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    • 2. 发明授权
    • Composite semiconductor device
    • 复合半导体器件
    • US4710794A
    • 1987-12-01
    • US828536
    • 1986-02-12
    • Yutaka KoshinoTatsuo AkiyamaYoshiro Baba
    • Yutaka KoshinoTatsuo AkiyamaYoshiro Baba
    • H01L29/06H01L21/18H01L21/762H01L21/764H01L21/8222H01L21/8249H01L27/07H01L27/082H01L27/12H01L25/04
    • H01L21/8249H01L21/187H01L21/76264H01L21/76297H01L21/764H01L21/8222H01L27/0716H01L27/0825H01L21/76286H01L21/76289
    • Disclosed is a composite semiconductor device, comprising a composite substrate consisting of first and second semiconductor substrates, one surface of each of which is mirror-polished, so that the mirror-polished surfaces are bonded together. The first semiconductor substrate has a space adjacent to the bonding interface, and an annular groove which communicates with the space from a surface of the first semiconductor substrate opposite the bonding interface, the annular groove being formed in a portion of the first semiconductor substrate corresponding to a peripheral edge portion of the space thereof, at least one pillar projecting through the space to the bonding interface from a surface, which is exposed to the space, of a first portion of the first semiconductor substrate which is defined by the space and the annular groove, a first insulating layer, formed in the annular groove, for electrically isolating the first portion from a second portion of the first semiconductor substrate adjacent thereto, a second insulating layer, formed on the pillar or a bonding interface between the pillar and the second semiconductor substrate, for electrically isolating the first portion from the second semiconductor substrate, a first functional element formed in the first portion, and a second functional element formed in the second portion.
    • 公开了一种复合半导体器件,其包括由第一和第二半导体衬底组成的复合衬底,每个半导体衬底的一个表面被镜面抛光,使得镜面抛光表面被接合在一起。 所述第一半导体衬底具有与所述接合界面相邻的空间,以及与所述第一半导体衬底的与所述接合界面相对的表面与所述空间连通的环形槽,所述环形槽形成在所述第一半导体衬底的对应于 其空间的外围边缘部分,至少一个从所述空间向所述接合界面突出的第一半导体衬底的第一部分暴露于所述空间的表面的至少一个柱,所述第一部分由所述空间和环形 槽,形成在环形槽中的第一绝缘层,用于将第一部分与与其相邻的第一半导体衬底的第二部分电隔离;形成在柱上的第二绝缘层或柱与第二绝缘层之间的接合界面 半导体衬底,用于将第一部分与第二半导体衬底电隔离,第一 形成在第一部分中的功能元件和形成在第二部分中的第二功能元件。
    • 5. 发明授权
    • Process for manufacturing a Schottky FET device using metal sidewalls as
gates
    • 使用金属侧壁作为栅极制造肖特基FET器件的工艺
    • US4729966A
    • 1988-03-08
    • US843833
    • 1986-03-26
    • Yutaka KoshinoTatsuo AkiyamaShunichi Hiraki
    • Yutaka KoshinoTatsuo AkiyamaShunichi Hiraki
    • H01L29/812H01L21/28H01L21/285H01L21/338H01L29/417H01L21/225H01L29/72H01L29/80
    • H01L29/66878H01L21/2815H01L21/28587
    • A first insulative film is formed with predetermined height and thickness in a loop shape on the surface of the Schottky-junction semiconductor substrate. A gate electrode metal film is formed with a predetermined height and thickness in a loop shape on the surface of the substrate along the inner surface of the first insulative film. A second insulative film is formed with a predetermined height and thickness in a loop shape on the surface of the substrate along the inner surface of the metal film. A channel consisting of a low concentration impurity layer, is formed in a loop shape inside the substrate directly under the metal film and the first and second insulative films. The source region consists of a high-concentration impurity layer formed such that it surrounds the channel positioned inside the substrate on the outside of the first insulative film. The drain region consists of a high-concentration impurity layer, which is formed such that it is surrounded by the channel positioned inside the substrate on the inside of the second insulative film.
    • 第一绝缘膜在肖特基结半导体衬底的表面上以环形形成预定的高度和厚度。 栅极电极金属膜沿着第一绝缘膜的内表面在基板的表面上以环形形成预定的高度和厚度。 第二绝缘膜沿着金属膜的内表面在基板的表面上以环形形成预定的高度和厚度。 由低浓度杂质层构成的通道在金属膜正下方的基板内部以及第一绝缘膜和第二绝缘膜之间形成为环状。 源极区域由高浓度杂质层构成,其形成为使得其围绕位于第一绝缘膜外侧的衬底内的沟道。 漏极区域由高浓度杂质层构成,其形成为被位于第二绝缘膜内侧的位于基板内部的沟道包围。
    • 8. 发明授权
    • Polishing method and apparatus for detecting a polishing end point of a
semiconductor wafer
    • 用于检测半导体晶片的抛光终点的抛光方法和装置
    • US5643046A
    • 1997-07-01
    • US390529
    • 1995-02-17
    • Ichiro KatakabeNaoto MiyashitaTatsuo Akiyama
    • Ichiro KatakabeNaoto MiyashitaTatsuo Akiyama
    • B24B37/013B24B49/04H01L21/304B24B7/22B24B49/12
    • B24B37/013B24B49/04
    • A polishing method and apparatus are provided for detecting the polishing end point of a semi-conductor wafer having a polishing film and a stopper film formed thereon. First driving means are provided having a first drive shaft for rotating a polishing plate and a polishing cloth thereon. Second driving means having a second rotatable drive shaft are also provided. Mounting means for mounting the semi-conductor wafer is adapted to be rotated by the second driving means for polishing the wafer. Energy supplying means for supplying prescribed energy to the semi-conductor wafer are also included. Finally, detecting means for detecting a polishing end point of the polishing film is included and detects a variation of the energy supplied to the semi-conductor wafer. Different types of energy can be utilized such as infrared light and a vibration wave.
    • 提供了一种抛光方法和装置,用于检测在其上形成有抛光膜和阻挡膜的半导体晶片的研磨终点。 第一驱动装置设置有用于使研磨板和抛光布旋转的第一驱动轴。 还提供具有第二可旋转驱动轴的第二驱动装置。 用于安装半导体晶片的安装装置适于通过用于抛光晶片的第二驱动装置旋转。 还包括用于向半导体晶片提供规定能量的能量供给装置。 最后,包括用于检测抛光膜的抛光终点的检测装置,并且检测提供给半导体晶片的能量的变化。 可以使用不同类型的能量,例如红外光和振动波。