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1. 发明授权

US08144337B2 Inspecting method and inspecting apparatus for substrate surface 有权
标题翻译：基板表面检查方法及检查装置
公开(公告)号：US08144337B2
公开(公告)日：2012-03-27
申请号：US12470505
申请日：2009-05-22
申请人： Akira Hamamatsu , Yoshimasa Oshima , Shunji Maeda , Hisae Shibuya , Yuta Urano , Toshiyuki Nakao , Shigenobu Maruyama
发明人： Akira Hamamatsu , Yoshimasa Oshima , Shunji Maeda , Hisae Shibuya , Yuta Urano , Toshiyuki Nakao , Shigenobu Maruyama
IPC分类号： G01B11/30
CPC分类号： G01B11/303 , G01N21/47 , G01N21/94 , G01N21/9501
摘要： To inspect a substrate such as a semiconductor substrate for surface roughness at high precision.The surface roughness of the substrate is measured in each frequency band of the surface roughness by applying a light to the substrate surface and detecting a scattered light or reflected light at a plurality of azimuth or elevation angles.
摘要翻译：以高精度检查用于表面粗糙度的半导体基板等基板。通过向基板表面施加光并以多个方位角或仰角检测散射光或反射光，测量表面粗糙度的每个频带中的基板的表面粗糙度。

2. 发明授权

US08477302B2 Defect inspection apparatus 有权
标题翻译：缺陷检查装置
公开(公告)号：US08477302B2
公开(公告)日：2013-07-02
申请号：US12412776
申请日：2009-03-27
申请人： Yuta Urano , Toshiyuki Nakao , Yoshimasa Oshima , Akira Hamamatsu
发明人： Yuta Urano , Toshiyuki Nakao , Yoshimasa Oshima , Akira Hamamatsu
IPC分类号： G01N21/00
CPC分类号： G01N21/9501 , G01N21/9505 , G01N2021/8854 , G01N2021/8874 , G01N2201/103 , G01N2201/1045
摘要： A defect inspection apparatus for inspecting a surface of a sample includes a stage for holding the sample, an illumination optical system that irradiates a laser beam to form a linear illuminated area on the surface of the sample, a detection optical system, and a signal processing system. The detection optical system includes a detector device having a plurality of pixels for detecting light scattered from the linear illuminated area of the surface of the sample, and that outputs in parallel a plurality of detection signals having mutually different sensitivities acquired from the plurality of pixels of the detector device. The signal processing system selects an unsaturated detection signal from the plurality of detection signals and detects a defect in accordance with the selected detection signal.
摘要翻译：用于检查样品表面的缺陷检查装置包括用于保持样品的载物台，照射光学系统，其照射激光束以在样品的表面上形成线性照射区域，检测光学系统和信号处理系统。检测光学系统包括具有多个像素的检测器装置，用于检测从样品表面的线性照射区域散射的光，并且并行地输出具有从多个像素获得的具有相互不同的灵敏度的多个检测信号检测器装置。信号处理系统从多个检测信号中选择不饱和检测信号，并根据所选择的检测信号检测缺陷。

3. 发明授权

US08310665B2 Inspecting method and inspecting apparatus for substrate surface 有权
标题翻译：基板表面检查方法及检查装置
公开(公告)号：US08310665B2
公开(公告)日：2012-11-13
申请号：US13404749
申请日：2012-02-24
申请人： Akira Hamamatsu , Yoshimasa Oshima , Shunji Maeda , Hisae Shibuya , Yuta Urano , Toshiyuki Nakao , Shigenobu Maruyama
发明人： Akira Hamamatsu , Yoshimasa Oshima , Shunji Maeda , Hisae Shibuya , Yuta Urano , Toshiyuki Nakao , Shigenobu Maruyama
IPC分类号： G01N21/00
CPC分类号： G01B11/303 , G01N21/47 , G01N21/94 , G01N21/9501
摘要： An inspecting method and apparatus for inspecting a substrate surface includes application of a light to the substrate surface, detection of scattered light or reflected light from the substrate surface due to the applied light at a plurality of positions to obtain a plurality of electrical signals, extraction of a signal in a mutually different frequency band from each of the plurality of electrical signals, and calculation of a value regarding a state of film of the substrate through an arithmetical operation process of a plurality of extracted signals in the frequency bands.
摘要翻译：用于检查基板表面的检查方法和装置包括：由于在多个位置处施加的光，向基板表面施加光，检测散射光或来自基板表面的反射光，以获得多个电信号，提取在与所述多个电信号中的每一个相互不同的频带中的信号的信号，以及通过所述频带中的多个提取的信号的算术运算处理来计算关于所述衬底的膜的状态的值。

