element group having a transistor, provided over a substrate; a first conductive film functioning as an antenna provided over the element group and is electrically connected to the transistor; a second conductive film to be a dummy pattern provided to be adjacent to the first conductive film and is not electrically connected to the transistor; are included.
摘要翻译：在基板上形成具有晶体管的元件组，并且通过从第一开口部分推出包括导电粒子的浆料，在元件组上形成作为虚设图案的导电膜，然后，用作天线的导电膜为随后通过从第二开口部分推出包括导电粒子的浆料，从而与晶体管电连接。因此，设置在基板上的具有晶体管的元件组; 用作天线的第一导电膜，设置在元件组上并电连接到晶体管; 第二导电膜为与第一导电膜相邻且不与晶体管电连接的虚设图案; 包括在内。

10. 发明授权

US07622361B2 Method for manufacturing semiconductor device 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US07622361B2
公开(公告)日：2009-11-24
申请号：US11822609
申请日：2007-07-09
申请人： Yuugo Goto , Yumiko Fukumoto , Toru Takayama , Junya Maruyama , Takuya Tsurume
发明人： Yuugo Goto , Yumiko Fukumoto , Toru Takayama , Junya Maruyama , Takuya Tsurume
IPC分类号： H01L21/46 , H01L21/30 , H01L21/78 , H01L21/301
CPC分类号： H01L27/1266 , G02F2001/13613 , H01L27/3246 , H01L51/524 , H01L51/5246 , H01L51/5253 , H01L51/56 , H01L2221/68368 , H01L2227/323 , H01L2227/326 , Y10S438/976 , Y10S438/977
摘要： It is an object of the invention to provide a peeling method which does not damage a peeling layer, and to perform peeling not only a peeling layer having a small-size area but also an entire peeling layer having a large-size area with a preferable yield. In the invention, after pasting a fixing substrate, a part of a glass substrate is removed by scribing or performing laser irradiation on the glass substrate which leads to providing a trigger. Then, peeling is performed with a preferable yield by performing peeling from the removed part. In addition, a crack is prevented by covering the entire face except for a connection portion of a terminal electrode (including a periphery region of the terminal electrode) with a resin.
摘要翻译：本发明的目的是提供一种不会损伤剥离层的剥离方法，并且不仅剥离具有小尺寸区域的剥离层，而且还可以剥离具有大尺寸区域的整个剥离层产量。在本发明中，在粘贴固定基板之后，通过在导致提供触发的玻璃基板上划线或进行激光照射来去除玻璃基板的一部分。然后，通过从去除部分剥离而以优选的收率进行剥离。此外，通过用树脂覆盖端子电极（包括端子电极的周边区域）的连接部分以外的整个面来防止裂纹。

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