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    • 4. 发明授权
    • Photoelectric conversion device and manufacturing method thereof
    • 光电转换装置及其制造方法
    • US08546902B2
    • 2013-10-01
    • US12779471
    • 2010-05-13
    • Seiichi TamuraHiroshi YuzuriharaTakeshi IchikawaRyuichi Mishima
    • Seiichi TamuraHiroshi YuzuriharaTakeshi IchikawaRyuichi Mishima
    • H01L27/146
    • H01L27/14601H01L27/14609H04N5/335
    • The present invention, in a photoelectric conversion device in which a pixel including a photoelectric conversion device for converting a light into a signal charge and a peripheral circuit including a circuit for processing the signal charge outside a pixel region in which the pixel are disposed on the same substrate, comprising: a first semiconductor region of a first conductivity type for forming the photoelectric region, the first semiconductor region being formed in a second semiconductor region of a second conductivity type; and a third semiconductor region of the first conductivity type and a fourth semiconductor region of the second conductivity type for forming the peripheral circuit, the third and fourth semiconductor regions being formed in the second semiconductor region; wherein in that the impurity concentration of the first semiconductor region is higher than the impurity concentration of the third semiconductor region.
    • 本发明涉及一种光电转换装置,其中包括用于将光转换为信号电荷的光电转换装置的像素和包括用于处理信号电荷的电路的外围电路的像素, 相同的衬底,包括:用于形成光电区域的第一导电类型的第一半导体区域,第一半导体区域形成在第二导电类型的第二半导体区域中; 以及第一导电类型的第三半导体区域和用于形成外围电路的第二导电类型的第四半导体区域,第三和第四半导体区域形成在第二半导体区域中; 其中,所述第一半导体区域的杂质浓度高于所述第三半导体区域的杂质浓度。
    • 5. 发明授权
    • Image sensing device and image sensing system
    • 影像感测装置及影像感应系统
    • US08184189B2
    • 2012-05-22
    • US12623747
    • 2009-11-23
    • Seiichi Tamura
    • Seiichi Tamura
    • H04N3/14H04N5/335
    • H04N5/335H01L27/14623H04N5/361
    • The image sensing device includes a semiconductor substrate; a light shielding layer that is arranged above the semiconductor substrate and shields an optical black region and a peripheral region from light; a first capacitance element that is arranged between the light shielding layer in the peripheral region and the semiconductor substrate and is used to temporarily hold signals output from effective pixels or optical black pixels; and a second capacitance element that is arranged between the light shielding layer in the optical black region and the semiconductor substrate so as to shield the photoelectric conversion units of the optical black pixels from light.
    • 图像感测装置包括半导体衬底; 遮光层,其设置在所述半导体基板的上方,并遮蔽光的黑色区域和周边区域。 布置在外围区域的遮光层和半导体衬底之间的第一电容元件,用于临时保持从有效像素或光学黑色像素输出的信号; 以及布置在所述光学黑色区域中的所述遮光层和所述半导体衬底之间以遮蔽所述光学黑色像素的光电转换单元的光的第二电容元件。
    • 6. 发明申请
    • METHOD AND LINE FOR MANUFACTURING SEMICONDUCTOR DEVICE
    • 用于制造半导体器件的方法和线路
    • US20090130782A1
    • 2009-05-21
    • US12266725
    • 2008-11-07
    • Masatsugu ItahashiKouhei HashimotoNobuhiko SatoSeiichi TamuraHiroshi Yuzurihara
    • Masatsugu ItahashiKouhei HashimotoNobuhiko SatoSeiichi TamuraHiroshi Yuzurihara
    • H01L21/66H01L21/67
    • H01L22/12H01L22/20H01L2924/0002H01L2924/00
    • A method is provided for manufacturing a semiconductor device that includes a multilayer wiring structure in which insulating layers and wiring layers each with a plurality of conductor lines are alternately stacked on each other. The method includes steps of forming a first wiring layer on a first insulating layer, detecting a defect in the first wiring layer on the first insulating layer, and determining whether or not the defect is to be irradiated with a focused ion beam, according to a detection result. If it is determined that the defect is to be irradiated, the defect is irradiated with a focused ion beam and then a second insulating layer is formed on the first wiring layer disposed on the first insulating layer. If it is determined that the defect is not to be irradiated with a focused ion beam, the second insulating layer is formed on the first wiring layer disposed on the first insulating layer without irradiating the defect.
    • 提供一种用于制造半导体器件的方法,该半导体器件包括多层布线结构,其中每个具有多条导体线的绝缘层和布线层彼此交替堆叠。 该方法包括以下步骤:在第一绝缘层上形成第一布线层,检测第一绝缘层上的第一布线层中的缺陷,以及确定是否要用聚焦离子束照射缺陷,根据 检测结果。 如果确定要照射缺陷,则用聚焦离子束照射缺陷,然后在布置在第一绝缘层上的第一布线层上形成第二绝缘层。 如果确定不用聚焦离子束照射缺陷,则在不照射缺陷的情况下,在布置在第一绝缘层上的第一布线层上形成第二绝缘层。
    • 10. 发明授权
    • Photoelectric conversion device manufacturing method, semiconductor device manufacturing method, photoelectric conversion device, and image sensing system
    • 光电转换器件制造方法,半导体器件制造方法,光电转换器件和图像感测系统
    • US07592579B2
    • 2009-09-22
    • US12341385
    • 2008-12-22
    • Seiichi TamuraTetsuya Itano
    • Seiichi TamuraTetsuya Itano
    • H01L27/00
    • H01L27/1463H01L27/14603H01L27/14689
    • A photoelectric conversion device manufacturing method comprises: a first implantation step of implanting impurity ions of a first conductivity type into an underlying substrate via a region of the oxide film exposed by an opening, thereby forming a first semiconductor region having a first thickness in the element region; an the oxidation step of oxidizing the region of the oxide film exposed by the opening, thereby thickening the exposed region; an the exposure step of exposing a region of the oxide film which is not exposed by the opening; a the second implantation step of, after the exposure step, implanting the impurity ions of the first conductivity type into the underlying substrate via a region unthickened in the oxidation step, thereby forming a second semiconductor region having a second thickness larger than the first thickness in the element isolation region; and an the element formation step.
    • 一种光电转换装置的制造方法,包括:第一注入工序,通过由开口露出的氧化膜的区域,将第一导电型杂质离子注入到下层基板中,由此在元件中形成具有第一厚度的第一半导体区域 地区; 氧化步骤,氧化由开口暴露的氧化膜的区域,从而使曝光区域变厚; 曝光步骤,曝光所述氧化膜的未被所述开口暴露的区域; 第二注入步骤,在曝光步骤之后,通过在氧化步骤中未被凸起的区域将第一导电类型的杂质离子注入到下面的衬底中,从而形成具有大于第一厚度的第二厚度的第二半导体区域 元件隔离区; 和元件形成步骤。