4. 发明申请

US20090279081A1 DEFECT INSPECTION APPARATUS 有权
标题翻译：缺陷检查装置
公开(公告)号：US20090279081A1
公开(公告)日：2009-11-12
申请号：US12412776
申请日：2009-03-27
申请人： Yuta Urano , Toshiyuki Nakao , Yoshimasa Oshima , Akira Hamamatsu
发明人： Yuta Urano , Toshiyuki Nakao , Yoshimasa Oshima , Akira Hamamatsu
IPC分类号： G01N21/896
CPC分类号： G01N21/9501 , G01N21/9505 , G01N2021/8854 , G01N2021/8874 , G01N2201/103 , G01N2201/1045
摘要： A defect inspection apparatus for inspecting a surface of a sample includes a stage for holding the sample, an illumination optical system that irradiates a laser beam to form a linear illuminated area on the surface of the sample, a detection optical system, and a signal processing system. The detection optical system includes a detector device having a plurality of pixels for detecting light scattered from the linear illuminated area of the surface of the sample, and that outputs in parallel a plurality of detection signals having mutually different sensitivities acquired from the plurality of pixels of the detector device. The signal processing system selects an unsaturated detection signal from the plurality of detection signals and detects a defect in accordance with the selected detection signal.
摘要翻译：用于检查样品表面的缺陷检查装置包括用于保持样品的载物台，照射光学系统，其照射激光束以在样品的表面上形成线性照射区域，检测光学系统和信号处理系统。检测光学系统包括具有多个像素的检测器装置，用于检测从样品表面的线性照射区域散射的光，并且并行地输出具有从多个像素获得的具有相互不同的灵敏度的多个检测信号检测器装置。信号处理系统从多个检测信号中选择不饱和检测信号，并根据所选择的检测信号检测缺陷。

5. 发明申请

US20130107247A1 Inspecting Method and Inspecting Apparatus For Substrate Surface 有权
标题翻译：基板表面检查方法及检查装置
公开(公告)号：US20130107247A1
公开(公告)日：2013-05-02
申请号：US13672742
申请日：2012-11-09
申请人： Akira Hamamatsu , Yoshimasa Oshima , Shunji Maeda , Hisae Shibuya , Yuta Urano , Toshiyuki Nakao , Shigenobu Maruyama
发明人： Akira Hamamatsu , Yoshimasa Oshima , Shunji Maeda , Hisae Shibuya , Yuta Urano , Toshiyuki Nakao , Shigenobu Maruyama
IPC分类号： G01B11/30
CPC分类号： G01B11/303 , G01N21/47 , G01N21/94 , G01N21/9501
摘要： An inspecting method and apparatus for inspecting a substrate surface includes illuminating a light to the substrate surface having a film, detection of a scattered light or reflected light from a plurality of positions of the substrate surface to obtain a plurality of electrical signals, comparison of the plurality of electrical signals and a database which indicates a relationship between the electrical signals and surface roughness, and calculation of a surface roughness value based on the result of comparison.
摘要翻译：用于检查基板表面的检查方法和装置包括将光照射到具有膜的基板表面，从基板表面的多个位置检测散射光或反射光以获得多个电信号，多个电信号和指示电信号和表面粗糙度之间的关系的数据库，以及基于比较结果的表面粗糙度值的计算。

