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    • 1. 发明申请
    • Surface treatment apparatus for small object
    • 小物体表面处理装置
    • US20080006527A1
    • 2008-01-10
    • US11808744
    • 2007-06-12
    • Yutaka SugiuraTomoji OkudaHideki Nakada
    • Yutaka SugiuraTomoji OkudaHideki Nakada
    • C25D17/16
    • C25D17/22C25D21/10
    • A plating process apparatus (1) for small objects, including a treatment cell (2) formed by combining a base plate (23), a bottom plate (24), an electrode ring (21) and a cover (25) using bolts (26), energizes a plating solution within the treatment cell (2) while bringing the small objects (100) into contact with the electrode ring (21) and circulating the plating solution (4) from the inside of the treatment cell (2) to the outside thereof through a flow-out means by rotating the treatment cell (2) with a vertical rotation shaft (3), thereby plating the small objects (100). The apparatus (1) is characterized in that the flow-out means is a gap channel formed between adjacent sheet members (61) by sandwiching the sheet members (61), each having a dimension smaller than a minimum dimension of each small object (100), between the bottom plate (24) and the electrode ring (21) circumferentially at appropriate intervals.
    • 一种用于小物体的电镀处理装置(1),包括通过使用螺栓(...)组合基板(23),底板(24),电极环(21)和盖(25)而形成的处理电池(2) 26),同时使小物体(100)与电极环(21)接触并使电镀液(4)从处理电池(2)的内部循环到处理电池(2)的内部,从而使处理电池(2)内的电镀液通电, 通过利用垂直旋转轴(3)旋转处理电池(2),通过流出装置的外部,从而电镀小物体(100)。 所述装置(1)的特征在于,所述流出装置是通过夹着所述薄片构件(61)而形成在相邻薄片构件(61)之间的间隙通道,所述薄板构件(61)的尺寸小于每个小物体(100 ),以适当的间隔周向地位于底板(24)和电极环(21)之间。
    • 2. 发明授权
    • Surface treatment apparatus for small object
    • 小物体表面处理装置
    • US07837840B2
    • 2010-11-23
    • US11808744
    • 2007-06-12
    • Yutaka SugiuraTomoji OkudaHideki Nakada
    • Yutaka SugiuraTomoji OkudaHideki Nakada
    • C25D17/00
    • C25D17/22C25D21/10
    • A plating process apparatus (1) for small objects, including a treatment cell (2) formed by combining a base plate (23), a bottom plate (24), an electrode ring (21) and a cover (25) using bolts (26), energizes a plating solution within the treatment cell (2) while bringing the small objects (100) into contact with the electrode ring (21) and circulating the plating solution (4) from the inside of the treatment cell (2) to the outside thereof through a flow-out means by rotating the treatment cell (2) with a vertical rotation shaft (3), thereby plating the small objects (100). The apparatus (1) is characterized in that the flow-out means is a gap channel formed between adjacent sheet members (61) by sandwiching the sheet members (61), each having a dimension smaller than a minimum dimension of each small object (100), between the bottom plate (24) and the electrode ring (21) circumferentially at appropriate intervals.
    • 一种用于小物体的电镀处理装置(1),包括通过使用螺栓(...)组合基板(23),底板(24),电极环(21)和盖(25)而形成的处理电池(2) 26),同时使小物体(100)与电极环(21)接触并使电镀液(4)从处理电池(2)的内部循环到处理电池(2)的内部,从而使处理电池(2)内的电镀液通电, 通过利用垂直旋转轴(3)旋转处理电池(2),通过流出装置的外部,从而电镀小物体(100)。 所述装置(1)的特征在于,所述流出装置是通过夹着所述薄片构件(61)而形成在相邻薄片构件(61)之间的间隙通道,所述薄板构件(61)的尺寸小于每个小物体(100 ),以适当的间隔周向地位于底板(24)和电极环(21)之间。