6. 发明申请

US20120162665A1 Inspecting Method and Inspecting Apparatus for Substrate Surface 有权
标题翻译：基板表面检查方法及检查装置
公开(公告)号：US20120162665A1
公开(公告)日：2012-06-28
申请号：US13404749
申请日：2012-02-24
申请人： Akira Hamamatsu , Yoshimasa Oshima , Shunji Maeda , Hisae Shibuya , Yuta Urano , Toshiyuki Nakao , Shigenobu Maruyama
发明人： Akira Hamamatsu , Yoshimasa Oshima , Shunji Maeda , Hisae Shibuya , Yuta Urano , Toshiyuki Nakao , Shigenobu Maruyama
IPC分类号： G01B11/30
CPC分类号： G01B11/303 , G01N21/47 , G01N21/94 , G01N21/9501
摘要： An inspecting method and apparatus for inspecting a substrate surface includes application of a light to the substrate surface, detection of scattered light or reflected light from the substrate surface due to the applied light at a plurality of positions to obtain a plurality of electrical signals, extraction of a signal in a mutually different frequency band from each of the plurality of electrical signals, and calculation of a value regarding a state of film of the substrate through an arithmetical operation process of a plurality of extracted signals in the frequency bands.
摘要翻译：用于检查基板表面的检查方法和装置包括：由于在多个位置处施加的光，向基板表面施加光，检测散射光或来自基板表面的反射光，以获得多个电信号，提取在与所述多个电信号中的每一个相互不同的频带中的信号的信号，以及通过所述频带中的多个提取的信号的算术运算处理来计算关于所述衬底的膜的状态的值。

7. 发明授权

US08654350B2 Inspecting method and inspecting apparatus for substrate surface 有权
标题翻译：基板表面检查方法及检查装置
公开(公告)号：US08654350B2
公开(公告)日：2014-02-18
申请号：US13672742
申请日：2012-11-09
申请人： Akira Hamamatsu , Yoshimasa Oshima , Shunji Maeda , Hisae Shibuya , Yuta Urano , Toshiyuki Nakao , Shigenobu Maruyama
发明人： Akira Hamamatsu , Yoshimasa Oshima , Shunji Maeda , Hisae Shibuya , Yuta Urano , Toshiyuki Nakao , Shigenobu Maruyama
IPC分类号： G01B11/30
CPC分类号： G01B11/303 , G01N21/47 , G01N21/94 , G01N21/9501
摘要： An inspecting method and apparatus for inspecting a substrate surface includes illuminating a light to the substrate surface having a film, detection of a scattered light or reflected light from a plurality of positions of the substrate surface to obtain a plurality of electrical signals, comparison of the plurality of electrical signals and a database which indicates a relationship between the electrical signals and surface roughness, and calculation of a surface roughness value based on the result of comparison.
摘要翻译：用于检查基板表面的检查方法和装置包括将光照射到具有膜的基板表面，从基板表面的多个位置检测散射光或反射光以获得多个电信号，多个电信号和指示电信号和表面粗糙度之间的关系的数据库，以及基于比较结果的表面粗糙度值的计算。

8. 发明申请

US20120320373A1 Inspection Apparatus 有权
标题翻译：检验仪器
公开(公告)号：US20120320373A1
公开(公告)日：2012-12-20
申请号：US13597553
申请日：2012-08-29
申请人： Yoshimasa Oshima , Yuta Urano , Toshiyuki Nakao
发明人： Yoshimasa Oshima , Yuta Urano , Toshiyuki Nakao
IPC分类号： G01N21/88
CPC分类号： G01N21/9501 , G01N21/21 , G01N21/47 , G01N21/94 , G01N2021/4707 , G01N2021/4709 , G01N2021/8864
摘要： An inspection method and apparatus for detecting defects or haze of a sample, includes illuminating light to the sample from an oblique direction relative to a surface of the sample with an illuminator, detecting first scattered light at a forward position relative to an illuminating direction from the sample with a first detector, detecting sec and scattered light at a sideward or backward position relative to the illuminating direction from the sample with a second detection, and processing a first signal of the first scattered light and a second signal of the second scattered light with different weighting for the first signal and for the second signal with a processor.
摘要翻译：一种用于检测样品的缺陷或雾度的检查方法和装置，包括使用照明器从相对于样品表面的倾斜方向向样品照射光，从相对于照射方向的前方位置检测第一散射光，采用第一检测器，利用第二检测从样品检测相对于照明方向的向后或向后位置处的秒和散射光，并且处理第一散射光的第一信号和第二散射光的第二信号，对于第一信号和与处理器的第二信号的加权不同。

9. 发明申请

US20110080578A1 Method and Its Apparatus For Inspecting Defects 有权
标题翻译：检测缺陷的方法及其设备
公开(公告)号：US20110080578A1
公开(公告)日：2011-04-07
申请号：US12964249
申请日：2010-12-09
申请人： Yuta Urano , Toshiyuki Nakao , Yoshimasa Oshima
发明人： Yuta Urano , Toshiyuki Nakao , Yoshimasa Oshima
IPC分类号： G01N21/88
CPC分类号： G01N21/9501 , G01N21/9503
摘要： A defect inspection apparatus is capable of inspecting an extremely small defect present on the top and edge surfaces of a sample such as a semiconductor substrate or a thin film substrate with high sensitivity and at high speed. The defect inspection apparatus has an illumination optical system, a plurality of detection optical units and a signal processor. One or more of the detection optical units receives either light diffracted from an edge portion of the sample or light diffracted from an edge grip holding the sample. The one or more of the detection optical units shields the diffracted light received by the detection optical unit based on a signal obtained by monitoring an intensity of the diffracted light received by the detection optical unit in order to inspect a sample portion located near the edge portion and a sample portion located near the edge grip.
摘要翻译：缺陷检查装置能够以高灵敏度和高速检查诸如半导体衬底或薄膜衬底的样品的顶部和边缘表面上存在的极小缺陷。缺陷检查装置具有照明光学系统，多个检测光学单元和信号处理器。一个或多个检测光学单元接收从样品的边缘部分衍射的光或从夹持样品的边缘把手衍射的光。一个或多个检测光学单元基于通过监视由检测光学单元接收的衍射光的强度而获得的信号来屏蔽由检测光学单元接收的衍射光，以便检查位于边缘部分附近的样本部分以及位于边缘把手附近的样品部分。

10. 发明授权

US07869024B2 Method and its apparatus for inspecting defects 有权
公开(公告)号：US07869024B2
公开(公告)日：2011-01-11
申请号：US12414727
申请日：2009-03-31
申请人： Yuta Urano , Toshiyuki Nakao , Yoshimasa Oshima
发明人： Yuta Urano , Toshiyuki Nakao , Yoshimasa Oshima
IPC分类号： G01N21/00 , G01J4/00
CPC分类号： G01N21/9501 , G01N21/9503
摘要： A defect inspection apparatus is capable of inspecting an extremely small defect present on the top and edge surfaces of a sample such as a semiconductor substrate or a thin film substrate with high sensitivity and at high speed. The defect inspection apparatus has an illumination optical system, a plurality of detection optical units and a signal processor. One or more of the detection optical units receives either light diffracted from an edge portion of the sample or light diffracted from an edge grip holding the sample. The one or more of the detection optical units shields the diffracted light received by the detection optical unit based on a signal obtained by monitoring an intensity of the diffracted light received by the detection optical unit in order to inspect a sample portion located near the edge portion and a sample portion located near the edge grip.

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